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AIP74HC244SA.TB

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Wuxi I-core Elec Buffer/Driver/Transceiver, SOP-20-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentlogic icsaip74hc244sa.tbfactory-2.0.0extractor-text

Verified AIP74HC244SA.TB

by Ray · last 30 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

30 Oct 2026RayPublished by the parts factory: tier lcsc, 20 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: AIP74HC244SA.TB · SOP-20-300mil · 20 pins
  • ✓copper: 20 copper pads, none touching another net
  • ✓datasheet: all 20 pin names found in the 16-page datasheet
  • •distributor (warn): no ['digikey', 'mouser'] number
  • ✓family: SOP-20_7.5x12.8mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-jh9_qrry/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): the datasheet dimensions give no height or body size to compare (datasheet p.3)
  • ✓pads: 20 pins = 20 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 20 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ aip74hc244sa-tb.kicad_sym✓ aip74hc244sa-tb.kicad_mod✓ aip74hc244sa-tb.step
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Ray Publish 0.1.0 f8b1d89 1d ago

AIP74HC244SA.TB

Wuxi I-core Elec · Buffer/Driver/Transceiver · SOP-20-300mil

AIP74HC244SA.TB from Wuxi I-core Elec, in a SOP-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1OE input Output enable input for the 1Y outputs, active LOW; a HIGH puts them in high-impedance OFF-state.
2 1A0 input Data input 0 of bank 1.
3 2Y0 tri_state Bus output 0 of bank 2 (3-state, non-inverting).
4 1A1 input Data input 1 of bank 1.
5 2Y1 tri_state Bus output 1 of bank 2 (3-state, non-inverting).
6 1A2 input Data input 2 of bank 1.
7 2Y2 tri_state Bus output 2 of bank 2 (3-state, non-inverting).
8 1A3 input Data input 3 of bank 1.
9 2Y3 tri_state Bus output 3 of bank 2 (3-state, non-inverting).
10 GND power_in Ground (0 V).
11 2A3 input Data input 3 of bank 2.
12 1Y3 tri_state Bus output 3 of bank 1 (3-state, non-inverting).
13 2A2 input Data input 2 of bank 2.
14 1Y2 tri_state Bus output 2 of bank 1 (3-state, non-inverting).
15 2A1 input Data input 1 of bank 2.
16 1Y1 tri_state Bus output 1 of bank 1 (3-state, non-inverting).
17 2A0 input Data input 0 of bank 2.
18 1Y0 tri_state Bus output 0 of bank 1 (3-state, non-inverting).
19 2OE input Output enable input for the 2Y outputs, active LOW; a HIGH puts them in high-impedance OFF-state.
20 VCC power_in Supply voltage, 2.0 V to 6.0 V for AiP74HC244 (absolute maximum 7.0 V).

Key specifications

Parameter Value
Manufacturer Wuxi I-core Elec
Package SOP-20-300mil
Category Logic ICs
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC -0.5 7 V 6
Input clamping current IIK 20 mA VI < -0.5V or VI > VCC+0.5V; printed ±20 6
Output clamping current IOK 20 mA VO < -0.5V or VO > VCC+0.5V; printed ±20 6
Output current IO 35 mA -0.5V < VO < VCC+0.5V; printed ±35 6
Supply current ICC 70 mA 6
Ground current IGND -70 mA 6
Storage temperature Tstg -65 150 ℃ 6
Total power dissipation Ptot 500 mW SOP20: above 70℃ derates linearly with 8mW/K 6
Soldering temperature TL 250 ℃ 10s, SOP 6
Supply voltage VCC 2 5 6 V AiP74HC244 6
Input transition rise and fall rate Δt/ΔV 625 ns/V VCC=2.0V 6
Input transition rise and fall rate Δt/ΔV 1.67 139 ns/V VCC=4.5V 6
Input transition rise and fall rate Δt/ΔV 83 ns/V VCC=6.0V 6
Ambient temperature Tamb -40 85 ℃ 6
HIGH-level input voltage VIH 1.5 1.2 V Tamb=25℃; VCC=2.0V 7
HIGH-level input voltage VIH 3.15 2.4 V Tamb=25℃; VCC=4.5V 7
HIGH-level input voltage VIH 4.2 3.2 V Tamb=25℃; VCC=6.0V 7
LOW-level input voltage VIL 0.8 0.5 V Tamb=25℃; VCC=2.0V 7
LOW-level input voltage VIL 2.1 1.35 V Tamb=25℃; VCC=4.5V 7
LOW-level input voltage VIL 2.8 1.8 V Tamb=25℃; VCC=6.0V 7
HIGH-level output voltage VOH 1.9 2 V Tamb=25℃; VI = VIH or VIL; IO=-20uA; VCC=2.0V 7
HIGH-level output voltage VOH 4.4 4.5 V Tamb=25℃; VI = VIH or VIL; IO=-20uA; VCC=4.5V 7
HIGH-level output voltage VOH 5.9 6 V Tamb=25℃; VI = VIH or VIL; IO=-20uA; VCC=6.0V 7
HIGH-level output voltage VOH 3.98 4.32 V Tamb=25℃; VI = VIH or VIL; IO=-6.0mA; VCC=4.5V 7
HIGH-level output voltage VOH 5.48 5.81 V Tamb=25℃; VI = VIH or VIL; IO=-7.8mA; VCC=6.0V 7
LOW-level output voltage VOL 0 0.1 V Tamb=25℃; VI = VIH or VIL; IO=20uA; VCC=2.0V 7
LOW-level output voltage VOL 0.15 0.26 V Tamb=25℃; VI = VIH or VIL; IO=6.0mA; VCC=4.5V 7
LOW-level output voltage VOL 0.16 0.26 V Tamb=25℃; VI = VIH or VIL; IO=7.8mA; VCC=6.0V 7
Input leakage current II -0.1 0.1 uA Tamb=25℃; VI=VCC or GND; VCC=6.0V; printed ±0.1 7
OFF-state output current IOZ -0.5 0.5 uA Tamb=25℃; VI=VIH or VIL; VCC=6.0V; VO=VCC or GND; printed ±0.5 7
Supply current ICC 8 uA Tamb=25℃; VI=VCC or GND; IO=0A; VCC=6.0V 7
HIGH-level input voltage VIH 3.15 V Tamb=-40℃ to +85℃; VCC=4.5V 8
LOW-level input voltage VIL 1.35 V Tamb=-40℃ to +85℃; VCC=4.5V 8
HIGH-level output voltage VOH 1.9 V Tamb=-40℃ to +85℃; VI = VIH or VIL; IO=-20uA; VCC=2.0V 8
HIGH-level output voltage VOH 4.4 V Tamb=-40℃ to +85℃; VI = VIH or VIL; IO=-20uA; VCC=4.5V 8
HIGH-level output voltage VOH 3.84 V Tamb=-40℃ to +85℃; VI = VIH or VIL; IO=-6.0mA; VCC=4.5V 8
HIGH-level output voltage VOH 5.34 V Tamb=-40℃ to +85℃; VI = VIH or VIL; IO=-7.8mA; VCC=6.0V 8
LOW-level output voltage VOL 0.1 V Tamb=-40℃ to +85℃; VI = VIH or VIL; IO=20uA; VCC=4.5V 8
LOW-level output voltage VOL 0.33 V Tamb=-40℃ to +85℃; VI = VIH or VIL; IO=6.0mA; VCC=4.5V 8
Input leakage current II -1 1 uA Tamb=-40℃ to +85℃; VI=VCC or GND; VCC=6.0V; printed ±1.0 8
OFF-state output current IOZ -5 5 uA Tamb=-40℃ to +85℃; VI=VIH or VIL; VCC=6.0V; VO=VCC or GND; printed ±5.0 8
Supply current ICC 80 uA Tamb=-40℃ to +85℃; VI=VCC or GND; IO=0A; VCC=6.0V 8
Propagation delay nAn to nYn tpd 11 22 ns Tamb=25℃; VCC=4.5V; see Figure 5 9
Enable time nOE to nYn ten 13 30 ns Tamb=25℃; VCC=4.5V; see Figure 6 9
Disable time nOE to nYn tdis 14 30 ns Tamb=25℃; VCC=4.5V; see Figure 6 9
Transition time tt 5 12 ns Tamb=25℃; VCC=4.5V; see Figure 5 9
Propagation delay nAn to nYn tpd 28 ns Tamb=-40℃ to +85℃; VCC=4.5V; see Figure 5 10
Enable time nOE to nYn ten 38 ns Tamb=-40℃ to +85℃; VCC=4.5V; see Figure 6 10
Disable time nOE to nYn tdis 38 ns Tamb=-40℃ to +85℃; VCC=4.5V; see Figure 6 10
Transition time tt 15 ns Tamb=-40℃ to +85℃; VCC=4.5V; see Figure 5 10
Input capacitance CI 3.5 pF Tamb=25℃ 7
Power dissipation capacitance CPD 35 pF Tamb=25℃; per buffer; VI=GND to VCC 9

CAD (KiCad official)

  • Symbol: AIP74HC244SA.TB
  • Footprint: Package_SO:SOP-20_7.5x12.8mm_P1.27mm
  • 3D model: SOP-20-300mil, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 2.65 mm nominal SOIC height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: aip74hc244sa-tb-etched.step / aip74hc244sa-tb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); aip74hc244sa-tb.step / aip74hc244sa-tb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi I-core Elec datasheet (16 pp, sha256 06f00ce8e30be55b, retrieved 2026-10-30, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF