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Ray Publish 0.1.0 774e65a 11d ago

AGMH70N70C

AGM-Semi · MOSFETs · TO-220

AGMH70N70C from AGM-Semi, in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; controls the channel, with absolute maximum VGS of ±20 V and threshold VGS(th) of 2.0 to 4.0 V.
2 D passive Drain (also connected to the metal tab); rated for VDS of 68 V and continuous ID of 69 A at Tc=25℃.
3 S passive Source; body-diode source-drain current up to 69 A.

Key specifications

Parameter Value
Manufacturer AGM-Semi
Package TO-220
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 68 V VGS=0V ID=250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=68V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) 2 4 V VDS=VGS,ID=250μA 2
Drain-Source On-State Resistance RDS(on) 6.9 9 mΩ VGS=10V, ID=40A 2
Source-Drain Current (Body Diode) ISD 69 A 2
Forward on Voltage VSD 0.8 1.2 V VGS=0V,IS=20A 2
Drain-Source Voltage VDS 68 V VGS=0V 1
Gate-Source Voltage VGS -20 20 V VDS=0V 1
Drain Current-Continuous ID 69 A Tc=25℃ 1
Drain Current-Continuous ID 49 A Tc=100℃ 1
Maximum Power Dissipation PD 103 w Tc=25℃ 1
Maximum Power Dissipation PD 51 w Tc=100℃ 1
Avalanche energy EAS 256 mJ TJ=25℃ 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 175 ℃ 1
Thermal Resistance Junction-ambient RθJA 62.5 ℃/W Steady State 1
Thermal Resistance Junction-Case RθJC 1.45 ℃/W 1
Forward Transconductance gFS 33 S VDS=5V,ID=10A 2
Input Capacitance Ciss 2710 pF VDS=30V,VGS=0V, F=1MHZ 2
Output Capacitance Coss 205 pF VDS=30V,VGS=0V, F=1MHZ 2
Reverse Transfer Capacitance Crss 177 pF VDS=30V,VGS=0V, F=1MHZ 2
Gate resistance Rg 1.7 Ω VGS=0V, VDS=0V,f=1.0MHz 2
Turn-on Delay Time td(on) 18 nS VGS=10V,VDS=30V, RL=1.5Ω,RGEN=6Ω 2
Turn-on Rise Time tr 11 nS VGS=10V,VDS=30V, RL=1.5Ω,RGEN=6Ω 2
Turn-Off Delay Time td(off) 42 nS VGS=10V,VDS=30V, RL=1.5Ω,RGEN=6Ω 2
Turn-Off Fall Time tf 10.5 nS VGS=10V,VDS=30V, RL=1.5Ω,RGEN=6Ω 2
Total Gate Charge Qg 56 nC VGS=10V, VDS=30V, ID=20A 2
Gate-Source Charge Qgs 12 nC VGS=10V, VDS=30V, ID=20A 2
Gate-Drain Charge Qgd 6 nC VGS=10V, VDS=30V, ID=20A 2

CAD (KiCad official)

  • Symbol: AGMH70N70C
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220 (KiCad packages3D, STEP)
  • 3D model files: agmh70n70c-etched.step / agmh70n70c-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); agmh70n70c.step / agmh70n70c.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: AGM-Semi datasheet (7 pp, sha256 0f66a6cb5e5046fd, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF