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AMC1303M2520DWVR

Texas Instruments · Analog To Digital Converters (ADCs) · SOIC-8-300mil

AMC1303M2520DWVR from Texas Instruments, in a SOIC-8-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 AVDD power_in Analog (high-side) power supply, 3.0V to 5.5V; see the Power Supply Recommendations section for decoupling.
2 AINP input Noninverting analog input of the modulator.
3 AINN input Inverting analog input of the modulator.
4 AGND power_in Analog (high-side) ground reference.
5 DGND power_in Digital (controller-side) ground reference.
6 DOUT output Modulator bitstream output; uncoded for the AMC1303Mx (Manchester coding applies only to the AMC1303Ex derivatives).
7 CLKOUT output Modulator clock output, 20MHz nominal on the AMC1303Mxx20 (10MHz on AMC1303Mxx10).
8 DVDD power_in Digital (controller-side) power supply, 2.7V to 5.5V; see the Power Supply Recommendations section for decoupling.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8-300mil
Category Data Converters
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Analog (high-side) supply voltage (AVDD to AGND) AVDD 3 5 5.5 V 4
Digital (controller-side) supply voltage (DVDD to DGND) DVDD 2.7 3.3 5.5 V 4
Operating ambient temperature TA -40 125 °C 4
Supply voltage, AVDD to AGND or DVDD to DGND -0.3 6.5 V 4
Analog input voltage at AINP, AINN (printed AGND, 6 to AVDD + 0.5) -6 V Referenced to AGND; upper limit printed as AVDD + 0.5 4
Digital output voltage at DOUT, CLKOUT (printed DGND, 0.5 to DVDD + 0.5) -0.5 V Referenced to DGND; upper limit printed as DVDD + 0.5 4
Input current to any pin except supply pins -10 10 mA 4
Junction temperature TJ 150 °C 4
Storage temperature Tstg -65 150 °C 4
Junction-to-ambient thermal resistance RθJA 112.2 °C/W DWV (SOIC) 8-pin 5
Junction-to-case (top) thermal resistance RθJC(top) 47.6 °C/W DWV (SOIC) 8-pin 5
Junction-to-board thermal resistance RθJB 60 °C/W DWV (SOIC) 8-pin 5
Junction-to-top characterization parameter ψJT 23.1 °C/W DWV (SOIC) 8-pin 5
Junction-to-board characterization parameter ψJB 60 °C/W DWV (SOIC) 8-pin 5
Differential input voltage before clipping output VClipping -320 320 mV VIN = AINP, AINN 10
Specified linear differential full-scale FSR -250 250 mV VIN = AINP, AINN 10
Absolute common-mode input voltage -2 V (AINP + AINN) / 2 to AGND; upper limit printed as AVDD 10
Operating common-mode input voltage VCM -0.16 V (AINP + AINN) / 2 to AGND; upper limit printed as AVDD, 2.1 10
Input bias current IIB -82 -60 -48 μA AINP = AINN = AGND, IIB = IIBP + IIBN 10
Input offset current IIO -5 5 nA 10
Common-mode transient immunity CMTI 50 100 kV/µs 10
Differential nonlinearity DNL -0.99 0.99 LSB Resolution: 16 bits 10
Integral nonlinearity INL -4 1 4 LSB Resolution: 16 bits 10
Offset error EO -100 4.5 100 µV Initial, at TA = 25°C, AINP = AINN = AGND 10
Offset error thermal drift TCEO -1 0.15 1 μV/°C 10
Gain error EG -0.2 -0.005 0.2 % Initial, at TA = 25°C 10
Gain error thermal drift TCEG -40 20 40 ppm/°C 10
Signal-to-noise ratio (AMC1303x2520) SNR 84.5 86.5 dB fIN = 35Hz 10
Total harmonic distortion (AMC1303x2520) THD -101 -86 dB fIN = 35Hz 10
Low-level output voltage VOL 0.1 V IOL = 20µA 11
Low-level output voltage VOL 0.4 V IOL = 4mA 11
High-side supply current (AMC1303x2520) IAVDD 6.3 8.5 mA 3.0V ≤ AVDD ≤ 3.6V 11
High-side supply current (AMC1303x2520) IAVDD 7.2 9.8 mA 4.5V ≤ AVDD ≤ 5.5V 11
Controller-side supply current (AMC1303M2520) IDVDD 4.6 6 mA 2.7V ≤ DVDD ≤ 3.6V, CLOAD = 15pF 11
Controller-side supply current (AMC1303M2520) IDVDD 5.4 7.2 mA 4.5V ≤ DVDD ≤ 5.5V, CLOAD = 15pF 11
Internal clock frequency on CLKOUT (AMC1303Mxx20) fCLK 19.2 20 20.8 MHz 12
Internal clock duty cycle on CLKOUT (AMC1303Mx) 45 50 55 % 12

CAD (KiCad official)

  • Symbol: AMC1303M2520DWVR
  • Footprint: Package_SO:SOIC-8_7.5x5.85mm_P1.27mm
  • 3D model: SOIC-8-300mil (KiCad packages3D, STEP)
  • 3D model files: amc1303m2520dwvr-etched.step / amc1303m2520dwvr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); amc1303m2520dwvr.step / amc1303m2520dwvr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (45 pp, sha256 7a48b395c8a1460d, retrieved 2026-11-06, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF