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docs amc1306m25dwvr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
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amc1306m25dwvr-etched.fit.json amc1306m25dwvr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
amc1306m25dwvr-etched.glb amc1306m25dwvr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
amc1306m25dwvr-etched.step amc1306m25dwvr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
amc1306m25dwvr.glb Publish 0.1.0 · Ray 1mo ago
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package.json amc1306m25dwvr: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding) · Ray 1mo ago
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README.md Initial commit: component/amc1306m25dwvr · Ray 1mo ago

AMC1306M25DWVR

Texas Instruments · ADCs/DACs - Special Purpose · SOIC-8-300mil

AMC1306M25DWVR from Texas Instruments, in a SOIC-8-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 AVDD power_in Analog high-side power supply, 3.0V to 5.5V nominal with respect to AGND, requires 0.1µF low-ESR decoupling capacitor placed close to pin.
2 AINP input Non-inverting differential analog input for ±250mV measurement range with 22kΩ differential input resistance.
3 AINN input Inverting differential analog input for ±250mV measurement range with 22kΩ differential input resistance.
4 AGND power_in Analog high-side ground reference connected to floating power supply return.
5 DGND power_in Digital low-side ground reference connected to microcontroller ground.
6 DOUT output Unencoded 1-bit modulator data bitstream output at CMOS logic level with 15ns typical propagation delay from CLKIN rising edge.
7 CLKIN input System clock input, 5MHz to 21MHz range at AVDD ≥4.5V or 5MHz to 20MHz at 3.0V≤AVDD<4.5V, with 1.5MΩ typical internal pull-down.
8 DVDD power_in Digital low-side power supply, 2.7V to 5.5V nominal with respect to DGND, requires 0.1µF decoupling capacitor.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8-300mil
Category Data Acquisition
Pins 8

CAD (KiCad official)

  • Symbol: AMC1306M25DWVR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8-300mil (KiCad packages3D, STEP)
  • 3D model files: amc1306m25dwvr-etched.step / amc1306m25dwvr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); amc1306m25dwvr.step / amc1306m25dwvr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (46 pp, sha256 101cf1fa31881464, retrieved 2026-09-24, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF