component
AO4606-VB
Public Made by Adomby adom
VBsemi Elec MOSFETs, SO-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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| docs | 16d ago |
| viewers | 16d ago |
| ao4606-vb-etched.glb | 16d ago |
| ao4606-vb-etched.step | 16d ago |
| ao4606-vb-hero.glb | 16d ago |
| ao4606-vb-hero.overlay.json | 16d ago |
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| README.md | 16d ago |
AO4606-VB
VBsemi Elec · MOSFETs · SO-8
AO4606-VB from VBsemi Elec, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | N-channel MOSFET source terminal; the N-channel device is rated VDS 30 V with VGS ±20 V. |
| 2 | G1 | input | N-channel MOSFET gate terminal; VGS is limited to ±20 V. |
| 3 | S2 | passive | P-channel MOSFET source terminal; the P-channel device is rated VDS -30 V with VGS ±20 V. |
| 4 | G2 | input | P-channel MOSFET gate terminal; VGS is limited to ±20 V. |
| 5 | D2 | passive | P-channel MOSFET drain terminal, rated for -30 V drain-source voltage (pins 5 and 6 are tied together as D2). |
| 6 | D2 | passive | P-channel MOSFET drain terminal, rated for -30 V drain-source voltage (pins 5 and 6 are tied together as D2). |
| 7 | D1 | passive | N-channel MOSFET drain terminal, rated for 30 V drain-source voltage (pins 7 and 8 are tied together as D1). |
| 8 | D1 | passive | N-channel MOSFET drain terminal, rated for 30 V drain-source voltage (pins 7 and 8 are tied together as D1). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | SO-8 |
| Category | Transistors/Thyristors |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| N-Ch Drain-Source Voltage | VDS | 30 | V | 1 | |||
| P-Ch Drain-Source Voltage | VDS | -30 | V | 1 | |||
| N-Ch Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| P-Ch Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| N-Ch Continuous Drain Current | ID | 8 | A | TC = 25 °C (TJ = 150 °C) | 1 | ||
| P-Ch Continuous Drain Current | ID | -8 | A | TC = 25 °C (TJ = 150 °C) | 1 | ||
| N-Ch Continuous Drain Current | ID | 6.8 | A | TC = 70 °C | 1 | ||
| P-Ch Continuous Drain Current | ID | -6.8 | A | TC = 70 °C | 1 | ||
| P-Ch Continuous Drain Current | ID | -6.6 | A | TA = 25 °C | 1 | ||
| N-Ch Continuous Drain Current | ID | 5.4 | A | TA = 70 °C | 1 | ||
| P-Ch Continuous Drain Current | ID | -5.3 | A | TA = 70 °C | 1 | ||
| N-Ch Pulsed Drain Current | IDM | 40 | A | 10 µs pulse width | 1 | ||
| P-Ch Pulsed Drain Current | IDM | -40 | A | 10 µs pulse width | 1 | ||
| N-Ch Source-Drain Diode Current | IS | 2.6 | A | TC = 25 °C | 1 | ||
| P-Ch Source-Drain Diode Current | IS | -2.6 | A | TC = 25 °C | 1 | ||
| N-Ch Source-Drain Diode Current | IS | 1.6 | A | TA = 25 °C | 1 | ||
| P-Ch Source-Drain Diode Current | IS | -1.6 | A | TA = 25 °C | 1 | ||
| N-Ch Pulsed Source-Drain Current | ISM | 40 | A | 1 | |||
| P-Ch Pulsed Source-Drain Current | ISM | -40 | A | 1 | |||
| N-Ch Single Pulse Avalanche Current | IAS | 10 | A | L = 0.1 mH | 1 | ||
| P-Ch Single Pulse Avalanche Current | IAS | -20 | A | L = 0.1 mH | 1 | ||
| N-Ch Single Pulse Avalanche Energy | EAS | 5 | mJ | 1 | |||
| P-Ch Single Pulse Avalanche Energy | EAS | 20 | mJ | 1 | |||
| N-Ch Maximum Power Dissipation | PD | 3.1 | W | TC = 25 °C | 1 | ||
| P-Ch Maximum Power Dissipation | PD | 3.2 | W | TC = 25 °C | 1 | ||
| N-Ch Maximum Power Dissipation | PD | 2 | W | TC = 70 °C | 1 | ||
| P-Ch Maximum Power Dissipation | PD | 2.1 | W | TC = 70 °C | 1 | ||
| P-Ch Maximum Power Dissipation | PD | 2 | W | TA = 25 °C | 1 | ||
| N-Ch Maximum Power Dissipation | PD | 1.28 | W | TA = 70 °C | 1 | ||
| P-Ch Maximum Power Dissipation | PD | 1.28 | W | TA = 70 °C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| N-Ch Maximum Junction-to-Ambient | RthJA | 50 | 62.5 | °C/W | t ≤ 10 s | 1 | |
| P-Ch Maximum Junction-to-Ambient | RthJA | 47 | 62.5 | °C/W | t ≤ 10 s | 1 | |
| N-Ch Maximum Junction-to-Ambient (steady state) | RthJA | 120 | °C/W | Steady state (footnote d) | 1 | ||
| P-Ch Maximum Junction-to-Ambient (steady state) | RthJA | 110 | °C/W | Steady state (footnote d) | 1 | ||
| N-Ch Maximum Junction-to-Foot (Drain) | RthJF | 30 | 40 | °C/W | Steady state | 1 | |
| P-Ch Maximum Junction-to-Foot (Drain) | RthJF | 29 | 38 | °C/W | Steady state | 1 | |
| N-Ch Drain-Source Breakdown Voltage | VDS | 30 | V | VGS = 0 V, ID = 250 µA | 2 | ||
| P-Ch Drain-Source Breakdown Voltage | VDS | -30 | V | VGS = 0 V, ID = -250 µA | 2 | ||
| N-Ch Gate Threshold Voltage | VGS(th) | 1 | 2 | V | VDS = VGS, ID = 250 µA | 2 | |
| P-Ch Gate Threshold Voltage | VGS(th) | -1 | -2 | V | VDS = VGS, ID = -250 µA | 2 | |
| N-Ch Gate-Body Leakage | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ±12 V | 2 | |
| P-Ch Gate-Body Leakage | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ±12 V | 2 | |
| N-Ch Zero Gate Voltage Drain Current | IDSS | 1 | µA | VDS = 30 V, VGS = 0 V | 2 | ||
| P-Ch Zero Gate Voltage Drain Current | IDSS | -1 | µA | VDS = -30 V, VGS = 0 V | 2 | ||
| N-Ch Zero Gate Voltage Drain Current | IDSS | 10 | µA | VDS = 30 V, VGS = 0 V, TJ = 55 °C | 2 | ||
| P-Ch Zero Gate Voltage Drain Current | IDSS | -10 | µA | VDS = -30 V, VGS = 0 V, TJ = 55 °C | 2 | ||
| N-Ch Body Diode Forward Voltage | VSD | 0.81 | 1.2 | V | IS = 5.4 A | 3 | |
| P-Ch Body Diode Forward Voltage | VSD | -0.77 | -1.2 | V | IS = -2 A | 3 | |
| N-Ch On-State Drain Current | ID(on) | 20 | A | VDS = 5 V, VGS = 10 V | 2 | ||
| P-Ch On-State Drain Current | ID(on) | -20 | A | VDS = -5 V, VGS = -10 V | 2 | ||
| N-Ch Drain-Source On-State Resistance | RDS(on) | 0.02 | Ω | VGS = 8 V, ID = 6.7 A | 2 | ||
| N-Ch Drain-Source On-State Resistance | RDS(on) | 0.024 | Ω | VGS = 4.5 V, ID = 6.6 A | 2 | ||
| P-Ch Drain-Source On-State Resistance | RDS(on) | 0.04 | Ω | VGS = -10 V, ID = -8 A | 2 | ||
| P-Ch Drain-Source On-State Resistance | RDS(on) | 0.044 | Ω | VGS = -8 V, ID = -6.5 A | 2 | ||
| P-Ch Drain-Source On-State Resistance | RDS(on) | 0.05 | Ω | VGS = -4.5 V, ID = -5 A | 2 |
CAD (KiCad official)
- Symbol:
AO4606-VB - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files:
ao4606-vb-etched.step/ao4606-vb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ao4606-vb.step/ao4606-vb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (14 pp, sha256
1b37c2e14da181cf, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).