component
AMC1203DWR
Public Made by Adomby adom
Texas Instruments ADCs/DACs - Special Purpose, SOIC-16-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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AMC1203DWR
Texas Instruments · ADCs/DACs - Special Purpose · SOIC-16-300mil
AMC1203DWR from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | AVDD | power_in | Analog (high-side) power supply, specified at 4.5 V to 5.5 V (5.0 V nominal) from AVDD to AGND, and should be decoupled per the Power Supply Recommendations section. |
| 2 | INP | input | Noninverting analog input for the differential input VIN = VINP − VINN, with a specified linear range of −280 mV to 280 mV and clipping above ±320 mV. |
| 3 | INN | input | Inverting analog input for the differential input VIN = VINP − VINN, with a specified linear range of −280 mV to 280 mV and clipping above ±320 mV. |
| 4 | AGND | power_in | Analog (high-side) ground reference; pins 4 and 8 are connected internally by a low-impedance path, so only one must be tied to the ground plane. |
| 5 | NC | unconnected | No internal connection; tie to any potential or leave unconnected. |
| 6 | NC | unconnected | No internal connection; tie to any potential or leave unconnected. |
| 7 | NC | unconnected | No internal connection; tie to any potential or leave unconnected. |
| 8 | AGND | power_in | Analog (high-side) ground; connected internally to pin 4 by a low-impedance path, so only one of the two pins must be tied to the ground plane. |
| 9 | DGND | power_in | Digital (low-side) ground; connected internally to pin 16 by a low-impedance path, so only one of the two pins must be tied to the ground plane. |
| 10 | NC | unconnected | No internal connection; tie to any potential or leave unconnected. |
| 11 | DOUT | output | Modulator data output, a bitstream synchronized to the internally generated clock. |
| 12 | NC | unconnected | No internal connection; tie to any potential or leave unconnected. |
| 13 | CLKOUT | output | Modulator clock output derived from the internal 10 MHz clock generator. |
| 14 | DVDD | power_in | Digital (low-side) power supply, specified at 4.5 V to 5.5 V (5.0 V nominal) from DVDD to DGND, and should be decoupled per the Power Supply Recommendations section. |
| 15 | NC | unconnected | No internal connection; tie to any potential or leave unconnected. |
| 16 | DGND | power_in | Digital (low-side) ground; connected internally to pin 9 by a low-impedance path, so only one of the two pins must be tied to the ground plane. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-16-300mil |
| Category | Data Acquisition |
| Pins | 16 |
CAD (KiCad official)
- Symbol:
AMC1203DWR - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
- 3D model files:
amc1203dwr-etched.step/amc1203dwr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);amc1203dwr.step/amc1203dwr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (47 pp, sha256
13ddc3a6a9782b02, retrieved 2026-10-11, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# AMC1203DWR
**Texas Instruments** · ADCs/DACs - Special Purpose · SOIC-16-300mil
AMC1203DWR from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | AVDD | power_in | Analog (high-side) power supply, specified at 4.5 V to 5.5 V (5.0 V nominal) from AVDD to AGND, and should be decoupled per the Power Supply Recommendations section. |
| 2 | INP | input | Noninverting analog input for the differential input VIN = VINP − VINN, with a specified linear range of −280 mV to 280 mV and clipping above ±320 mV. |
| 3 | INN | input | Inverting analog input for the differential input VIN = VINP − VINN, with a specified linear range of −280 mV to 280 mV and clipping above ±320 mV. |
| 4 | AGND | power_in | Analog (high-side) ground reference; pins 4 and 8 are connected internally by a low-impedance path, so only one must be tied to the ground plane. |
| 5 | NC | unconnected | No internal connection; tie to any potential or leave unconnected. |
| 6 | NC | unconnected | No internal connection; tie to any potential or leave unconnected. |
| 7 | NC | unconnected | No internal connection; tie to any potential or leave unconnected. |
| 8 | AGND | power_in | Analog (high-side) ground; connected internally to pin 4 by a low-impedance path, so only one of the two pins must be tied to the ground plane. |
| 9 | DGND | power_in | Digital (low-side) ground; connected internally to pin 16 by a low-impedance path, so only one of the two pins must be tied to the ground plane. |
| 10 | NC | unconnected | No internal connection; tie to any potential or leave unconnected. |
| 11 | DOUT | output | Modulator data output, a bitstream synchronized to the internally generated clock. |
| 12 | NC | unconnected | No internal connection; tie to any potential or leave unconnected. |
| 13 | CLKOUT | output | Modulator clock output derived from the internal 10 MHz clock generator. |
| 14 | DVDD | power_in | Digital (low-side) power supply, specified at 4.5 V to 5.5 V (5.0 V nominal) from DVDD to DGND, and should be decoupled per the Power Supply Recommendations section. |
| 15 | NC | unconnected | No internal connection; tie to any potential or leave unconnected. |
| 16 | DGND | power_in | Digital (low-side) ground; connected internally to pin 9 by a low-impedance path, so only one of the two pins must be tied to the ground plane. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-16-300mil |
| Category | Data Acquisition |
| Pins | 16 |
## CAD (KiCad official)
- Symbol: `AMC1203DWR`
- Footprint: `Package_SO:SOIC-16_3.9x9.9mm_P1.27mm`
- 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
- 3D model files: `amc1203dwr-etched.step` / `amc1203dwr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `amc1203dwr.step` / `amc1203dwr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/amc1203) (47 pp, sha256 `13ddc3a6a9782b02`, retrieved 2026-10-11, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/amc1203dwr-datasheet.pdf)