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AMC1301QDWVRQ1

Public Made by Adom

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Texas Instruments Isolation Amplifiers, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentsignal isolation devicesamc1301qdwvrq1factory-2.0.0extractor-text

Verified AMC1301QDWVRQ1

by Ray · last 5 Nov 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

5 Nov 2026RayPublished by the parts factory: tier mfr, 8 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: AMC1301QDWVRQ1 · SOIC-8 · 8 pins
  • ✓copper: 8 copper pads, none touching another net
  • ✓datasheet: all 8 pin names found in the 36-page datasheet
  • ✓distributor: lcsc C2057461, digikey 296-48286-2-ND, mouser 595-AMC1301QDWVRQ1
  • ✓family: SOIC-8_3.9x4.9mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-7yt0ffzq/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 8 pins = 8 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 8 pins agree
  • ✓symbol_text: no pin names collide
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ amc1301qdwvrq1.kicad_sym✓ amc1301qdwvrq1.kicad_mod✓ amc1301qdwvrq1.step
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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 6d ago
viewers amc1301qdwvrq1: viewers · Ray 6d ago
amc1301qdwvrq1-etched.glb Publish 0.1.0 · Ray 6d ago
amc1301qdwvrq1-etched.step amc1301qdwvrq1: factory component page (tier=mfr) · Ray 6d ago
amc1301qdwvrq1-hero.glb amc1301qdwvrq1: hero GLB from the etched model (keeps the MPN mark) · Ray 6d ago
amc1301qdwvrq1-hero.overlay.json Publish 0.1.0 · Ray 6d ago
amc1301qdwvrq1.glb Publish 0.1.0 · Ray 6d ago
amc1301qdwvrq1.kicad_mod Publish 0.1.0 · Ray 6d ago
amc1301qdwvrq1.kicad_sym Publish 0.1.0 · Ray 6d ago
amc1301qdwvrq1.lbr Publish 0.1.0 · Ray 6d ago
amc1301qdwvrq1.step Publish 0.1.0 · Ray 6d ago
package.json Publish 0.1.0 · Ray 6d ago
page.json Set visibility: public · Ray 6d ago
README.md Publish 0.1.0 · Ray 6d ago
verification.json Verified: Published by the parts factory: tier mfr, 8 pins · Ray 6d ago

AMC1301QDWVRQ1

Texas Instruments · Isolation Amplifiers · SOIC-8

AMC1301QDWVRQ1 from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD1 power_in High-side power supply; see the Power Supply Recommendations section for power-supply decoupling recommendations.
2 INP input Noninverting analog input; either INP or INN must have a DC current path to GND1 to define the common-mode input voltage.
3 INN input Inverting analog input; either INP or INN must have a DC current path to GND1 to define the common-mode input voltage.
4 GND1 power_in High-side analog ground.
5 GND2 power_in Low-side analog ground.
6 OUTN output Inverting analog output.
7 OUTP output Noninverting analog output.
8 VDD2 power_in Low-side power supply; see the Power Supply Recommendations section for power-supply decoupling recommendations.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8
Category Signal Isolation Devices
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power-supply voltage high-side VDD1 to GND1 VDD1 -0.3 7 V 5
Power-supply voltage low-side VDD2 to GND2 VDD2 -0.3 7 V 5
Input current continuous, any pin except power-supply pins -10 10 mA Continuous, any pin except power-supply pins 5
Junction temperature TJ 150 °C 5
Storage temperature Tstg -65 150 °C 5
High-side power supply VDD1 to GND1 VDD1 3 5 5.5 V 5
Low-side power supply VDD2 to GND2 VDD2 3 3.3 5.5 V 5
Clipping differential input voltage before clipping output VClipping -302.7 302.7 mV VIN = VINP, VINN 5
Specified linear differential full-scale voltage VFSR -250 250 mV VIN = VINP, VINN 5
Absolute common-mode input voltage -2 V (VINP + VINN) / 2 to GND1 5
Operating common-mode input voltage VCM -0.16 V (VINP + VINN) / 2 to GND1 5
Specified ambient temperature TA -40 125 °C 5
Input offset voltage VOS -0.2 0.05 0.2 mV Initial, at TA = 25°C, INP = INN = GND1 9
Input offset drift TCVOS -3 1 3 µV/°C 9
Input bias current IIB -41 -30 -24 µA INP = INN = GND1; IIB = (IIBP + IIBN) / 2 9
Gain error at TA = 25°C EG -0.3 0.05 0.3 % at TA = 25°C 9
Gain drift TCEG -50 15 50 ppm/°C 9
Nonlinearity -0.03 0.01 0.03 % 9
Nonlinearity drift -1 1 ppm/°C 9
Clipping differential output voltage VCLIPout -2.52 2.49 2.52 V VOUT = (VOUTP, VOUTN); /VIN/ = /VINP, VINN/ > /VClipping/ 9
Failsafe differential output voltage VFailsafe -2.563 -2.545 V VCM ≥ VCMov, or VDD1 missing 9
Output resistance ROUT 0.2 Ω On OUTP or OUTN 9
Common-mode output voltage VCMout 1.39 1.44 1.49 V 9
Power-supply current high-side IDD1 6.3 8.5 mA 3.0 V ≤ VDD1 ≤ 3.6 V 10
Power-supply current high-side IDD1 7.2 9.8 mA 4.5 V ≤ VDD1 ≤ 5.5 V 10
Power-supply current low-side IDD2 5.3 7.2 mA 3.0 V ≤ VDD2 ≤ 3.6 V 10
Power-supply current low-side IDD2 5.9 8.1 mA 4.5 V ≤ VDD2 ≤ 5.5 V 10
Junction-to-ambient thermal resistance RθJA 110.1 °C/W 6
Junction-to-case (top) thermal resistance RθJC(top) 51.7 °C/W 6
Junction-to-board thermal resistance RθJB 66.4 °C/W 6
Junction-to-top characterization parameter ΨJT 16 °C/W 6
Junction-to-board characterization parameter ΨJB 64.5 °C/W 6

CAD (KiCad official)

  • Symbol: AMC1301QDWVRQ1
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: amc1301qdwvrq1-etched.step / amc1301qdwvrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); amc1301qdwvrq1.step / amc1301qdwvrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (36 pp, sha256 8d0ccb947abb56e6, retrieved 2026-11-05, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF