# AGM6080D

**AGM-Semi** · MOSFETs · TO-252

AGM6080D from AGM-Semi, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; controls the channel, with VGS rated at ±20 V maximum and a threshold of 2.0 to 4.0 V at ID=250µA. |
| 2 | D | passive | Drain, connected to the exposed tab; VDS rated at 60 V maximum and continuous ID of 82 A (package limited) at Tc=25°C. |
| 3 | S | passive | Source; body-diode continuous current is rated at 82 A. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | AGM-Semi |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS |  |  | 60 | V | VGS=0V | 1 |
| Gate-Source Voltage | VGS | -20 |  | 20 | V | VDS=0V | 1 |
| Drain Current-Continuous | ID |  |  | 82 | A | Tc=25℃ (Note 1) | 1 |
| Drain Current-Continuous | ID |  |  | 50 | A | Tc=100℃ | 1 |
| Maximum Power Dissipation | PD |  |  | 89 | w | Tc=25℃ | 1 |
| Maximum Power Dissipation | PD |  |  | 36 | w | Tc=100℃ | 1 |
| Avalanche energy | EAS |  |  | 272 | mJ | (Note 3) TJ=25℃, VDD=30V, Vgs=10V, ID=33A, L=0.5mH, RG=25ohm | 1 |
| Operating Junction and Storage Temperature Range | TJ,TSTG | -55 |  | 150 | ℃ |  | 1 |
| Thermal Resistance Junction-ambient (Steady State) | RθJA |  |  | 50 | ℃/W | Steady State | 1 |
| Thermal Resistance Junction-Case | RθJC |  |  | 1.4 | ℃/W |  | 1 |
| Drain-Source Breakdown Voltage | BVDSS | 60 |  |  | V | VGS=0V, ID=250μA | 2 |
| Zero Gate Voltage Drain Current | IDSS |  |  | 1 | μA | VDS=60V, VGS=0V | 2 |
| Gate-Body Leakage Current | IGSS | -100 |  | 100 | nA | VGS=±20V, VDS=0V | 2 |
| Gate Threshold Voltage | VGS(th) | 2 | 3 | 4 | V | VDS=VGS, ID=250μA | 2 |
| Drain-Source On-State Resistance | RDS(on) |  | 6 | 8.4 | mΩ | VGS=10V, ID=20A | 2 |
| Source-Drain Current (Body Diode) | ISD |  |  | 82 | A |  | 2 |
| Forward on Voltage | VSD |  |  | 1.2 | V | VGS=0V, IS=15A | 2 |

## CAD (KiCad official)

- Symbol: `AGM6080D`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files: `agm6080d-etched.step` / `agm6080d-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `agm6080d.step` / `agm6080d.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [AGM-Semi datasheet](docs/agm6080d-datasheet.pdf) (7 pp, sha256 `2a4445d568774343`, retrieved 2026-10-29, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/agm6080d-datasheet.pdf)