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AIP1637SA20.TB
Public Made by Adomby adom
I-CORE(中微爱芯) LED Drivers, SOP-20. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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AIP1637SA20.TB
I-CORE(中微爱芯) · LED Drivers · SOP-20
AIP1637SA20.TB from I-CORE(中微爱芯), in a SOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Logic ground; connect to the system ground (GND = 0 V reference for all ratings). |
| 2 | SG1/KS1 | output | Segment output SG1, N-channel open-drain, also used as key-scan line KS1; absolute LED SEG drive output current limit is -200 mA. |
| 3 | SG2/KS2 | output | Segment output SG2, N-channel open-drain, also used as key-scan line KS2; absolute LED SEG drive output current limit is -200 mA. |
| 4 | SG3/KS3 | output | Segment output SG3, N-channel open-drain, also used as key-scan line KS3; absolute LED SEG drive output current limit is -200 mA. |
| 5 | SG4/KS4 | output | Segment output SG4, N-channel open-drain, also used as key-scan line KS4; absolute LED SEG drive output current limit is -200 mA. |
| 6 | SG5/KS5 | output | Segment output SG5, N-channel open-drain, also used as key-scan line KS5; absolute LED SEG drive output current limit is -200 mA. |
| 7 | SG6/KS6 | output | Segment output SG6, N-channel open-drain, also used as key-scan line KS6; absolute LED SEG drive output current limit is -200 mA. |
| 8 | SG7/KS7 | output | Segment output SG7, N-channel open-drain, also used as key-scan line KS7; absolute LED SEG drive output current limit is -200 mA. |
| 9 | SG8/KS8 | output | Segment output SG8, N-channel open-drain, also used as key-scan line KS8; absolute LED SEG drive output current limit is -200 mA. |
| 10 | GRID6 | output | Digit output GRID6, P-channel open-drain; absolute LED GRID drive output current limit is +20 mA. |
| 11 | GRID5 | output | Digit output GRID5, P-channel open-drain; absolute LED GRID drive output current limit is +20 mA. |
| 12 | GRID4 | output | Digit output GRID4, P-channel open-drain; absolute LED GRID drive output current limit is +20 mA. |
| 13 | GRID3 | output | Digit output GRID3, P-channel open-drain; absolute LED GRID drive output current limit is +20 mA. |
| 14 | GRID2 | output | Digit output GRID2, P-channel open-drain; absolute LED GRID drive output current limit is +20 mA. |
| 15 | GRID1 | output | Digit output GRID1, P-channel open-drain; absolute LED GRID drive output current limit is +20 mA. |
| 16 | VDD | power_in | Logic supply voltage, 5 V ±10% (recommended 3.0 V to 5.5 V; absolute maximum range -0.5 V to 7.0 V). |
| 17 | DIO | bidirectional | Serial data input/output; input data changes only while CLK is low and is transferred while CLK is high, and the chip pulls DIO low as an ACK on the ninth clock of each byte. |
| 18 | CLK | input | Serial clock input; data is input/output on the rising edge, with a maximum clock frequency of 500 kHz at 50% duty cycle (below 250 kHz when reading key data). |
| 19 | K1 | input | Key-scan data input K1; the level on this pin is latched after the display cycle ends, with a 10 kΩ pull-down resistance. |
| 20 | K2 | input | Key-scan data input K2; the level on this pin is latched after the display cycle ends, with a 10 kΩ pull-down resistance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | I-CORE(中微爱芯) |
| Package | SOP-20 |
| Category | LED Drivers |
| Pins | 20 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Logic supply voltage (absolute maximum) | VDD | -0.5 | 7 | V | GND=0V, Tamb=25℃ (unless otherwise specified) | 3 | |
| LED SEG drive output current | IO1 | -200 | mA | GND=0V, Tamb=25℃ (unless otherwise specified) | 3 | ||
| LED GRID drive output current | IO2 | 20 | mA | GND=0V, Tamb=25℃ (unless otherwise specified) | 3 | ||
| Power dissipation | PD | 400 | mW | GND=0V, Tamb=25℃ (unless otherwise specified) | 3 | ||
| Operating ambient temperature | Tamb | -40 | 85 | ℃ | GND=0V, Tamb=25℃ (unless otherwise specified) | 3 | |
| Storage temperature | Tstg | -65 | 150 | ℃ | GND=0V, Tamb=25℃ (unless otherwise specified) | 3 | |
| Soldering temperature (SOP package) | TL | 250 | ℃ | SOP package, 10 s | 3 | ||
| Logic supply voltage (recommended) | VDD | 3 | 5 | 5.5 | V | Ta=-40~+85℃, GND=0V | 3 |
| Low-level input voltage (recommended) | VIL | 0 | V | Ta=-40~+85℃, GND=0V | 3 | ||
| Low-level output current SG1~SG8, Vo=2V | IOL1 | -20 | -25 | -40 | mA | SG1~SG8, Vo=2V | 4 |
| Low-level output current SG1~SG8, Vo=3V | IOL2 | -20 | -30 | -50 | mA | SG1~SG8, Vo=3V | 4 |
| High-level output current GRID1~GRID6, Vo=0.3V | IOH1 | 80 | 140 | mA | GRID1~GRID6, Vo=0.3V | 4 | |
| Input current | II | -1 | 1 | µA | VI=VDD/GND | 4 | |
| Low-level output current (dout) | Idout | 4 | mA | Vo=0.4V, dout | 4 | ||
| High-level output current tolerance (GRID1~GRID6) | Itolsg | 5 | % | Vo=VDD-3V, GRID1~GRID6 | 4 | ||
| Output pull-down resistance | RL | 10 | KΩ | K1~K2 | 4 | ||
| Hysteresis voltage | VH | 0.35 | V | CLK, DIO | 4 | ||
| Dynamic current loss | IDDdyn | 5 | mA | No load, display off | 4 | ||
| Oscillation frequency | Fosc | 450 | KHz | 4 | |||
| Tplz | Tplz | 300 | ns | 4 | |||
| Propagation delay time | Tpzl | 100 | ns | CLK→DIO, CL=15pf, RL=10KΩ | 4 | ||
| Rise time (GRID1~GRID6) | TTZH1 | 2 | µs | GRID1~GRID6 | 4 | ||
| Rise time (SEG1~SEG8) | TTZH2 | 0.5 | µs | CL=300pf, SEG1~SEG8 | 4 | ||
| Fall time | TTHZ | 120 | µs | CL=300pf, SEGN, GRIDN | 4 | ||
| Maximum clock frequency | Fmax | 500 | KHz | Duty cycle 50% | 4 | ||
| Input capacitance | CI | 15 | pf | 4 | |||
| Clock pulse width | PWCLK | 400 | ns | 4 | |||
| Data setup time | tSETUP | 100 | ns | 4 | |||
| Data hold time | tHOLD | 100 | ns | 4 | |||
| Wait time | tWAIT | 1 | µs | CLK↑→CLK↓ | 4 |
CAD (KiCad official)
- Symbol:
AIP1637SA20.TB - Footprint:
Package_SO:SOP-20_7.5x12.8mm_P1.27mm - 3D model: SOP-20, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 2.65 mm nominal SOIC height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
aip1637sa20-tb-etched.step/aip1637sa20-tb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);aip1637sa20-tb.step/aip1637sa20-tb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: I-CORE(中微爱芯) datasheet (12 pp, sha256
1c8d4bd7d64e00fa, retrieved 2026-10-18, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).