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AMC0236DR

Texas Instruments · IC · SOIC-8

AMC0236DR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 AVDD power_in High-side analog power supply, 3V to 5.5V relative to AGND (absolute max 6.5V); see Power Supply Recommendations for decoupling.
2 INP input Noninverting analog input with linear range ±1V (VINP - VSNSN); connect a 10nF filter capacitor from INP to SNSN.
3 SNSN input AGND sense pin and inverting input to the modulator; connect to AGND.
4 AGND power_in High-side (analog) ground.
5 DGND power_in Low-side (digital) ground.
6 DOUT output Modulator data output bitstream synchronized to CLKIN, referenced to DGND with range DGND - 0.5V to DVDD + 0.5V.
7 CLKIN input Modulator clock input, 5MHz to 11MHz, with internal pulldown resistor (typical value: 1.5MΩ).
8 DVDD power_in Low-side digital power supply, 2.7V to 5.5V relative to DGND (absolute max 6.5V); see Power Supply Recommendations for decoupling.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8
Category
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
High-side power supply AVDD 3 5 5.5 V AVDD to AGND 4
Low-side power supply DVDD 2.7 3.3 5.5 V DVDD to DGND 4
Input voltage before clipping output VClipping 1.25 V VIN = VINP, VSNSN, ±1.25 V 4
Specified linear differential input voltage VFSR -1 1 V VIN = VINP, VSNSN 4
Digital input/output voltage VIO 0 V 0 to DVDD 4
Input clock frequency fCLKIN 5 10 11 MHz 4
Input clock high time tHIGH 40 50 110 ns 4
Input clock low time tLOW 40 50 110 ns 4
Specified ambient temperature TA -40 125 °C 4
High-side power supply voltage AVDD to AGND -0.3 6.5 V 4
Low-side power supply voltage DVDD to DGND -0.3 6.5 V 4
Analog input voltage INP, SNSN to AGND -3 0.5 V Min is AGND, 3, max is AVDD + 0.5 4
Digital input voltage CLKIN to DGND -0.5 0.5 V Min is DGND, 0.5, max is DVDD + 0.5 4
Digital output voltage DOUT to DGND -0.5 0.5 V Min is DGND, 0.5, max is DVDD + 0.5 4
Input current -10 10 mA Continuous, any pin except power-supply pins 4
Junction temperature TJ 150 °C 4
Storage temperature Tstg -65 150 °C 4
Input resistance RIN 0.05 2.4 GΩ INP pin to AGND, SNSN = AGND 10
Input bias current IIB -10 3 10 nA INP pin, INP = AGND 10
Common-mode transient immunity CMTI 150 V/ns 10
Offset error EO -0.9 0.1 0.9 mV TA = 25°C, INP = AGND 10
Offset error temperature drift TCEO 3 6.5 µV/°C 10
Gain error EG -0.25 0.02 0.25 % Initial, at TA = 25°C, VINP = 1V or VINP = -1V 10
Gain error temperature drift TCEG -35 10 35 ppm/°C 10
Integral nonlinearity INL -6 1 6 LSB Resolution: 16 bits 10
Differential nonlinearity DNL -0.99 0.99 LSB Resolution: 16 bits 10
Signal-to-noise ratio SNR 84.5 89 dB VIN = 2VPP, fIN = 1kHz 10
Signal-to-noise + distortion SINAD 77 88 dB VIN = 2VPP, fIN = 1kHz 10
Total harmonic distortion THD -91 -80 dB VIN = 2VPP, fIN = 1kHz 10
Input current (digital) IIN 7 µA DGND ≤ VIN ≤ DVDD 10
High-level input voltage VIH 0.7 0.3 V Min 0.7 x DVDD, max DVDD + 0.3 10
Low-level input voltage VIL -0.3 0.3 V Max is 0.3 x DVDD 10
Output load capacitance CLOAD 15 30 pF fCLKIN = 10MHz 10
High-level output voltage VOH -0.4 V IOH = -4mA, min is DVDD, 0.4 10
Low-level output voltage VOL 0.4 V IOL = 4mA 10
High-side supply current IAVDD 5.3 7 mA 10
Low-side supply current IDVDD 3.6 5 mA CLOAD = 15pF 10
High-side undervoltage detection threshold, rising AVDDUV 2.4 2.6 2.8 V AVDD rising 10
High-side undervoltage detection threshold, falling AVDDUV 1.9 2.05 2.2 V AVDD falling 10
Low-side undervoltage detection threshold, rising DVDDUV 2.3 2.5 2.7 V DVDD rising 10
Low-side undervoltage detection threshold, falling DVDDUV 1.9 2.05 2.2 V DVDD falling 10
DOUT hold time after rising edge of CLKIN tH 10 ns CLOAD = 15pF 11
Rising edge of CLKIN to DOUT valid delay tD 35 ns CLOAD = 15pF 11
DOUT rise time tr 2.5 6 ns 10% to 90%, 2.7V ≤ DVDD ≤ 3.6V, CLOAD = 15pF 11
DOUT rise time tr 3.2 6 ns 10% to 90%, 4.5V ≤ DVDD ≤ 5.5V, CLOAD = 15pF 11
DOUT fall time tf 2.2 6 ns 10% to 90%, 2.7V ≤ DVDD ≤ 3.6V, CLOAD = 15pF 11
DOUT fall time tf 2.9 6 ns 10% to 90%, 4.5V ≤ DVDD ≤ 5.5V, CLOAD = 15pF 11
Device start-up time tSTART 30 µs AVDD step from 0 to 3.0V with DVDD ≥ 2.7V to bitstream valid, 0.1% settling 11
Junction-to-ambient thermal resistance RθJA 116.5 °C/W D (SOIC) 8 pins 5
Junction-to-case (top) thermal resistance RθJC(top) 52.8 °C/W D (SOIC) 8 pins 5
Junction-to-board thermal resistance RθJB 58.9 °C/W D (SOIC) 8 pins 5
Maximum power dissipation (both sides) PD 67 mW AVDD = DVDD = 5.5V 5
ESD HBM V(ESD) -2000 2000 V Human-body model, ANSI/ESDA/JEDEC JS-001 4
ESD CDM V(ESD) -1000 1000 V Charged-device model, ANSI/ESDA/JEDEC JS-002 4

CAD (KiCad official)

  • Symbol: AMC0236DR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: amc0236dr-etched.step / amc0236dr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); amc0236dr.step / amc0236dr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (44 pp, sha256 55949af4529f2820, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF