component
AMC3330QDWERQ1
Public Made by Adomby adom
Texas Instruments Isolation Amplifiers, SOIC-16-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownAMC3330QDWERQ1
Texas Instruments · Isolation Amplifiers · SOIC-16-300mil
AMC3330QDWERQ1 from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | DCDC_OUT | power_out | High-side output of the isolated DC/DC converter; connect this pin to the HLDO_IN pin. |
| 2 | DCDC_HGND | power_in | High-side ground reference for the isolated DC/DC converter; connect this pin to the HGND pin. |
| 3 | HLDO_IN | power_in | Input of the high-side low-dropout (LDO) regulator; connect this pin to the DCDC_OUT pin. |
| 4 | NC | unconnected | No internal connection; connect this pin to the high-side ground or leave it unconnected (floating). |
| 5 | HLDO_OUT | power_out | Output of the high-side LDO. |
| 6 | INP | input | Noninverting analog input with a ±1 V linear full-scale differential input range (±1.25 V before clipping). |
| 7 | INN | input | Inverting analog input; connect this pin to HGND. |
| 8 | HGND | power_in | High-side analog ground; connect this pin to the DCDC_HGND pin. |
| 9 | GND | power_in | Low-side analog ground; connect this pin to the DCDC_GND pin. |
| 10 | OUTN | output | Inverting analog output. |
| 11 | OUTP | output | Noninverting analog output. |
| 12 | VDD | power_in | Low-side power supply, 3.0 V to 5.5 V relative to GND. |
| 13 | LDO_OUT | power_out | Output of the low-side LDO; connect this pin to the DCDC_IN pin. |
| 14 | DIAG | output | Active-low, open-drain status indicator output; connect to the pullup supply (for example, VDD) using a resistor or leave floating if not used. |
| 15 | DCDC_GND | power_in | Low-side ground reference for the isolated DC/DC converter; connect this pin to the GND pin. |
| 16 | DCDC_IN | power_in | Low-side input of the isolated DC/DC converter; connect this pin to the LDO_OUT pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-16-300mil |
| Category | Operational Amplifier/Comparator |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Single-ended input resistance | RIN | 0.1 | 0.8 | GΩ | INN = HGND | 8 | |
| Differential input resistance | RIND | 0.1 | 1.2 | GΩ | 8 | ||
| Input bias current | IIB | -10 | 2.5 | 10 | nA | INP = INN = HGND, IIB = (IIBP + IIBN) / 2 | 8 |
| Input offset current | IIO | -10 | -0.8 | 10 | nA | IIO = IINP, IINN; INP = INN = HGND | 8 |
| Common-mode output voltage | VCMout | 1.39 | 1.44 | 1.49 | V | 8 | |
| Failsafe differential output voltage | VFailsafe | -2.57 | -2.5 | V | V+ = (VOUTP, VOUTN); VDCDCout ≤ VDCDCUV or VHLDOout ≤ VHLDOUV | 8 | |
| Output bandwidth | BWOUT | 300 | 375 | kHz | 8 | ||
| Common-mode transient immunity | CMTI | 85 | 135 | kV/µs | /HGND, GND/ = 2 kV | 8 | |
| Input offset voltage | VOS | -0.3 | 0.05 | 0.3 | mV | TA = 25°C, INP = INN = HGND | 8 |
| Input offset drift | TCVOS | -4 | 1 | 4 | µV/°C | 8 | |
| Gain error | EG | -0.2 | -0.08 | 0.2 | % | TA = 25°C | 8 |
| Gain error drift | TCEG | -45 | 7 | 45 | ppm/°C | 8 | |
| Nonlinearity | -0.02 | 0.01 | 0.02 | % | 8 | ||
| Signal-to-noise ratio | SNR | 81 | 85 | dB | VIN = 2 VPP, fIN = 1 kHz, BW = 10 kHz, 10 kHz filter | 8 | |
| Common-mode rejection ratio | CMRR | -100 | dB | fIN = 0 Hz, VCM min ≤ VCM ≤ VCM max | 8 | ||
| Common-mode rejection ratio | CMRR | -86 | dB | fIN = 10 kHz, VCM min ≤ VCM ≤ VCM max | 8 | ||
| Low-level output voltage DIAG | VOL | 80 | 250 | mV | ISINK= 4 mA | 8 | |
| Open-drain output leakage current | ILKG | 5 | 100 | nA | VDD = 5V | 9 | |
| Low-side supply current | IDD | 28.5 | 41 | mA | No external load on HLDO | 9 | |
| Low-side supply current | IDD | 30.5 | 43 | mA | 1 mA external load on HLDO | 9 | |
| DC/DC output voltage | VDCDC_OUT | 3.1 | 3.5 | 4.65 | V | DCDC_OUT to HGND | 9 |
| DC/DC output undervoltage detection threshold | VDCDCUV | 2.1 | 2.25 | V | DCDC output falling | 9 | |
| High-side LDO output voltage | VHLDO_OUT | 3 | 3.2 | 3.4 | V | HLDO to HGND, up to 1 mA external load | 9 |
| High-side LDO undervoltage detection threshold | VHLDOUV | 2.4 | 2.6 | V | HLDO output falling | 9 | |
| Analog settling time | tAS | 0.6 | 1.1 | ms | VDD step to 3.0 V, to OUTP and OUTN valid, 0.1% settling | 9 | |
| VINx to VOUTx signal delay (50%, 10%) | 1.2 | 1.3 | µs | Unfiltered output | 9 | ||
| VINx to VOUTx signal delay (50%, 50%) | 1.6 | 2.1 | µs | Unfiltered output | 9 | ||
| VINx to VOUTx signal delay (50%, 90%) | 2.2 | 2.6 | µs | Unfiltered output | 9 | ||
| Low-side supply voltage | VDD | 3 | 3.3 | 5.5 | V | VDD to GND | 4 |
| Specified linear differential full-scale voltage | VFSR | -1 | 1 | V | VIN = VINP, VINN | 4 | |
| Operating ambient temperature | TA | -40 | 25 | 125 | °C | 4 | |
| Power-supply voltage | VDD | -0.3 | 6.5 | V | VDD to GND | 4 | |
| Digital output voltage DIAG | 6.5 | V | min GND, 0.5 | 4 | |||
| Input current | -10 | 10 | mA | Continuous, any pin except power-supply pins | 4 | ||
| Junction temperature | TJ | 150 | °C | 4 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| Junction-to-ambient thermal resistance | RθJA | 73.5 | °C/W | DWE (SOIC) 16 pins | 5 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 31 | °C/W | 5 | |||
| Junction-to-board thermal resistance | RθJB | 44 | °C/W | 5 |
CAD (KiCad official)
- Symbol:
AMC3330QDWERQ1 - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
- 3D model files:
amc3330qdwerq1-etched.step/amc3330qdwerq1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);amc3330qdwerq1.step/amc3330qdwerq1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (39 pp, sha256
8b8ffe975f1a7adb, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).