Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

AGMH022P10H

AGM-Semi · MOSFETs · TO-263

AGMH022P10H from AGM-Semi, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage is limited to ±20 V (VDS=0V) with a threshold of -2 to -4 V at ID=-250µA.
2 D passive Drain, also connected to the exposed tab; drain-source voltage is limited to -100 V and continuous drain current to -65 A at Tc=25℃ (package limited).
3 S passive Source; body-diode source-drain current is rated up to -65 A with a forward voltage of at most -1.2 V at IS=-10A.

Key specifications

Parameter Value
Manufacturer AGM-Semi
Package TO-263
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -100 V 1
Gate-Source Voltage VGS -20 20 V VDS=0V 1
Drain Current-Continuous ID -65 A Tc=25℃ (Note 1) 1
Drain Current-Continuous ID -41 A Tc=100℃ 1
Drain Current-Pulsed IDM (pluse) -260 A Note 2 1
Maximum Power Dissipation PD 250 w Tc=25℃ 1
Maximum Power Dissipation PD 100 w Tc=100℃ 1
Avalanche energy EAS 676 mJ Note 3 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance Junction-ambient (Steady State) RθJA 62 ℃/W Steady State 1
Thermal Resistance Junction-Case RθJC 0.5 ℃/W 1
Drain-Source Breakdown Voltage BVDSS -100 V VGS=0V ID=-250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=-100V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) -2 -3 -4 V VDS=VGS,ID=-250μA 2
Drain-Source On-State Resistance RDS(on) 15 24 mΩ VGS=-10V, ID=-10A 2
Source-Drain Current (Body Diode) ISD -65 A 2
Forward on Voltage VSD -1.2 V VGS=0V,IS=-10A 2

CAD (KiCad official)

  • Symbol: AGMH022P10H
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: TO-263 (KiCad packages3D, STEP)
  • 3D model files: agmh022p10h-etched.step / agmh022p10h-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); agmh022p10h.step / agmh022p10h.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: AGM-Semi datasheet (10 pp, sha256 cbb82f7d9ccb8cf7, retrieved 2026-11-05, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF