# AMC1304L25DWR

**Texas Instruments** · ADCs/DACs - Special Purpose · SOIC-16-300mil

AMC1304L25DWR from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection; this pin can be connected to VCAP or left unconnected. |
| 2 | AINP | input | Noninverting analog input; the AMC1304L25 full-scale input range is ±250 mV (differential input resistance 25 kΩ). |
| 3 | AINN | input | Inverting analog input; the AMC1304L25 full-scale input range is ±250 mV (differential input resistance 25 kΩ). |
| 4 | AGND | power_in | Internally connected to pin 8; can be left unconnected or tied to high-side ground. |
| 5 | NC | unconnected | No internal connection; can be left unconnected or tied to AGND only. |
| 6 | LDOIN | power_in | Low dropout regulator input; supply range 4 V to 18 V (15 V nominal). |
| 7 | VCAP | power_out | LDO output; requires a 0.1 µF decoupling capacitor between VCAP and AGND placed as close as possible to the device. |
| 8 | AGND | power_in | High-side ground reference. |
| 9 | DGND | power_in | Controller-side ground reference. |
| 10 | DOUT_N | output | Inverted modulator data output (LVDS interface version only). |
| 11 | DOUT | output | Modulator data output. |
| 12 | CLKIN_N | input | Inverted modulator clock input (LVDS interface version only); a 100-Ω termination resistor should be placed as close as possible to CLKIN/CLKIN_N. |
| 13 | CLKIN | input | Modulator clock input, 5 MHz to 20.1 MHz. |
| 14 | DVDD | power_in | Controller-side power supply, 3.0 V to 5.5 V (3.3 V nominal). |
| 15 | NC | unconnected | No internal connection; can be left unconnected or tied to DVDD only. |
| 16 | DGND | power_in | Controller-side ground reference. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-16-300mil |
| Category | Data Acquisition |
| Pins | 16 |

## CAD (KiCad official)

- Symbol: `AMC1304L25DWR`
- Footprint: `Package_SO:SOIC-16_3.9x9.9mm_P1.27mm`
- 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
- 3D model files: `amc1304l25dwr-etched.step` / `amc1304l25dwr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `amc1304l25dwr.step` / `amc1304l25dwr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/amc1304m05) (44 pp, sha256 `5c0071e2f9aa6c3e`, retrieved 2026-10-08, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/amc1304l25dwr-datasheet.pdf)