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README

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AiP74AVC2T45YA8.TR

Wuxi I-core Elec · Buffer/Driver/Transceiver · VSSOP-8

AiP74AVC2T45YA8.TR from Wuxi I-core Elec, in a VSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC(A) power_in Supply voltage A (0.8V to 3.6V) powering pins 1A, 2A and DIR.
2 1A bidirectional Data input or output, port A channel 1, powered by VCC(A).
3 2A bidirectional Data input or output, port A channel 2, powered by VCC(A).
4 GND power_in Ground (0V).
5 DIR input Direction control powered by VCC(A); high transfers data A to B, low transfers B to A.
6 2B bidirectional Data input or output, port B channel 2, powered by VCC(B).
7 1B bidirectional Data input or output, port B channel 1, powered by VCC(B).
8 VCC(B) power_in Supply voltage B (0.8V to 3.6V) powering pins 1B and 2B.

Key specifications

Parameter Value
Manufacturer Wuxi I-core Elec
Package VSSOP-8
Category Logic ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage A VCC(A) 0.8 3.6 V 5
Supply voltage B VCC(B) 0.8 3.6 V 5
Input voltage VI 0 3.6 V 5
Output voltage active mode VO 0 V Active mode, max = VCCO 5
Output voltage suspend or 3-state VO 0 3.6 V Suspend or 3-state mode 5
Operating ambient temperature Tamb -40 105 ℃ 5
Input transition rise and fall rate Δt/ΔV 5 ns/V VCCI=0.8V~3.6V 5
Supply voltage A VCC(A) -0.5 4.6 V 4
Supply voltage B VCC(B) -0.5 4.6 V 4
Input clamping current IIK -50 mA VI<0V 4
Input voltage VI -0.5 4.6 V 4
Output clamping current IOK -50 mA VO<0V 4
Output voltage active mode VO -0.5 V Active mode, max = VCCO+0.5 4
Output voltage suspend or 3-state VO -0.5 4.6 V Suspend or 3-state mode 4
Output current IO -50 50 mA VO=0V~VCCO 4
Supply current ICC 100 mA ICC(A) or ICC(B) 4
Ground current IGND -100 mA 4
Storage temperature Tstg -65 150 ℃ 4
Total power dissipation Ptot 250 mW Tamb=-40℃~+105℃; VSSOP8 derates 8mW/K above 110℃ 4
Soldering temperature TL 250 ℃ 10 s 4
High-level input voltage data input VIH 2 V Data input, VCCI=3.0V3.6V, Tamb=-40+105℃ 7
High-level input voltage data input VIH 1.6 V Data input, VCCI=2.3V2.7V, Tamb=-40+105℃ 7
Low-level input voltage data input VIL 0.9 V Data input, VCCI=3.0V3.6V, Tamb=-40+105℃ 7
Low-level input voltage data input VIL 0.7 V Data input, VCCI=2.3V2.7V, Tamb=-40+105℃ 7
High-level output voltage VOH 2.3 V VI=VIH or VIL; IO=-12mA; VCC(A)=VCC(B)=3.0V; Tamb=-40~+105℃ 8
High-level output voltage VOH 1.75 V VI=VIH or VIL; IO=-9mA; VCC(A)=VCC(B)=2.3V; Tamb=-40~+105℃ 8
Low-level output voltage VOL 0.7 V VI=VIH or VIL; IO=12mA; VCC(A)=VCC(B)=3.0V; Tamb=-40~+105℃ 8
