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AIP1624
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Wuxi I core Elec LED Drivers, SOP-24-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownAIP1624
Wuxi I core Elec · LED Drivers · SOP-24-300mil
AIP1624 from Wuxi I core Elec, in a SOP-24-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | DIN | input | Serial data input; logic-input thresholds are VIH 0.7VDD min and VIL 0.2VDD max, with absolute range -0.5 V to VDD+0.5 V. |
| 2 | CLK | input | Serial clock input; data is written on the rising edge, with minimum clock pulse width PWCLK 400 ns and maximum clock frequency 1 MHz at 50% duty. |
| 3 | STB | input | Chip select / strobe input; a high level on STB during a transfer initializes serial communication and invalidates the instruction or data being sent, and minimum strobe pulse width PWSTB is 1 us. |
| 4 | VDD | power_in | Logic supply voltage, 3 V to 5.5 V (5 V typical); absolute maximum rating is -0.5 V to +7.0 V, and a filter capacitor should be placed close to the chip between VDD and GND. |
| 5 | SEG1 | output | Segment output or key-scan output with P-channel open-drain driver; high-level drive IOH1 is -20 to -40 mA at VO = VDD-2 V. |
| 6 | SEG2 | output | Segment output or key-scan output with P-channel open-drain driver; high-level drive IOH1 is -20 to -40 mA at VO = VDD-2 V. |
| 7 | SEG3 | output | Segment output or key-scan output with P-channel open-drain driver; high-level drive IOH1 is -20 to -40 mA at VO = VDD-2 V. |
| 8 | SEG4 | output | Segment output or key-scan output with P-channel open-drain driver; high-level drive IOH1 is -20 to -40 mA at VO = VDD-2 V. |
| 9 | SEG5 | output | Segment output or key-scan output with P-channel open-drain driver; high-level drive IOH1 is -20 to -40 mA at VO = VDD-2 V. |
| 10 | SEG6 | output | Segment output or key-scan output with P-channel open-drain driver; high-level drive IOH1 is -20 to -40 mA at VO = VDD-2 V. |
| 11 | SEG7 | output | Segment output or key-scan output with P-channel open-drain driver; high-level drive IOH1 is -20 to -40 mA at VO = VDD-2 V. |
| 12 | SEG8 | output | Segment output or key-scan output with P-channel open-drain driver; high-level drive IOH1 is -20 to -40 mA at VO = VDD-2 V. |
| 13 | SEG9 | output | Segment output or key-scan output with P-channel open-drain driver; high-level drive IOH1 is -20 to -40 mA at VO = VDD-2 V. |
| 14 | SEG10 | output | Segment output or key-scan output with P-channel open-drain driver; high-level drive IOH1 is -20 to -40 mA at VO = VDD-2 V. |
| 15 | SEG11 | output | Segment-only output with P-channel open-drain driver; high-level drive IOH1 is -20 to -40 mA at VO = VDD-2 V. |
| 16 | SEG12/GRID7 | output | Multiplexed segment or grid output with P/N-channel open-drain driver; grid sink IOL1 is 80 mA min at VO = 0.3 V. |
| 17 | SEG13/GRID6 | output | Multiplexed segment or grid output with P/N-channel open-drain driver; grid sink IOL1 is 80 mA min at VO = 0.3 V. |
| 18 | SEG14/GRID5 | output | Multiplexed segment or grid output with P/N-channel open-drain driver; grid sink IOL1 is 80 mA min at VO = 0.3 V. |
| 19 | GND | power_in | Ground reference for the device (GND = 0 V). |
| 20 | GRID4 | output | Grid output with N-channel open-drain driver; grid sink IOL1 is 80 mA min at VO = 0.3 V. |
| 21 | GRID3 | output | Grid output with N-channel open-drain driver; grid sink IOL1 is 80 mA min at VO = 0.3 V. |
| 22 | GND | power_in | Ground reference for the device (GND = 0 V). |
| 23 | GRID2 | output | Grid output with N-channel open-drain driver; grid sink IOL1 is 80 mA min at VO = 0.3 V. |
| 24 | GRID1 | output | Grid output with N-channel open-drain driver; grid sink IOL1 is 80 mA min at VO = 0.3 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Wuxi I core Elec |
| Package | SOP-24-300mil |
| Category | LED Drivers |
| Pins | 24 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Logic supply voltage | VDD | 3 | 5 | 5.5 | V | 4 | |
| Input low-level voltage | VIL | 0 | V | CLK、DIN、STB | 4 | ||
| Supply voltage | VDD | -0.5 | 7 | V | 4 | ||
| Output high-level drive current (SEG) | IO1 | -50 | mA | 4 | |||
| Output low-level drive current (GRID) | IO2 | 150 | mA | 4 | |||
| Operating temperature | Tamb | -40 | 85 | ℃ | 4 | ||
| Storage temperature | Tstg | -65 | 150 | ℃ | 4 | ||
| Soldering temperature (SOP) | TL | 250 | ℃ | 10 s, SOP package | 4 | ||
| High-level output current (SEG) | IOH1 | -20 | -25 | -40 | mA | VO=VDD-2V，SEGn | 4 |
| High-level output current (SEG) | IOH2 | -20 | -30 | -50 | mA | VO=VDD-3V，SEGn | 4 |
| Low-level output current (GRID) | IOL1 | 80 | 100 | mA | VO= 0.3V，GRIDn | 4 | |
| High-level output current tolerance | ITOLSG | 5 | % | VO=VDD-3V，SEGn | 4 | ||
| Hysteresis voltage | VH | 0.35 | V | CLK、DIN、STB | 4 | ||
| Input leakage current | II | -1 | 1 | uA | VIN=VDD/GND | 5 | |
| Static supply current | IDD | 140 | 160 | 180 | uA | 无负载，VIN=VDD | 5 |
| Oscillation frequency | fOSC | 400 | kHz | 5 | |||
| Rise time (SEG) | tTZH1 | 2 | us | CL=300pF，SEGn | 5 | ||
| Rise time (GRID) | tTZH | 0.5 | us | CL=300pF，GRIDn | 5 | ||
| Fall time | tTHZ | 120 | us | CL=300pF，SEGn、GRIDn | 5 | ||
| Maximum clock frequency | fmax | 1 | MHz | 占空比 50% | 5 | ||
| Clock pulse width | PWCLK | 400 | ns | 5 | |||
| Strobe pulse width | PWSTB | 1 | us | 5 | |||
| Data setup time | tSETUP | 100 | ns | 5 | |||
| Data hold time | tHOLD | 100 | ns | 5 | |||
| CLK to STB time | tCLK-STB | 1 | us | CLK↑→STB↑ | 5 |
CAD (KiCad official)
- Symbol:
AIP1624 - Footprint:
Package_SO:SOP-24_7.5x15.4mm_P1.27mm - 3D model: SOP-24-300mil, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 2.65 mm nominal SOIC height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
aip1624-etched.step/aip1624-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);aip1624.step/aip1624.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Wuxi I core Elec datasheet (14 pp, sha256
25e656bb275b7e90, retrieved 2026-10-19, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).