AMC1204BDWR from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	AVDD	power_in	High-side (analog) power supply; recommended operating range is 4.5 V to 5.5 V with 5 V nominal, referenced to AGND.
2	VINP	input	Noninverting analog input; the differential input VINP - VINN is specified over ±250 mV, with linearity and noise ensured only within this range.
3	VINN	input	Inverting analog input; the differential input VINP - VINN is specified over ±250 mV, with linearity and noise ensured only within this range.
4	AGND	power_in	High-side ground; internally connected to pin 8 via a low-impedance path, so only one of the two AGND pins must be tied to the ground plane.
5	NC	unconnected	No internal connection; can be tied to any potential or left unconnected.
6	NC	unconnected	No internal connection; can be tied to any potential or left unconnected.
7	NC	unconnected	No internal connection; can be tied to any potential or left unconnected.
8	AGND	power_in	High-side ground; internally connected to pin 4 via a low-impedance path, so only one of the two AGND pins must be tied to the ground plane.
9	DGND	power_in	Controller-side (digital) ground, shared with pin 16.
10	NC	unconnected	No internal connection; can be tied to any potential or left unconnected.
11	DATA	output	Modulator data output; the bitstream is updated on the falling edge of CLKIN, with tD (delayed falling edge of CLKIN to DATA valid) of 2 ns minimum and 15 ns maximum.
12	NC	unconnected	No internal connection; can be tied to any potential or left unconnected.
13	CLKIN	input	Modulator clock input; 5 MHz to 22 MHz input clock frequency (20 MHz typical), with 45.5 ns to 200 ns clock period.
14	DVDD	power_in	Controller-side (digital) power supply; recommended operating range is 2.7 V to 5.5 V with 3.3 V typical.
15	NC	unconnected	No internal connection; can be tied to any potential or left unconnected.
16	DGND	power_in	Controller-side (digital) ground, shared with pin 9.

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	SOIC-16-300mil
Category	Data Acquisition
Pins	16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply voltage, AVDD to AGND or DVDD to DGND		-0.3		6	V	AVDD to AGND or DVDD to DGND	5
Input current to any pin except supply pins		-10		10	mA		5
Maximum virtual junction temperature	TJ			150	°C		5
Operating ambient temperature	TOA	-40		125	°C		5
Storage temperature	Tstg	-65		150	°C		5
Operating ambient temperature	TA	-40		105	°C		5
High-side (analog) supply voltage	AVDD	4.5	5	5.5	V		5
Controller-side (digital) supply voltage	DVDD	2.7	3.3	5.5	V		5
Integral linearity error	INL	-8	2	8	LSB	TA = -40°C to 85°C	9
Integral linearity error	INL	-16	5	16	LSB	TA = -40°C to 105°C	9
Differential nonlinearity	DNL	-1		1	LSB		9
Offset error	VOS	-1	0.1	1	mV		9
Offset error thermal drift	TCVOS	-3.5	1	3.5	μV/°C		9
Gain error	GERR	-2	0.5	2	%		9
Gain error thermal drift	TCGERR	-30		30	ppm/°C		9
Full-scale differential voltage input range	FSR	-320		320	mV	VINP, VINN	9
Specified full-scale range		-250		250	mV		9
Operating common-mode signal	VCM	-160			mV		9
Input leakage current	IIL	-10		10	μA	VINP, VINN = ±250 mV	9
Input leakage current	IIL	-50		50	μA	VINP, VINN = ±320 mV	9
Clock period (external clock)	tCLKIN	45.5	50	200	ns		9
Input clock frequency	fCLKIN	5	20	22	MHz		9
Clock duty cycle	DutyCLKIN	40	50	60	%	5 MHz ≤ fCLKIN < 20 MHz	9
Clock duty cycle	DutyCLKIN	45	50	55	%	20 MHz ≤ fCLKIN ≤ 22 MHz	9
Signal-to-noise + distortion	SINAD	78	87		dB	fIN = 1kHz, TA = -40°C to 85°C	9
Signal-to-noise + distortion	SINAD	70	87		dB	fIN = 1kHz, TA = -40°C to 105°C	9
Signal-to-noise ratio	SNR	84	88		dB	fIN = 1kHz, TA = -40°C to 85°C	9
Signal-to-noise ratio	SNR	83	88		dB	fIN = 1kHz, TA = -40°C to 105°C	9
Total harmonic distortion	THD		-96	-80	dB	fIN = 1kHz, TA = -40°C to 85°C	9
Total harmonic distortion	THD		-96	-70	dB	fIN = 1kHz, TA = -40°C to 105°C	9
Spurious-free dynamic range	SFDR	82	96		dB	fIN = 1kHz, TA = -40°C to 85°C	9
Spurious-free dynamic range	SFDR	72	96		dB	fIN = 1kHz, TA = -40°C to 105°C	9
Input current	IIN	-10		10	μA	VIN = DVDD to DGND	9
Low-level input voltage (CMOS Schmitt-trigger)	VIL	-0.3			V	DVDD = 4.5V to 5.5V	9
High-level input voltage (LVCMOS)	VIH	2			V	DVDD = 2.7 V to 3.6 V	9
Low-level input voltage (LVCMOS)	VIL	-0.3		0.8	V	DVDD = 2.7 V to 3.6 V	10
High-side supply voltage	AVDD	4.5	5	5.5	V		10
Controller-side supply voltage	DVDD	2.7	3.3	5.5	V		10
High-side supply current	IAVDD		11	16	mA	4.5 V ≤ AVDD ≤ 5.5 V	10
Controller-side supply current	IDVDD		2	4	mA	2.7 V ≤ DVDD ≤ 3.6 V	10
Controller-side supply current	IDVDD		2.8	5	mA	4.5V ≤ DVDD ≤ 5.5 V	10
Power dissipation	PD		61.6	102.4	mW	AVDD = 5.5 V, DVDD = 3.6 V	10
CLKIN clock high time	tHIGH	20	25	120	ns		10
CLKIN clock low time	tLOW	20	25	120	ns		10
Delayed falling edge of CLKIN to DATA valid	tD	2		15	ns		10
Power-supply rejection ratio	PSRR		79		dB		9
Common-mode rejection ratio	CMRR		108		dB	VIN from 0 V to 5 V at 0 Hz	9
Common-mode rejection ratio	CMRR		114		dB	VIN from 0 V to 5 V at 100 kHz	9
Input capacitance to AGND	CI		7		pF	VINP or VINN	9
Differential input capacitance	CID		3.5		pF		9
Differential input resistance	RID		12.5		kΩ		9
Common-mode transient immunity	CMTI		15		kV/μs		9
Input capacitance	CIN		5		pF		9
High-level output voltage (CMOS)	VOH		4.4		V	DVDD = 4.5 V, IOH = -100 µA	10
Low-level output voltage (CMOS)	VOL		0.5		V	DVDD = 4.5 V, IOL = 100 µA	10
Low-level output voltage (LVCMOS)	VOL		0.1		V	IOL = 20 µA	10
Low-level output voltage (LVCMOS)	VOL		0.4		V	IOL = 4 mA	10
Junction-to-ambient thermal resistance (DW, 16-pin)	RθJA		78.5		°C/W		5
Junction-to-case (top) thermal resistance (DW, 16-pin)	RθJC(top)		41.3		°C/W		5
Junction-to-board thermal resistance (DW, 16-pin)	RθJB		50.2		°C/W		5

CAD (KiCad official)

Symbol: AMC1204BDWR
Footprint: Package_SO:SOIC-16W_7.5x10.3mm_P1.27mm
3D model: SOIC-16-300mil (KiCad packages3D, STEP)
3D model files: amc1204bdwr-etched.step / amc1204bdwr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); amc1204bdwr.step / amc1204bdwr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (46 pp, sha256 59b4ffc6b2b9478a, retrieved 2026-11-10, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

AMC1204BDWR

Verified AMC1204BDWR

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3D Model

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Datasheet

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