main
History Download
Ray Publish 0.1.0 3c21596 7d ago

AGMH10P15D

AGM-Semi · MOSFETs · TO-252

AGMH10P15D from AGM-Semi, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limit is ±20 V and threshold VGS(th) is -2.0 V to -4.0 V at ID=-250µA.
2 D passive Drain, also connected to the exposed tab; VDS max -150 V and continuous ID -10 A at Tc=25℃ (package limited).
3 S passive Source; body diode continuous source-drain current is -10 A with VSD max -1.2 V at IS=-5A.

Key specifications

Parameter Value
Manufacturer AGM-Semi
Package TO-252
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS -150 V VGS=0V ID=-250μA 2
Zero Gate Voltage Drain Current IDSS -1 μA VDS=-150V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) -2 -4 V VDS=VGS,ID=-250μA 2
Drain-Source On-State Resistance RDS(on) 320 360 mΩ VGS=-10V, ID=-5A 2
Source-Drain Current (Body Diode) ISD -10 A 2
Forward on Voltage VSD -1.2 V VGS=0V,IS=-5A 2
Drain-Source Voltage VDS -150 V VGS=0V 1
Gate-Source Voltage VGS -20 20 V VDS=0V 1
Drain Current-Continuous ID -10 A Tc=25℃ 1
Drain Current-Continuous ID -6.7 A Tc=100℃ 1
Drain Current-Pulsed IDM -40 A 1
Maximum Power Dissipation PD 156 w Tc=25℃ 1
Maximum Power Dissipation PD 62.5 w Tc=100℃ 1
Avalanche energy EAS 90 mJ 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance Junction-ambient RθJA 50 ℃/W Steady State 1
Thermal Resistance Junction-Case RθJC 0.8 ℃/W 1
Forward Transconductance gFS 11 S VDS=-5V,ID=-3A 2
Input Capacitance Ciss 2111 pF VDS=-40V,VGS=0V,F=1MHZ 2
Output Capacitance Coss 610 pF VDS=-40V,VGS=0V,F=1MHZ 2
Reverse Transfer Capacitance Crss 512 pF VDS=-40V,VGS=0V,F=1MHZ 2
Gate resistance Rg 5.1 Ω VGS=0V, VDS=0V, f=1.0MH 2
Turn-on Delay Time td(on) 30 nS VGS=-10V,VDS=-50V, RGEN=3Ω 2
Turn-on Rise Time tr 34 nS VGS=-10V,VDS=-50V, RGEN=3Ω 2
Turn-Off Delay Time td(off) 241 nS VGS=-10V,VDS=-50V, RGEN=3Ω 2
Turn-Off Fall Time tf 130 nS VGS=-10V,VDS=-50V, RGEN=3Ω 2
Total Gate Charge Qg 38 nC VGS=-10V, VDS=-50V, ID=-3A 2
Gate-Source Charge Qgs 8 nC VGS=-10V, VDS=-50V, ID=-3A 2
Gate-Drain Charge Qgd 9.1 nC VGS=-10V, VDS=-50V, ID=-3A 2
Reverse Recovery Time trr 34 ns Isd=-5A , dI/dt=100A/µs , TJ=25℃ 2
Reverse Recovery Charge Qrr 32 nc Isd=-5A , dI/dt=100A/µs , TJ=25℃ 2

CAD (KiCad official)

  • Symbol: AGMH10P15D
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: agmh10p15d-etched.step / agmh10p15d-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); agmh10p15d.step / agmh10p15d.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: AGM-Semi datasheet (7 pp, sha256 ce97da1642bf41ab, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF