AI Flow: Reverse Engineering

{
  "passes": [
    {
      "aiThread": "driver-re2",
      "at": "2026-11-03T23:27:54Z",
      "changes": 5,
      "confidence": {
        "blocks": {
          "level": "High",
          "why": "silkscreen labels (VIN, GND, X1-X3, CAN, AUX, PROG, FAN, MOTOR_TEMP, RESET) and the part identities agree with the block topology"
        },
        "connectivity": {
          "level": "Low",
          "why": "only the three phase pours and the XT30 pin were measured on the photos; the MCU pin map, the regulator and transceiver pinouts and every passive's role are inferred"
        },
        "copper": {
          "level": "Medium",
          "why": "five bottom pours fitted to measured gap lines (64 to 91 percent of each outline); two sketched pours and all top-side copper are not traced; via rings could not be paired across faces for 306 of 326 vias"
        },
        "identity": {
          "level": "Medium",
          "why": "DRV8323S, SS210 diodes, R002 shunts, the 100 uH inductor and every connector are read off the photo; the six MOSFETs, the STM32G4 variant, the buck IC, the CAN transceiver and both regulators have unreadable markings"
        },
        "layers": {
          "level": "Low",
          "why": "no inner via was detected, so the layer count rests on the routing results, and the inner planes are inferred from which nets are largest"
        },
        "placement": {
          "level": "High",
          "why": "120 of 137 parts placed by their own pads on the photo (median correction 0.26 mm); the rest by body centre or a pin-1 reading; overlay checked by eye"
        },
        "values": {
          "level": "Medium",
          "why": "resistor codes read where legible (R002, 220, 30B, 241, 391, 621, 59C, 01C, 472, 100); every MLCC value and ten resistor codes are not readable"
        }
      },
      "hashes": {
        "blocks.json": "ef3a018b04fd2e24a9bbeb1f9c437146bca39af0b80da8f60f78d88517cd54a7",
        "copper.json": "86326950162756cc427b5f65b984c581359c60649c677993e748424fc80b1521",
        "layers.json": "72d8c32480f78239771f1f9d7dd8c0a8366dec26ec286d337c7372ece90771c5",
        "nets.json": "bc213b65e2e07aa2bedbdbd5b5ebd6f410146a9e25641f8290b373b074382d93",
        "parts.json": "4d332847fa5eb00103bb53d9a776f191920a1ac5d604680ef76ec3a2cb4b2bf7",
        "prep.json": "336a6a45b984593dfe40ca488a9ba478bf9d932e8b1aaf421c281c4df712ec08",
        "scale.json": "033ee84509855df456ea668f0294224c0ab12595a3e17d48b6e846d2acf4a77a"
      },
      "n": 1,
      "note": "gate-driver passives corrected to 0805 at centres read on a 120 px/mm crop; L1 turned 90 (terminals left and right); C30 moved to its body; zone clearance written without the raster margin; snaps that end at the search edge rejected; routes re-run on the corrected placement"
    },
    {
      "aiThread": "driver-re2",
      "at": "2026-11-03T23:27:54Z",
      "changes": 0,
      "confidence": {
        "blocks": {
          "level": "High",
          "why": "silkscreen labels (VIN, GND, X1-X3, CAN, AUX, PROG, FAN, MOTOR_TEMP, RESET) and the part identities agree with the block topology"
        },
        "connectivity": {
          "level": "Low",
          "why": "only the three phase pours and the XT30 pin were measured on the photos; the MCU pin map, the regulator and transceiver pinouts and every passive's role are inferred"
        },
        "copper": {
          "level": "Medium",
          "why": "five bottom pours fitted to measured gap lines (64 to 91 percent of each outline); two sketched pours and all top-side copper are not traced; via rings could not be paired across faces for 306 of 326 vias"
        },
        "identity": {
          "level": "Medium",
          "why": "DRV8323S, SS210 diodes, R002 shunts, the 100 uH inductor and every connector are read off the photo; the six MOSFETs, the STM32G4 variant, the buck IC, the CAN transceiver and both regulators have unreadable markings"
        },
        "layers": {
          "level": "Low",
          "why": "no inner via was detected, so the layer count rests on the routing results, and the inner planes are inferred from which nets are largest"
        },
        "placement": {
          "level": "High",
          "why": "120 of 137 parts placed by their own pads on the photo (median correction 0.26 mm); the rest by body centre or a pin-1 reading; overlay checked by eye"
        },
        "values": {
          "level": "Medium",
          "why": "resistor codes read where legible (R002, 220, 30B, 241, 391, 621, 59C, 01C, 472, 100); every MLCC value and ten resistor codes are not readable"
        }
      },
      "hashes": {
        "blocks.json": "ef3a018b04fd2e24a9bbeb1f9c437146bca39af0b80da8f60f78d88517cd54a7",
        "copper.json": "86326950162756cc427b5f65b984c581359c60649c677993e748424fc80b1521",
        "layers.json": "72d8c32480f78239771f1f9d7dd8c0a8366dec26ec286d337c7372ece90771c5",
        "nets.json": "bc213b65e2e07aa2bedbdbd5b5ebd6f410146a9e25641f8290b373b074382d93",
        "parts.json": "4d332847fa5eb00103bb53d9a776f191920a1ac5d604680ef76ec3a2cb4b2bf7",
        "prep.json": "336a6a45b984593dfe40ca488a9ba478bf9d932e8b1aaf421c281c4df712ec08",
        "scale.json": "033ee84509855df456ea668f0294224c0ab12595a3e17d48b6e846d2acf4a77a"
      },
      "n": 2,
      "note": "re-measured: the two sketched pours (vin-bottom, gnd-bottom-right) remain INFERRED with tests, as recorded; no other disagreement"
    },
    {
      "aiThread": "driver-re2",
      "at": "2026-11-04T07:06:47Z",
      "changes": 1,
      "confidence": {
        "blocks": {
          "level": "High",
          "why": "silkscreen labels (VIN, GND, X1-X3, CAN, AUX, PROG, FAN, MOTOR_TEMP, RESET) and the part identities agree with the block topology"
        },
        "connectivity": {
          "level": "Low",
          "why": "99 pins disagree with the copper they appear to touch and 4 net pairs meet at vias; the ring test does not reliably separate a joined plated pad from an isolated one on these photos. 827 mm2 of pour and 94 mm of track have no net. The MCU pin map, regulator and transceiver pinouts and passive roles are inferred. Routed copper is one possible way to make the connections, not what is inside the board"
        },
        "copper": {
          "level": "Medium",
          "why": "116 pours and 314 tracks traced from the photos on both faces, and checked by eye against them: phase, VIN and ground pours and the via fields follow the board. Known misses: the bulk-capacitor rails at the bottom's upper left are largely missing, the bottom's signal bundles come out mostly as gaps in the pour, not separate tracks, and 637 short track fragments were dropped as misreadings"
        },
        "identity": {
          "level": "Medium",
          "why": "DRV8323S, SS210 diodes, R002 shunts, the 100 uH inductor and every connector are read off the photo; the six MOSFETs, the STM32G4 variant, the buck IC, the CAN transceiver and most small parts rest on package and circuit role"
        },
        "layers": {
          "level": "Medium",
          "why": "6 layers proposed from routing difficulty: crossing of seen copper falls from 327 mm at 4 layers to 24 mm at 6 and does not improve at 8. Layer count has not been seen directly, and 3 inner-via candidates only prove at least 4. No stackup closed every connection at KiCad default rules; 34 stay open at 6 layers, and a tighter-rules experiment left 2"
        },
        "placement": {
          "level": "High",
          "why": "120 of 137 parts placed by their own pads on the photo (median correction 0.26 mm); the rest by body centre or a pin-1 reading; 62 courtyard overlaps and 23 pad-to-pad clearance errors remain in the copy"
        },
        "values": {
          "level": "Medium",
          "why": "resistor codes read where legible (R002, 220, 30B, 241, 391, 621, 59C, 01C, 472, 100); every MLCC value and ten resistor codes are not readable"
        },
        "vias": {
          "level": "Medium",
          "why": "1028 kept from 2681 dome candidates. Grids line up under the parts and pours they stitch, but only 45 are confirmed on both faces because vias tent on the top, and hand-checking was by eye only. Drill and diameter are the rule's, not measured"
        }
      },
      "hashes": {
        "blocks.json": "ef3a018b04fd2e24a9bbeb1f9c437146bca39af0b80da8f60f78d88517cd54a7",
        "copper.json": "ea32d9c84f44d45fa145ad7f4f49c24c97dd563f84406c6f1bab77183e82a013",
        "layers.json": "124bf5e358f9d55c67eb6c2a7c96f5d47e48fbf70cd5244abea62abc198ae3e7",
        "nets.json": "fc2e4063a68df4f906758a88b6a6ac1dbf790821166ff5f0851881b74b8bd00a",
        "parts.json": "4d332847fa5eb00103bb53d9a776f191920a1ac5d604680ef76ec3a2cb4b2bf7",
        "prep.json": "336a6a45b984593dfe40ca488a9ba478bf9d932e8b1aaf421c281c4df712ec08",
        "scale.json": "033ee84509855df456ea668f0294224c0ab12595a3e17d48b6e846d2acf4a77a"
      },
      "n": 3,
      "note": "Copper rebuilt island by island from the photos; 6-layer candidate built; checked by eye against both photos; the misses are recorded under copper."
    },
    {
      "aiThread": "driver-re2",
      "at": "2026-11-04T07:06:47Z",
      "changes": 0,
      "confidence": {
        "blocks": {
          "level": "High",
          "why": "silkscreen labels (VIN, GND, X1-X3, CAN, AUX, PROG, FAN, MOTOR_TEMP, RESET) and the part identities agree with the block topology"
        },
        "connectivity": {
          "level": "Low",
          "why": "99 pins disagree with the copper they appear to touch and 4 net pairs meet at vias; the ring test does not reliably separate a joined plated pad from an isolated one on these photos. 827 mm2 of pour and 94 mm of track have no net. The MCU pin map, regulator and transceiver pinouts and passive roles are inferred. Routed copper is one possible way to make the connections, not what is inside the board"
        },
        "copper": {
          "level": "Medium",
          "why": "116 pours and 314 tracks traced from the photos on both faces, and checked by eye against them: phase, VIN and ground pours and the via fields follow the board. Known misses: the bulk-capacitor rails at the bottom's upper left are largely missing, the bottom's signal bundles come out mostly as gaps in the pour, not separate tracks, and 637 short track fragments were dropped as misreadings"
        },
        "identity": {
          "level": "Medium",
          "why": "DRV8323S, SS210 diodes, R002 shunts, the 100 uH inductor and every connector are read off the photo; the six MOSFETs, the STM32G4 variant, the buck IC, the CAN transceiver and most small parts rest on package and circuit role"
        },
        "layers": {
          "level": "Medium",
          "why": "6 layers proposed from routing difficulty: crossing of seen copper falls from 327 mm at 4 layers to 24 mm at 6 and does not improve at 8. Layer count has not been seen directly, and 3 inner-via candidates only prove at least 4. No stackup closed every connection at KiCad default rules; 34 stay open at 6 layers, and a tighter-rules experiment left 2"
        },
        "placement": {
          "level": "High",
          "why": "120 of 137 parts placed by their own pads on the photo (median correction 0.26 mm); the rest by body centre or a pin-1 reading; 62 courtyard overlaps and 23 pad-to-pad clearance errors remain in the copy"
        },
        "values": {
          "level": "Medium",
          "why": "resistor codes read where legible (R002, 220, 30B, 241, 391, 621, 59C, 01C, 472, 100); every MLCC value and ten resistor codes are not readable"
        },
        "vias": {
          "level": "Medium",
          "why": "1028 kept from 2681 dome candidates. Grids line up under the parts and pours they stitch, but only 45 are confirmed on both faces because vias tent on the top, and hand-checking was by eye only. Drill and diameter are the rule's, not measured"
        }
      },
      "hashes": {
        "blocks.json": "ef3a018b04fd2e24a9bbeb1f9c437146bca39af0b80da8f60f78d88517cd54a7",
        "copper.json": "ea32d9c84f44d45fa145ad7f4f49c24c97dd563f84406c6f1bab77183e82a013",
        "layers.json": "124bf5e358f9d55c67eb6c2a7c96f5d47e48fbf70cd5244abea62abc198ae3e7",
        "nets.json": "fc2e4063a68df4f906758a88b6a6ac1dbf790821166ff5f0851881b74b8bd00a",
        "parts.json": "4d332847fa5eb00103bb53d9a776f191920a1ac5d604680ef76ec3a2cb4b2bf7",
        "prep.json": "336a6a45b984593dfe40ca488a9ba478bf9d932e8b1aaf421c281c4df712ec08",
        "scale.json": "033ee84509855df456ea668f0294224c0ab12595a3e17d48b6e846d2acf4a77a"
      },
      "n": 4,
      "note": "Measurements re-run against the delivered files; nothing changed."
    }
  ]
}