Low-level output voltage VOL 0.55 V VI=VIH or VIL; IO=9mA; VCC(A)=VCC(B)=2.3V; Tamb=-40~+105℃ 8
Low-level output voltage VOL 0.1 V VI=VIH or VIL; IO=100uA; VCC(A)=VCC(B)=0.8V3.6V; Tamb=-40+105℃ 8
Input leakage current II -1.5 1.5 uA DIR input; VI=0V or 3.6V; VCC(A)=VCC(B)=0.8V3.6V; Tamb=-40+105℃ 8
Off-state output current IOZ -7.5 7.5 uA A or B port; VO=0V or VCCO; VCC(A)=VCC(B)=3.6V; Tamb=-40~+105℃ 8
Power-off leakage current A port IOFF -35 35 uA VI or VO=0V3.6V; VCC(A)=0V; VCC(B)=0.8V3.6V; Tamb=-40~+105℃ 8
Power-off leakage current B port IOFF -35 35 uA VI or VO=0V3.6V; VCC(B)=0V; VCC(A)=0.8V3.6V; Tamb=-40~+105℃ 8
Quiescent current A port ICC 11.5 uA VI=0V or VCCI; IO=0A; VCC(A)=VCC(B)=0.8V3.6V; Tamb=-40+105℃ 8
Quiescent current A port ICC -8 uA VI=0V or VCCI; IO=0A; VCC(A)=0V; VCC(B)=3.6V; Tamb=-40~+105℃ 8
Quiescent current B port ICC 11.5 uA VI=0V or VCCI; IO=0A; VCC(A)=VCC(B)=0.8V3.6V; Tamb=-40+105℃ 8
Quiescent current B port ICC -8 uA VI=0V or VCCI; IO=0A; VCC(A)=3.6V; VCC(B)=0V; Tamb=-40~+105℃ 8
Total quiescent current ICC(A)+ICC(B) 23 uA IO=0A; VI=0V or VCCI; VCC(A)=VCC(B)=0.8V3.6V; Tamb=-40+105℃ 8
Input capacitance CI 1 pF DIR input; VI=0V or 3.3V; VCC(A)=VCC(B)=3.3V; Tamb=25℃ 5
Input/output capacitance CI/O 4 pF A and B ports; suspend mode; VCC(A)=VCC(B)=3.3V; Tamb=25℃ 5
Propagation delay A to B tpd 0.5 2.7 ns VCC(A)=3.0V3.6V; VCC(B)=3.3V±0.3V; Tamb=-40+105℃ 11
Propagation delay A to B tpd 1 9.9 ns VCC(A)=1.1V1.3V; VCC(B)=1.2V±0.1V; Tamb=-40+105℃ 11
Propagation delay B to A tpd 0.5 2.7 ns VCC(A)=3.0V3.6V; VCC(B)=3.3V±0.3V; Tamb=-40+105℃ 11
Propagation delay B to A tpd 1 9.9 ns VCC(A)=1.1V1.3V; VCC(B)=1.2V±0.1V; Tamb=-40+105℃ 11
Disable time DIR to A tdis 1.5 5.2 ns VCC(A)=3.0V3.6V; VCC(B)=3.3V±0.3V; Tamb=-40+105℃ 12
Disable time DIR to B tdis 1.7 5.2 ns VCC(A)=3.0V3.6V; VCC(B)=3.3V±0.3V; Tamb=-40+105℃ 12
Enable time DIR to A ten 7.9 ns VCC(A)=3.0V3.6V; VCC(B)=3.3V±0.3V; Tamb=-40+105℃ 12
Enable time DIR to B ten 7.9 ns VCC(A)=3.0V3.6V; VCC(B)=3.3V±0.3V; Tamb=-40+105℃ 12
Power dissipation capacitance CPD 17 pF A port B to A / B port A to B; VCC(A)=VCC(B)=3.3V; Tamb=25℃ 10

CAD (KiCad official)

  • Symbol: AiP74AVC2T45YA8.TR
  • Footprint: Package_SO:VSSOP-8_2.3x2mm_P0.5mm
  • 3D model: VSSOP-8 (KiCad packages3D, STEP)
  • 3D model files: aip74avc2t45ya8-tr-etched.step / aip74avc2t45ya8-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); aip74avc2t45ya8-tr.step / aip74avc2t45ya8-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi I-core Elec datasheet (20 pp, sha256 05897e779e3fa6ed, retrieved 2026-10-23, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF