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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
Name Last commit message Last updated
docs al8843sp-13: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
viewers pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray 2mo ago
al8843sp-13-etched.fit.json al8843sp-13: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
al8843sp-13-etched.glb al8843sp-13: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
al8843sp-13-etched.step al8843sp-13: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
al8843sp-13.glb fix footprint: SOIC-8_3.9x4.9mm_P1.27mm -> Diodes_SO-8EP (ep_dropped, 8 pins; datasheet EP 3.502x2.613mm, land 2.613x3.… · Ray 2mo ago
al8843sp-13.kicad_mod fix footprint: SOIC-8_3.9x4.9mm_P1.27mm -> Diodes_SO-8EP (ep_dropped, 8 pins; datasheet EP 3.502x2.613mm, land 2.613x3.… · Ray 2mo ago
al8843sp-13.kicad_sym add symbol pin "9" for the exposed thermal pad: the footprint carries the pad and the symbol had none, so it reached no… · Ray 2mo ago
al8843sp-13.lbr rebuild the library on adom-lbr 2.32.0. The published copy was built by 2.18.0, which imported every KiCad roundrect an… · Ray 2mo ago
al8843sp-13.step fix footprint: Diodes_SO-8EP -> Diodes_SO-8EP (3d refresh; body regenerated from the footprint F.Fab outline) · Ray 2mo ago
package.json Publish 0.2.0 · Ray 2mo ago
pads.json page.json: renumber the datasheet exposed-pad entry onto its footprint pad (EP -> 9) so one pad has one description · Ray 2mo ago
page.json al8843sp-13: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding) · Ray 1mo ago
README.md al8843sp-13: laser-etched CAD + chip hero (factory 2.0.0 backfill) · Ray 1mo ago

AL8843SP-13

Diodes Incorporated · LED Drivers · SO-8-EP

AL8843SP-13 from Diodes Incorporated, in a SO-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground of IC. Tie to system ground plane; internally connected to pin 2 and exposed pad.
2 GND power_in Ground of IC. Tie to system ground plane; internally connected to pin 1 and exposed pad.
3 SET input Set nominal output current pin. Connect resistor R_SET from this pin to VIN to define the nominal average output current. Mean current-sense threshold V_SET typ 100mV (96-104mV) with respect to VIN; I_SET typ 8µA.
4 NC unconnected No connection. Leave floating or tie to ground for best noise immunity.
5 CTRL input Multi-function On/Off and brightness control input. Leave floating for normal operation. Drive below 0.3V to shut down the power switch. Analog dim by applying 0.4V-2.5V DC (10%-100% of I_OUT_NOM); >2.6V gives 100%. Accepts PWM (low <0.3V, high >2.6V, edges <1µs). A capacitor from CTRL to GND increases soft-start time (default t_SS ≈ 0.1ms; adds ~1.5ms/nF).
6 VIN power_in Input supply voltage, 4.5V to 40V (abs max 42V). Decouple to ground with a 10µF or higher X7R ceramic capacitor placed close to the device. UVLO rising typ 3.9V with 250mV hysteresis.
7 SW output Switch node - drain of the internal 40V NDMOS high-side switch (R_ON typ 0.2Ω). Connect the inductor and freewheeling Schottky diode here, minimizing track length to reduce EMI. Internally tied to pin 8.
8 SW output Switch node - drain of the internal 40V NDMOS high-side switch. Connect the inductor and freewheeling Schottky diode here, minimizing track length to reduce EMI. Internally tied to pin 7.
EP EP power_in Exposed pad / thermal tab. Connects to GND and to the PCB thermal mass for enhanced thermal impedance. Solder to a copper pour tied to ground.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SO-8-EP
Category LED-drv
Pins 9

Ordering variants

Same part, different packaging or reel option.

  • AL8843SP-13

CAD (KiCad official)

  • Symbol: AL8843SP-13
  • Footprint: Package_SO:Diodes_SO-8EP
  • 3D model: SO-8-EP (KiCad packages3D, STEP)
  • 3D model files: al8843sp-13-etched.step / al8843sp-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); al8843sp-13.step / al8843sp-13.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
al8843sp-13.step 194 KB You want the bare part, or you mark your own boards.
al8843sp-13-etched.step 2.1 MB You want the part with AL8843SP-13 already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 527 faces against 63 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (16 pp, sha256 b544c47b8437fba0, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF