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AM26C31IDR

Public Made by Adom

by adom

Texas Instruments Buffer/Driver/Transceiver, SOIC-16. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs am26c31idr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
viewers pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray 2mo ago
am26c31idr-etched.fit.json am26c31idr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
am26c31idr-etched.glb am26c31idr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
am26c31idr-etched.step am26c31idr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
am26c31idr.glb Publish 0.1.0 · Ray 2mo ago
am26c31idr.kicad_mod Publish 0.1.0 · Ray 2mo ago
am26c31idr.kicad_sym Publish 0.1.0 · Ray 2mo ago
am26c31idr.lbr rebuild the library on adom-lbr 2.32.0. The published copy was built by 2.18.0, which imported every KiCad roundrect an… · Ray 2mo ago
am26c31idr.step Publish 0.1.0 · Ray 2mo ago
package.json Publish 0.2.0 · Ray 2mo ago
pads.json pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray 2mo ago
page.json am26c31idr: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding) · Ray 1mo ago
README.md am26c31idr: laser-etched CAD + chip hero (factory 2.0.0 backfill) · Ray 1mo ago

AM26C31IDR

Texas Instruments · Buffer/Driver/Transceiver · SOIC-16

AM26C31IDR from Texas Instruments, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1A input Driver 1 single-ended input. TTL/CMOS-compatible logic input (VIH ≥ 2 V, VIL ≤ 0.8 V) that drives the differential 1Y/1Z output pair.
2 1Y tri_state Driver 1 non-inverting differential output. 3-state output capable of ±20 mA drive into a 100 Ω line; forced to high-impedance when the driver is disabled via the enable pins.
3 1Z tri_state Driver 1 inverted differential output. 3-state complementary output paired with 1Y; goes high-impedance when disabled.
4 G input Active-high output enable, common to all four drivers. When G=H and G-bar=L, all Y/Z outputs are active; otherwise outputs are placed in the high-impedance state.
5 2Z tri_state Driver 2 inverted differential output. 3-state complementary output paired with 2Y.
6 2Y tri_state Driver 2 non-inverting differential output. 3-state output paired with 2Z; capable of ±20 mA into a 100 Ω line.
7 2A input Driver 2 single-ended TTL/CMOS input driving the differential 2Y/2Z output pair.
8 GND power_in Device ground reference (0 V). All voltages are referenced to this network ground terminal.
9 3A input Driver 3 single-ended TTL/CMOS input driving the differential 3Y/3Z output pair.
10 3Y tri_state Driver 3 non-inverting differential output. 3-state output paired with 3Z.
11 3Z tri_state Driver 3 inverted differential output. 3-state complementary output paired with 3Y.
12 G input Active-low output enable (G-bar), common to all four drivers. Must be LOW (and G HIGH) for outputs to be active; otherwise outputs go to high-impedance.
13 4Z tri_state Driver 4 inverted differential output. 3-state complementary output paired with 4Y.
14 4Y tri_state Driver 4 non-inverting differential output. 3-state output paired with 4Z.
15 4A input Driver 4 single-ended TTL/CMOS input driving the differential 4Y/4Z output pair.
16 VCC power_in Positive supply voltage, 4.5 V to 5.5 V (5 V nominal). ICC ≈ 100 µA typical; bypass to GND with a 0.1 µF capacitor close to the pin.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-16
Category Logic
Pins 16

Ordering variants

Same part, different packaging or reel option.

  • AM26C31IDRD
  • AM26C31IDR
  • AM26C31IDRIDG4
  • AM26C31IDRDB
  • AM26C31IDRPW
  • AM26C31IDRNS
  • AM26C31IDRN
  • AM26C31IDRJ
  • AM26C31IDRW
  • AM26C31IDRFK

CAD (KiCad official)

  • Symbol: AM26C31IDR
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: am26c31idr-etched.step / am26c31idr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); am26c31idr.step / am26c31idr.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
am26c31idr.step 217 KB You want the bare part, or you mark your own boards.
am26c31idr-etched.step 2.5 MB You want the part with AM26C31IDR already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 623 faces against 267 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (39 pp, sha256 c5ab343a1319884d, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF