# AMC1311QDWVRQ1

**Texas Instruments** · Isolation Amplifiers · SOIC-8-300mil

AMC1311QDWVRQ1 from Texas Instruments, in a SOIC-8-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD1 | power_in | High-side (input-side) power supply, 3.0 V to 5.5 V referenced to GND1. Bypass to GND1 with a low-ESR ceramic (typically 100 nF close to the pin plus a bulk 1-10 µF). |
| 2 | VINP | input | Non-inverting (positive) high-impedance analog input. Linear differential input range is ±2 V (full-scale ±2 V) relative to VINN, with a typical differential input impedance of ~1.25 GΩ. Referenced to GND1. |
| 3 | VINN | input | Inverting (negative) high-impedance analog input, typically tied to the low-side reference of the sensed node. Common-mode input range and ±2 V differential range are referenced to GND1. |
| 4 | GND1 | power_in | High-side (input-side) analog ground reference. All VDD1, VINP and VINN signals are referenced to this pin; it is isolated from GND2 across the reinforced isolation barrier. |
| 5 | GND2 | power_in | Low-side (output-side) ground reference for VDD2, VOUTP and VOUTN. Isolated from GND1 by the reinforced capacitive isolation barrier (up to 7 kVpk). |
| 6 | VOUTN | output | Inverting (negative) side of the differential analog output, referenced to GND2. Output common-mode is nominally VDD2/2 and the full-scale differential output swing is ±2 V. Drive to a downstream differential ADC input or an instrumentation amplifier. |
| 7 | VOUTP | output | Non-inverting (positive) side of the differential analog output, referenced to GND2. Together with VOUTN forms the ±2 V full-scale differential output with a VDD2/2 common-mode. |
| 8 | VDD2 | power_in | Low-side (output-side) power supply, 3.0 V to 5.5 V referenced to GND2. Bypass to GND2 with a low-ESR ceramic (typically 100 nF close to the pin plus a bulk 1-10 µF). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8-300mil |
| Category | Op-amp/Cmp |
| Pins | 8 |

## Ordering variants

- `AMC1311QDWVRQ1`
- `AMC1311QDWVRQ1QDWVQ1`

## CAD (KiCad official)

- Symbol: `AMC1311QDWVRQ1`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8-300mil (KiCad packages3D, STEP)
- 3D model files: `amc1311qdwvrq1-etched.step` / `amc1311qdwvrq1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `amc1311qdwvrq1.step` / `amc1311qdwvrq1.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/amc1311qdwvrq1.pdf) (None pp, sha256 `1a7fef342b6ab5ee`, retrieved 2026-08-17, tier: manufacturer)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/amc1311qdwvrq1-datasheet.pdf)