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Contents

README

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AL5871QT16E-13

Diodes Incorporated · LED Drivers · TSSOP-16-EP

AL5871QT16E-13 from Diodes Incorporated, in a TSSOP-16-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Power supply for the LED driver, 5V to 55V recommended operating range (65V absolute maximum).
2 NC unconnected No connection.
3 PWM input PWM signal input, internally pulled down; high above 1.4V enables, low below 0.4V disables, and standby is entered after PWM stays low about 25ms.
4 NC unconnected No connection.
5 NC unconnected No connection.
6 GND power_in Ground for the LED driver.
7 NC unconnected No connection.
8 NC unconnected No connection.
9 NC unconnected No connection.
10 NC unconnected No connection.
11 LED passive Connect to the LED string cathode; current sink regulating up to 750mA, rated -0.3V to 65V.
12 NC unconnected No connection.
13 DEN input Enable for LED open-circuit detection (enabled above 1.2V, disabled below 1.1V) and thermal fold-back (enabled above 0.3V, disabled below 0.2V).
14 REF passive Reference current setting pin; a resistor RREF to ground sets LED current (ILED = 12000 x VREF/RREF, 24kΩ gives 750mA).
15 ADIM input Analog dimming input, driven with DC voltage 0.3V to 1.5V; LED current shuts off below 0.15V.
16 FAULTB bidirectional Open-drain fault report asserted low on UVLO, OTP, LED open or LED short conditions, with internal pullup and input detection for bus sharing.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package TSSOP-16-EP
Category LED Drivers
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VIN UVLO Voltage VVIN_UVLO 4.75 5 5.25 V VVIN Rising 4
PWM Logic Low Voltage VIL_PWM 0.4 V 4
PWM Logic High Voltage VIH_PWM 1.4 V 4
PWM Internal Pulldown IPWM_PD 0.35 3.5 μA VPWM = 5V 4
Entrance Time for Standby Mode When PWM is Low tPWM_SHDN 15 25 ms 4
Voltage Range on ADIM Pin For Analog Dimming VADIM 0.3 1.5 V 4
DC Voltage on ADIM Pin for Analog Dimming On VADIM_ON 0.35 V VADIM Rising 4
DC Voltage on ADIM Pin for Analog Dimming Off VADIM_OFF 0.15 V VADIM Falling 4
ADIM Sourcing Current IADIM 19 20 22 µA 4
Base Reference Voltage VREF 1.47 1.5 1.53 V 4
LED Pin Leakage Current ILED_LEAK 0.1 5 μA VPWM = 0V, VLED = 12V 4
LED Current Accuracy ILED_ACCURACY -4 4 % RREF = 48kΩ 4
FAULTB Output Low Voltage VFOL 600 mV IFAULTB = 1mA 4
FAULTB Leakage Current IF_LKG 5 μA VFAULTB = 5V 4
VIN UVLO Hysteresis VVIN_UVLO_HYS 300 mV VVIN Falling 4
Input Current in Standby Mode IVIN_Standby 300 µA Standby Mode, PWM is “L” for 7ms 4
Input Current in Normal Mode IDVCC_Q 0.7 mA Enabled, LED Pin Floating, PWM is “H”, RSET is 48kΩ 4
Regulation Current ILED_NOM 375 mA RREF = 48kΩ 4
Minimum LED Regulation Voltage VLED_REG 0.2 V ILED = 125mA 4
FAULTB Pullup Current IF_PULLUP 500 μA VFAULTB = 1.6V 4
FAULTB Pullup Voltage VF_PULLUP 3 V Fault Pin Floating 4
Thermal Shutdown Threshold TSHDN 160 ℃ 4
Thermal Recovery Threshold TREC 130 ℃ 4
Input Voltage Relative to GND VVIN 5 55 V 3
PWM Frequency fPWM 0.2 1 kHz 3
LED Output Current ILED 0 750 mA 3
High-Level Input Voltage on PWM VIH 1.4 5.5 V 3
Low-Level Input Voltage on PWM VIL 0 0.4 V 3
Operating Junction Temperature TJ -40 150 °C 3
Operating Ambient Temperature TA -40 125 °C 3
Input Voltage Relative to GND VVIN -0.3 65 V 3
LED, DEN, PWM and FAULTB Voltage Relative to GND VLED, VDEN, VPWM, VFAULTB -0.3 65 V 3
REF and ADIM Voltage Relative to GND VREF, VADIM -0.3 6 V 3
Operating Junction Temperature TJ -40 150 °C 3
Storage Temperature TST -55 150 °C 3
Human-Body Model (HBM) 2000 V 3
Charged-Device Model (CDM) 1000 V 3
Junction-to-Ambient Thermal Resistance θJA 42.7 °C/W Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane 3
Junction-to-Case (Top) Thermal Resistance θJC 3.4 °C/W Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Finish, Matte Tin Plated Leads, Solderable per JESD22-B102  Weight: 0.055 grams (Approximate) 14

CAD (KiCad official)

  • Symbol: AL5871QT16E-13
  • Footprint: Package_SO:TSSOP-16-1EP_4.4x5mm_P0.65mm
  • 3D model: TSSOP-16-EP (KiCad packages3D, STEP)
  • 3D model files: al5871qt16e-13-etched.step / al5871qt16e-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); al5871qt16e-13.step / al5871qt16e-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (15 pp, sha256 7c0ad244f9a165ff, retrieved 2026-10-26, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF