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Ray Publish 0.1.0 ea59505 16d ago

AOD403-HXY

HXY MOSFET · MOSFETs · TO-252-2L

AOD403-HXY from HXY MOSFET, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; controls the P-channel MOSFET, with VGS rated ±20 V, threshold -1.2 V to -2.5 V at ID=-250uA, and operation with gate voltages as low as 4.5 V.
2 D passive Drain, connected to the exposed tab (the middle lead is trimmed in the 2L package); VDS = -30 V, continuous ID -70 A at TC=25℃ (package limited), pulsed IDM -200 A.
3 S passive Source; continuous source current IS is -70 A, and the body diode forward voltage VSD is -1.2 V max at IS=-1A.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package TO-252-2L
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS -30 V VGS=0V, ID=-250uA 2
Static Drain-Source On-Resistance RDS(ON) 7 10 mΩ VGS=-10V, ID=-20A 2
Static Drain-Source On-Resistance RDS(ON) 11 18 mΩ VGS=-4.5V, ID=-15A 2
Gate Threshold Voltage VGS(th) -1.2 -2.5 V VGS=VDS, ID=-250uA 2
Drain-Source Leakage Current IDSS -1 uA VDS=-24V, VGS=0V, TJ=25℃ 2
Drain-Source Leakage Current IDSS -5 uA VDS=-24V, VGS=0V, TJ=55℃ 2
Gate-Source Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 2
Continuous Source Current IS -70 A VG=VD=0V, Force Current 2
Diode Forward Voltage VSD -1.2 V VGS=0V, IS=-1A, TJ=25℃ 2
Drain-Source Voltage VDS -30 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID@TC=25℃ -70 A VGS @ -10V (Notes 1,6) 1
Continuous Drain Current ID@TC=100℃ -50 A VGS @ -10V (Notes 1,6) 1
Pulsed Drain Current IDM -200 A Note 2 1
Single Pulse Avalanche Energy EAS 80 mJ VDD=-50V,VGS=-10V,L=0.1mH,IAS=-40A (Note 3) 1
Avalanche Current IAS -40 A 1
Total Power Dissipation PD@TC=25℃ 90 W TC=25℃ (Note 4) 1
Storage Temperature Range TSTG -55 175 ℃ 1
Operating Junction Temperature Range TJ -55 175 ℃ 1
Thermal Resistance Junction-ambient RθJA 20 ℃/W t≦10S (surface mounted on 1 inch² FR-4 board, 2OZ copper, Note 1) 1
Thermal Resistance Junction-ambient RθJA 50 ℃/W Steady State (Note 1) 1
Thermal Resistance Junction-case RθJC 1.6 ℃/W Note 1 1

CAD (KiCad official)

  • Symbol: AOD403-HXY
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2L (KiCad packages3D, STEP)
  • 3D model files: aod403-hxy-etched.step / aod403-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); aod403-hxy.step / aod403-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (6 pp, sha256 d0aec488c71cde79, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF