component
AMC0306M05DWVR
Public Made by Adomby adom
Texas Instruments , SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownAMC0306M05DWVR
Texas Instruments · IC · SOIC-8
AMC0306M05DWVR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | AVDD | power_in | Analog (high-side) power supply; decoupling is described in the Power Supply Recommendation section. |
| 2 | INP | input | Noninverting analog input; the input filter design is described in the Input Filter Design section. |
| 3 | INN | input | Inverting analog input; the input filter design is described in the Input Filter Design section. |
| 4 | AGND | power_in | Analog (high-side) ground reference for the isolated high-side domain. |
| 5 | DGND | power_in | Digital (low-side) ground reference for the low-side domain. |
| 6 | DOUT | output | Modulator data output, a bitstream synchronized to the external clock on CLKIN. |
| 7 | CLKIN | input | Modulator clock input with internal pull-down resistor (typical value 1.5MΩ). |
| 8 | DVDD | power_in | Digital (low-side) power supply; decoupling is described in the Power Supply Recommendation section. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| High-side power-supply voltage AVDD to AGND | AVDD | -0.3 | 6.5 | V | over operating free-air temperature range | 4 | |
| Low-side power-supply voltage DVDD to DGND | DVDD | -0.3 | 6.5 | V | over operating free-air temperature range | 4 | |
| Input current continuous, any pin except power-supply pins | -10 | 10 | mA | Continuous | 4 | ||
| Junction temperature | TJ | 150 | °C | 4 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| High-side power supply AVDD to AGND | AVDD | 3 | 5 | 5.5 | V | over operating ambient temperature range | 5 |
| Low-side power supply DVDD to DGND | DVDD | 2.7 | 3.3 | 5.5 | V | over operating ambient temperature range | 5 |
| Differential input voltage before clipping | VClipping | -64 | 64 | mV | VIN = VINP, VINN | 5 | |
| Specified linear differential input voltage | VFSR | -50 | 50 | mV | VIN = VINP, VINN | 5 | |
| Operating common-mode input voltage | VCM | -0.032 | 1 | V | (VINP + VINN) / 2 to AGND | 5 | |
| Minimum external capacitance connected to the input from INP to INN | CIN, EXT | 10 | nF | 5 | |||
| Digital input/output voltage | VIO | 0 | V | 0 to DVDD | 5 | ||
| Input clock frequency | fCLKIN | 5 | 20 | 21 | MHz | 5 | |
| Input clock high time | tHIGH | 21.5 | 25 | 110 | ns | 5 | |
| Input clock low time | tLOW | 21.5 | 25 | 110 | ns | 5 | |
| Specified ambient temperature | TA | -40 | 125 | °C | 5 | ||
| Maximum power dissipation (both sides) | PD | 92 | mW | AVDD = DVDD = 5.5V | 7 | ||
| Maximum power dissipation (high-side) | PD1 | 38 | mW | AVDD = 5.5V | 7 | ||
| Maximum power dissipation (low-side) | PD2 | 54 | mW | DVDD = 5.5V | 7 | ||
| Input impedance | RIN | 11 | 13 | 15 | kΩ | fCLK = 10MHz | 14 |
| Input impedance | RIN | 5.5 | 6.5 | 7.5 | kΩ | fCLK = 20MHz | 14 |
| Input current | IINP | 4 | µA | VIN = (VINP, VINN) = VFSR, MAX, fCLK = 10MHz | 14 | ||
| Input current | IINP | 8 | µA | VIN = (VINP, VINN) = VFSR, MAX, fCLK = 20MHz | 14 | ||
| Input current | IINN | -4 | µA | VIN = (VINP, VINN) = VFSR, MAX, fCLK = 10MHz | 14 | ||
| Input current | IINN | -8 | µA | VIN = (VINP, VINN) = VFSR, MAX, fCLK = 20MHz | 14 | ||
