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docs amc1301dwv: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
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amc1301dwv-etched.fit.json amc1301dwv: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
amc1301dwv-etched.glb amc1301dwv: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
amc1301dwv-etched.step amc1301dwv: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
amc1301dwv.glb Publish 0.1.0 · Ray 1mo ago
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package.json amc1301dwv: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding) · Ray 1mo ago
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README.md Initial commit: component/amc1301dwv · Ray 1mo ago

AMC1301DWV

Texas Instruments · Isolation Amplifiers · SOIC-8

AMC1301DWV from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD1 power_in High-side power supply input; operating voltage 3.0V to 5.5V; requires 100nF + 1µF bypass capacitors.
2 INP input Noninverting analog input; linear differential input range ±250mV; requires DC current path to GND1 to define common-mode voltage.
3 INN input Inverting analog input; linear differential input range ±250mV; requires DC current path to GND1 to define common-mode voltage.
4 GND1 power_in High-side analog ground reference for input stage; connection point for shunt resistor outer lead recommended.
5 GND2 power_in Low-side analog ground reference for output stage; local ground connection for output filter and ADC.
6 OUTN output Inverting analog output; fixed gain 8.2 V/V; output bandwidth 190-210kHz; common-mode output voltage 1.39V to 1.49V.
7 OUTP output Noninverting analog output; fixed gain 8.2 V/V; output bandwidth 190-210kHz; common-mode output voltage 1.39V to 1.49V.
8 VDD2 power_in Low-side power supply input; operating voltage 3.0V to 5.5V; requires 100nF + 1µF bypass capacitors.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8
Category Signal Isolation Devices
Pins 8

CAD (KiCad official)

  • Symbol: AMC1301DWV
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: amc1301dwv-etched.step / amc1301dwv-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); amc1301dwv.step / amc1301dwv.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (36 pp, sha256 c3703ca08ee32269, retrieved 2026-09-22, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF