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AiP74LVC1T45GC363.TR

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Wuxi I-core Elec Buffer/Driver/Transceiver, SOT-363. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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AiP74LVC1T45GC363.TR

Wuxi I-core Elec · Buffer/Driver/Transceiver · SOT-363

AiP74LVC1T45GC363.TR from Wuxi I-core Elec, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC(A) power_in Supply voltage A for port A and DIR, operating range 1.2 V to 5.5 V.
2 GND power_in Ground (0 V).
3 A bidirectional Data input or output port A, referenced to VCC(A); inputs accept voltages up to 5.5 V.
4 B bidirectional Data input or output port B, referenced to VCC(B); inputs accept voltages up to 5.5 V.
5 DIR input Direction control referenced to VCC(A); HIGH allows A to B transmission and LOW allows B to A transmission.
6 VCC(B) power_in Supply voltage B for port B, operating range 1.2 V to 5.5 V.

Key specifications

Parameter Value
Manufacturer Wuxi I-core Elec
Package SOT-363
Category Logic ICs
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
supply voltage A VCC(A) -0.5 6.5 V 5
supply voltage B VCC(B) -0.5 6.5 V 5
input clamping current VIK -50 mA VI<0V 5
input voltage VI -0.5 6.5 V 5
output clamping current IOK -50 mA VO<0V 5
output voltage, suspend or 3-state mode VO -0.5 6.5 V Suspend or 3-state mode 5
output current IO -50 50 mA VO=0V to VCCO 5
supply current ICC 100 mA ICC(A) or ICC(B) 5
ground current IGND -100 mA 5
storage temperature Tstg -65 150 ℃ 5
total power dissipation Ptot 250 mW Tamb=-40℃ to +105℃ 5
soldering temperature TL 250 ℃ 10s 5
supply voltage A VCC(A) 1.2 5.5 V 6
supply voltage B VCC(B) 1.2 5.5 V 6
input voltage VI 0 5.5 V 6
output voltage, suspend or 3-state mode VO 0 5.5 V Suspend or 3-state mode 6
ambient temperature Tamb -40 105 ℃ 6
input transition rise and fall rate Δt/ΔV 20 ns/V VCCI=1.2V 6
input transition rise and fall rate Δt/ΔV 10 ns/V VCCI=3V to 3.6V 6
input transition rise and fall rate Δt/ΔV 5 ns/V VCCI=4.5V to 5.5V 6
HIGH-level input voltage, data input VIH 2 V data input; VCCI=3.0V to 3.6V 9
LOW-level input voltage, data input VIL 0.8 V data input; VCCI=3.0V to 3.6V 9
HIGH-level output voltage VOH 1 V VI=VIH; IO=-6mA; VCCO=1.4V 9
HIGH-level output voltage VOH 1.2 V VI=VIH; IO=-8mA; VCCO=1.65V 9
HIGH-level output voltage VOH 1.9 V VI=VIH; IO=-12mA; VCCO=2.3V 9
HIGH-level output voltage VOH 2.4 V VI=VIH; IO=-24mA; VCCO=3.0V 9
HIGH-level output voltage VOH 3.8 V VI=VIH; IO=-32mA; VCCO=4.5V 9
LOW-level output voltage VOL 0.1 V VI=VIH; IO=100uA; VCCO=1.2V to 4.5V 9
LOW-level output voltage VOL 0.3 V VI=VIH; IO=6mA; VCCO=1.4V 9
LOW-level output voltage VOL 0.45 V VI=VIH; IO=8mA; VCCO=1.65V 9
LOW-level output voltage VOL 0.55 V VI=VIH; IO=24mA; VCCO=3.0V 9
input leakage current II -2 2 uA DIR input; VI=0V to 5.5V; VCCI=1.2V to 5.5V 10
OFF-state output current IOZ -10 10 uA A or B port; VO=0V or VCCO; VCCO=1.2V to 5.5V 10
power-off leakage current A port IOFF -10 10 uA A port; VI or VO=0V to 5.5V; VCC(A)=0V; VCC(B)=1.2V to 5.5V 10
power-off leakage current B port IOFF -10 10 uA B port; VI or VO=0V to 5.5V; VCC(B)=0V; VCC(A)=1.2V to 5.5V 10
supply current A port ICC 8 uA A port; VI=0V or VCCI; IO=0A; VCC(A), VCC(B)=1.2V to 5.5V 10
supply current A port ICC 3 uA A port; VI=0V or VCCI; IO=0A; VCC(A), VCC(B)=1.65V to 5.5V 10
supply current A port ICC 2 uA A port; VI=0V or VCCI; IO=0A; VCC(A)=5.5V; VCC(B)=0V 10
supply current B port ICC 8 uA B port; VI=0V or VCCI; IO=0A; VCC(A), VCC(B)=1.2V to 5.5V 10
supply current B port ICC 3 uA B port; VI=0V or VCCI; IO=0A; VCC(A), VCC(B)=1.65V to 5.5V 10
supply current A plus B port ICC(A)+ICC(B) 16 uA IO=0A; VI=0V or VCCI; VCC(A), VCC(B)=1.2V to 5.5V 10
supply current A plus B port ICC(A)+ICC(B) 4 uA IO=0A; VI=0V or VCCI; VCC(A), VCC(B)=1.65V to 5.5V 10
additional supply current A port ΔICC 75 uA per input; VCC(A), VCC(B)=3.0V to 5.5V; A port at VCC(A)-0.6V; DIR at VCC(A); B port=open 10
additional supply current DIR input ΔICC 75 uA per input; VCC(A), VCC(B)=3.0V to 5.5V; DIR at VCC(A)-0.6V; A port at VCC(A) or GND; B port=open 10
additional supply current B port ΔICC 75 uA per input; VCC(A), VCC(B)=3.0V to 5.5V; B port at VCC(B)-0.6V; DIR at GND; A port=open 11
input capacitance CI 2.2 pF DIR input; VI=0V or 3.3V; VCC(A)=VCC(B)=3.3V 6
input/output capacitance CI/O 6 pF A and B port; suspend mode; VO=3.3V or 0V; VCC(A)=VCC(B)=3.3V 6
propagation delay LOW to HIGH A to B tPLH 2 18.9 ns Tamb=-40℃ to +105℃; VCC(A)=3.0V to 3.6V; VCC(B)=1.5V±0.1V; A to B 16
propagation delay HIGH to LOW A to B tPHL 1.9 17.2 ns Tamb=-40℃ to +105℃; VCC(A)=3.0V to 3.6V; VCC(B)=1.5V±0.1V; A to B 16

CAD (KiCad official)

  • Symbol: AiP74LVC1T45GC363.TR
  • Footprint: Package_TO_SOT_SMD:SOT-363_SC-70-6
  • 3D model: SOT-363 (KiCad packages3D, STEP)
  • 3D model files: aip74lvc1t45gc363-tr-etched.step / aip74lvc1t45gc363-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); aip74lvc1t45gc363-tr.step / aip74lvc1t45gc363-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi I-core Elec datasheet (30 pp, sha256 9c56c769a302ac80, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF