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page.json: renumber the datasheet exposed-pad entry onto its footprint pad (EP -> 9) so one pad has one description

Ray ·a30dd2c475 ·2mo ago ·parent e1974e7
2 files changed +6−12
pads.json+2−2
@@ -292,9 +292,9 @@    ],    "thermal": true,    "pin": "9",-   "name": "EXPOSED PAD",+   "name": "EP",    "type": "power_in",-   "description": "Exposed thermal pad. Present in the package land pattern; connect it per the manufacturer datasheet thermal recommendation. Added because the footprint carries this pad and the symbol had no pin for it.",+   "description": "Exposed pad / thermal tab. Connects to GND and to the PCB thermal mass for enhanced thermal impedance. Solder to a copper pour tied to ground.",    "is_pin1": false,    "source": {     "geometry": "Diodes_SO-8EP.kicad_mod",
page.json+4−10
@@ -15,7 +15,7 @@     "mpn": "AL8843SP-13",     "manufacturer": "Diodes Incorporated",     "package": "SO-8-EP",-    "pin_count": 10,+    "pin_count": 9,     "category": "LED-drv",     "subcategory": "LED Drivers",     "datasheet": "https://www.diodes.com/assets/Datasheets/AL8843SP-13.pdf",@@ -76,18 +76,12 @@         "type": "output",         "description": "Switch node - drain of the internal 40V NDMOS high-side switch. Connect the inductor and freewheeling Schottky diode here, minimizing track length to reduce EMI. Internally tied to pin 7."       },-      {-        "number": "EP",-        "name": "EP",-        "type": "power_in",-        "description": "Exposed pad / thermal tab. Connects to GND and to the PCB thermal mass for enhanced thermal impedance. Solder to a copper pour tied to ground."-      },       {         "number": "9",-        "name": "EXPOSED PAD",+        "name": "EP",         "type": "power_in",-        "description": "Exposed thermal pad. Present in the package land pattern; connect it per the manufacturer datasheet thermal recommendation. Added because the footprint carries this pad and the symbol had no pin for it.",-        "source": "derived-from-footprint"+        "description": "Exposed pad / thermal tab. Connects to GND and to the PCB thermal mass for enhanced thermal impedance. Solder to a copper pour tied to ground.",+        "source": "renumbered-to-footprint-pad"       }     ],     "provenance": {