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AM3401RA-VB

VBsemi Elec · MOSFETs · SOT-23(TO-236)

AM3401RA-VB from VBsemi Elec, in a SOT-23(TO-236). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 G input Gate of the P-channel MOSFET; the datasheet rates the gate-source voltage at ±20 V (VGS).
2 S passive Source of the P-channel MOSFET; the device is rated for a drain-source voltage of -30 V (VDS).
3 D passive Drain of the P-channel MOSFET; continuous drain current is rated at -5.6 A (ID, TC = 25 °C), with pulsed drain current of -18 A (t = 100 µs).

Key specifications

Parameter Value
Manufacturer VBsemi Elec
Package SOT-23(TO-236)
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -30 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID -5.6 A TC = 25 °C (TJ = 150 °C) 1
Continuous Drain Current ID -5.4 A TA = 25 °C 1
Continuous Drain Current ID -4.3 A TA = 70 °C 1
Pulsed Drain Current IDM -18 A t = 100 µs 1
Continuous Source-Drain Diode Current IS -2.1 A TC = 25 °C 1
Continuous Source-Drain Diode Current IS -1 A TA = 25 °C 1
Maximum Power Dissipation PD 2.5 W TC = 25 °C 1
Maximum Power Dissipation PD 1.6 W TC = 70 °C 1
Maximum Power Dissipation PD 1.25 W TA = 25 °C 1
Maximum Power Dissipation PD 0.8 W TA = 70 °C 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 150 °C 1
Maximum Junction-to-Ambient RthJA 75 100 °C/W t = 5 s 1
Maximum Junction-to-Ambient steady state RthJA 166 °C/W Steady state (note d) 1
Maximum Junction-to-Foot (Drain) Steady State RthJF 40 50 °C/W Steady state 1
Drain-Source Breakdown Voltage VDS -30 V VGS = 0 V, ID = -250 µA 2
Gate-Source Threshold Voltage VGS(th) -0.5 -2 V VDS = VGS, ID = -250 µA 2
Gate-Source Leakage IGSS -100 100 nA VDS = 0 V, VGS = ±20 V 2
Zero Gate Voltage Drain Current IDSS -1 µA VDS = -30 V, VGS = 0 V 2
Zero Gate Voltage Drain Current IDSS -5 µA VDS = -30 V, VGS = 0 V, TJ = 55 °C 2
On-State Drain Current ID(on) -2.5 A VDS -5 V, VGS = -10 V 2
Body Diode Voltage VSD -0.8 -1.2 V IS = -4.3 A, VGS 0 V 2
Pulse Diode Forward Current ISM -80 A t = 100 µs 2
Continuous Source-Drain Diode Current IS -2.1 A TC = 25 °C 2
Gate Resistance Rg 1.5 7.7 15.4 Ω f = 1 MHz 2
Total Gate Charge Qg 24 36 nC VDS = -15 V, VGS = -10 V, ID = -5.4 A 2
Total Gate Charge Qg 11.4 17 nC VDS = -15 V, VGS = -4.5 V, ID = -5.4 A 2
Reverse Recovery Time trr 15 23 ns IF = -4.3 A, dI/dt = 100 A/µs, TJ = 25 °C 2
Body Diode Reverse Recovery Charge Qrr 7 14 nC IF = -4.3 A, dI/dt = 100 A/µs, TJ = 25 °C 2
Drain-Source On-State Resistance RDS(on) 0.046 Ω VGS = -10 V, ID = -4.4 A 2
Drain-Source On-State Resistance RDS(on) 0.049 Ω VGS = -6 V, ID = -4 A 2
Drain-Source On-State Resistance RDS(on) 0.054 Ω VGS = -4.5 V, ID = -3.6 A 2
Forward Transconductance gfs 18 S VDS = -15 V, ID = -3.4 A 2
Gate-Source Charge Qgs 3.4 nC 2
Gate-Drain Charge Qgd 3.8 nC 2
Turn-On Delay Time td(on) 13 20 ns VDD = -15 V, RL = 3.5 Ω, ID -4.3 A, VGEN = -10 V, Rg = 1 Ω 2
Rise Time tr 48 ns VDD = -15 V, RL = 3.5 Ω, ID -4.3 A, VGEN = -10 V, Rg = 1 Ω 2
Turn-Off Delay Time td(off) 38 57 ns VDD = -15 V, RL = 3.5 Ω, ID -4.3 A, VGEN = -10 V, Rg = 1 Ω 2
Fall Time tf 6 12 ns VDD = -15 V, RL = 3.5 Ω, ID -4.3 A, VGEN = -10 V, Rg = 1 Ω 2
Turn-On Delay Time td(on) 28 42 ns VDD = -15 V, RL = 3.5 Ω, ID -4.3 A, VGEN = -4.5 V, Rg = 1 Ω 2
Rise Time tr 16 24 ns VDD = -15 V, RL = 3.5 Ω, ID -4.3 A, VGEN = -4.5 V, Rg = 1 Ω 2
Turn-Off Delay Time td(off) 30 45 ns VDD = -15 V, RL = 3.5 Ω, ID -4.3 A, VGEN = -4.5 V, Rg = 1 Ω 2
Fall Time tf 10 20 ns VDD = -15 V, RL = 3.5 Ω, ID -4.3 A, VGEN = -4.5 V, Rg = 1 Ω 2
Reverse Recovery Fall Time ta 8 ns 2
Reverse Recovery Rise Time tb 7 ns 2

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: AM3401RA-VB
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23(TO-236), generated on the KiCad land (body 1.3 x 2.92 mm, terminals on the pads, 1.0050000000000001 mm tall, datasheet A, midpoint of min and max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: am3401ra-vb-etched.step / am3401ra-vb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); am3401ra-vb.step / am3401ra-vb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: VBsemi Elec datasheet (9 pp, sha256 9b740017bcd80be7, retrieved 2026-11-13, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF