component
AMC1300BQDWVRQ1
Public Made by Adomby adom
Texas Instruments Isolation Amplifiers, SOIC-8-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownAMC1300BQDWVRQ1
Texas Instruments · Isolation Amplifiers · SOIC-8-300mil
AMC1300BQDWVRQ1 from Texas Instruments, in a SOIC-8-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD1 | power_in | High-side power supply, specified from 3 V to 5.5 V relative to GND1 (absolute maximum 6.5 V); see Power Supply Recommendations for decoupling. |
| 2 | INP | input | Noninverting analog input; either INP or INN must have a DC current path to GND1 to define the common-mode input voltage, with a linear differential range of ±250 mV. |
| 3 | INN | input | Inverting analog input; either INP or INN must have a DC current path to GND1 to define the common-mode input voltage, with a linear differential range of ±250 mV. |
| 4 | GND1 | power_in | High-side analog ground, the reference for VDD1 and the analog inputs. |
| 5 | GND2 | power_in | Low-side analog ground, the reference for VDD2 and the outputs. |
| 6 | OUTN | output | Inverting analog output, limited to between GND2 - 0.5 V and VDD2 + 0.5 V (absolute maximum). |
| 7 | OUTP | output | Noninverting analog output, limited to between GND2 - 0.5 V and VDD2 + 0.5 V (absolute maximum). |
| 8 | VDD2 | power_in | Low-side power supply, specified from 3 V to 5.5 V relative to GND2 (absolute maximum 6.5 V); see Power Supply Recommendations for decoupling. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8-300mil |
| Category | Signal Isolation Devices |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| High-side supply voltage | VDD1 to GND1 | -0.3 | 6.5 | V | 4 | ||
| Low-side supply voltage | VDD2 to GND2 | -0.3 | 6.5 | V | 4 | ||
| Input current | -10 | 10 | mA | Continuous, any pin except power-supply pins | 4 | ||
| Junction temperature | TJ | 150 | °C | 4 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| High-side power supply | VDD1 | 3 | 5 | 5.5 | V | VDD1 to GND1 | 4 |
| Low-side power supply | VDD2 | 3 | 3.3 | 5.5 | V | VDD2 to GND2 | 4 |
| Differential input voltage before clipping output | VClipping | -320 | 320 | mV | VIN = VINP, VINN | 4 | |
| Specified linear differential full-scale voltage | VFSR | -250 | 250 | mV | VIN = VINP, VINN | 4 | |
| Operating common-mode input voltage | VCM | -0.16 | V | (VINP + VINN) / 2 to GND1; max is VDD1, 2.1 | 4 | ||
| Specified ambient temperature | TA | -40 | 125 | °C | 4 | ||
| Junction-to-ambient thermal resistance | RθJA | 85.4 | °C/W | DWV (SOIC) 8 pins | 5 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 26.8 | °C/W | 5 | |||
| Junction-to-board thermal resistance | RθJB | 43.5 | °C/W | 5 | |||
| Maximum power dissipation (both sides) | PD | 99 | mW | VDD1 = VDD2 = 5.5 V | 5 | ||
| Input offset voltage | VOS | -0.2 | 0.01 | 0.2 | mV | Initial, at TA = 25°C, INP = INN = GND1 | 8 |
| Input offset drift | TCVOS | -0.9 | 0.1 | 0.9 | µV/°C | 8 | |
| Input bias current | IIB | -41 | -30 | -24 | µA | INP = INN = GND1; IIB = (IIBP + IIBN) / 2 | 8 |
| Gain error | EG | -0.3 | 0.04 | 0.3 | % | at TA = 25°C | 8 |
| Gain drift | TCEG | -30 | 5 | 30 | ppm/°C | 8 | |
| Nonlinearity | -0.03 | 0.01 | 0.03 | % | 8 | ||
| Signal-to-noise ratio | SNR | 81.5 | 85 | dB | fIN = 1 kHz, BW = 10 kHz | 8 | |
| Common-mode output voltage | VCMout | 1.39 | 1.44 | 1.49 | V | 8 | |
| Clipping differential output voltage | VCLIPout | -2.52 | 2.49 | 2.52 | V | VOUT = (VOUTP, VOUTN); /VIN/ > /VClipping/ | 8 |
| Failsafe differential output voltage | VFailsafe | -2.63 | -2.57 | -2.53 | V | VCM ≥ VCMov, or VDD1 missing | 8 |
| Output bandwidth | BW | 250 | 310 | kHz | 8 | ||
| Common-mode transient immunity | CMTI | 100 | 150 | kV/µs | /GND1, GND2/ = 1 kV | 8 | |
| VDD1 undervoltage detection threshold voltage | VDD1UV | 2.4 | 2.6 | 2.8 | V | VDD1 falling | 9 |
| High-side supply current | IDD1 | 6.3 | 8.5 | mA | 3.0 V ≤ VDD1 ≤ 3.6 V | 9 | |
| High-side supply current | IDD1 | 7.2 | 9.8 | mA | 4.5 V ≤ VDD1 ≤ 5.5 V | 9 | |
| Low-side supply current | IDD2 | 5.3 | 7.2 | mA | 3.0 V ≤ VDD2 ≤ 3.6 V | 9 | |
| Low-side supply current | IDD2 | 5.9 | 8.1 | mA | 4.5 V ≤ VDD2 ≤ 5.5 V | 9 | |
| VINx to VOUTx signal delay (50% - 10%) | 1 | 1.5 | µs | Unfiltered output | 9 | ||
| VINx to VOUTx signal delay (50% - 50%) | 1.6 | 2.1 | µs | Unfiltered output | 9 | ||
| VINx to VOUTx signal delay (50% - 90%) | 2.5 | 3 | µs | Unfiltered output | 9 | ||
| Analog settling time | tAS | 500 | µs | VDD1 step to 3.0 V with VDD2 ≥ 3.0 V, to VOUTP, VOUTN valid, 0.1% settling | 9 |
CAD (KiCad official)
- Symbol:
AMC1300BQDWVRQ1 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8-300mil (KiCad packages3D, STEP)
- 3D model files:
amc1300bqdwvrq1-etched.step/amc1300bqdwvrq1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);amc1300bqdwvrq1.step/amc1300bqdwvrq1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (33 pp, sha256
d97735576823f684, retrieved 2026-10-22, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).