| Common-mode transient immunity | CMTI | 150 | V/ns | 14 | |||
| Offset error | EO | -200 | 10 | 200 | µV | INP = INN = AGND, TA = 25°C | 14 |
| Offset error temperature drift | TCEO | -1.2 | 1.2 | µV/°C | 14 | ||
| Gain error | EG | -0.3 | 0.04 | 0.3 | % | TA = 25°C | 14 |
| Gain error temperature drift | TCEG | -50 | 20 | 50 | ppm/°C | 14 | |
| Integral nonlinearity | INL | -6 | 1 | 6 | LSB | Resolution: 16 bits | 14 |
| Differential nonlinearity | DNL | -0.99 | 0.99 | LSB | Resolution: 16 bits | 14 | |
| Common-mode rejection ratio | CMRR | -99 | dB | INP = INN, fIN = 0Hz, VCM min ≤ VIN ≤ VCM max | 14 | ||
| Common-mode rejection ratio | CMRR | -100 | dB | INP = INN, fIN from 0.1Hz to 10kHz, VCM min ≤ VIN ≤ VCM max | 14 | ||
| Power-supply rejection ratio | PSRR | -100 | dB | INP = INN = AGND, AVDD from 3.0V to 5.5V, DC | 14 | ||
| Signal-to-noise ratio | SNR | 84 | dB | fIN = 1kHz | 14 | ||
| Signal-to-noise + distortion | SINAD | 84 | dB | fIN = 1kHz | 14 | ||
| Total harmonic distortion | THD | -103 | -79 | dB | 3.0V ≤ AVDD ≤ 5.5V, fIN = 1kHz, 5MHz ≤ fCLKIN ≤ 21MHz | 14 | |
| Input current (digital input) | IIN | 0 | 7 | µA | DGND ≤ VIN ≤ DVDD | 14 | |
| Input capacitance (digital input) | CIN | 4 | pF | 14 | |||
| Low-level input voltage | VIL | -0.3 | V | 14 | |||
| Output load capacitance | CLOAD | 15 | 30 | pF | 14 | ||
| Low-level output voltage | VOL | 0.4 | V | IOL = 4mA | 15 | ||
| High-side supply current | IAVDD | 6.2 | 8 | mA | 15 | ||
| Low-side supply current | IDVDD | 4.5 | 7 | mA | CLOAD = 15pF | 15 | |
| High-side undervoltage detection threshold, AVDD rising | AVDDUV | 2.4 | 2.6 | 2.8 | V | AVDD rising | 15 |
| High-side undervoltage detection threshold, AVDD falling | AVDDUV | 1.9 | 2.05 | 2.2 | V | AVDD falling | 15 |
| Low-side undervoltage detection threshold, DVDD rising | DVDDUV | 2.3 | 2.5 | 2.7 | V | DVDD rising | 15 |
| Low-side undervoltage detection threshold, DVDD falling | DVDDUV | 1.9 | 2.05 | 2.2 | V | DVDD falling | 15 |
| DOUT hold time after rising edge of CLKIN | tH | 12 | ns | CLOAD = 15pF | 16 | ||
| Rising edge of CLKIN to DOUT valid delay | tD | 30 | ns | CLOAD = 15pF | 16 | ||
| DOUT rise time, 2.7V ≤ DVDD ≤ 3.6V | tr | 2.5 | 6 | ns | 10% to 90%, 2.7V ≤ DVDD ≤ 3.6V, CLOAD = 15pF | 16 | |
| DOUT rise time, 4.5V ≤ DVDD ≤ 5.5V | tr | 3.2 | 6 | ns | 10% to 90%, 4.5V ≤ DVDD ≤ 5.5V, CLOAD = 15pF | 16 | |
| DOUT fall time, 2.7V ≤ DVDD ≤ 3.6V | tf | 2.2 | 6 | ns | 10% to 90%, 2.7V ≤ DVDD ≤ 3.6V, CLOAD = 15pF | 16 | |
| DOUT fall time, 4.5V ≤ DVDD ≤ 5.5V | tf | 2.9 | 6 | ns | 10% to 90%, 4.5V ≤ DVDD ≤ 5.5V, CLOAD = 15pF | 16 | |
| Junction-to-ambient thermal resistance (DWV) | RθJA | 102.8 | °C/W | 7 | |||
| Junction-to-case (top) thermal resistance (DWV) | RθJC(top) | 45.1 | °C/W | 7 | |||
| Junction-to-board thermal resistance (DWV) | RθJB | 63 | °C/W | 7 |
CAD (KiCad official)
- Symbol:
AMC0306M05DWVR - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
amc0306m05dwvr-etched.step/amc0306m05dwvr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);amc0306m05dwvr.step/amc0306m05dwvr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (47 pp, sha256
be9ea643dbdb34c7, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).