# AGM40P100H

**AGM-Semi** · MOSFETs · TO-263

AGM40P100H from AGM-Semi, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; left pin in the top view, gate-source voltage rated ±20 V with threshold of -1.2 V min to -2.2 V max at ID=-250μA. |
| 2 | D | passive | Drain; centre lead, connected to the exposed drain tab, with drain-source voltage rated -40 V and continuous drain current of -140 A (package limited) at Tc=25℃. |
| 3 | S | passive | Source; right pin in the top view, with body-diode source-drain current up to -140 A. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | AGM-Semi |
| Package | TO-263 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | -40 |  |  | V | VGS=0V ID=-250μA | 2 |
| Zero Gate Voltage Drain Current | IDSS |  |  | -1 | μA | VDS=-40V,VGS=0V | 2 |
| Gate-Body Leakage Current | IGSS | -100 |  | 100 | nA | VGS=±20V,VDS=0V | 2 |
| Gate Threshold Voltage | VGS(th) | -1.2 | -1.6 | -2.2 | V | VDS=VGS,ID=-250μA | 2 |
| Drain-Source On-State Resistance | RDS(on) |  | 4.6 | 6.5 | mΩ | VGS=-10V, ID=-20A | 2 |
| Drain-Source On-State Resistance | RDS(on) |  | 6 | 8.6 | mΩ | VGS=-4.5V, ID=-15A | 2 |
| Source-Drain Current (Body Diode) | ISD |  |  | -140 | A |  | 2 |
| Forward on Voltage | VSD |  |  | -1.2 | V | VGS=0V,IS=-20A | 2 |
| Forward Transconductance | gFS |  | 15 |  | S | VDS=-5V,ID=-5A | 2 |
| Input Capacitance | Ciss |  | 6550 |  | pF | VDS=-20V,VGS=0V, F=1MHZ | 2 |
| Output Capacitance | Coss |  | 515 |  | pF | VDS=-20V,VGS=0V, F=1MHZ | 2 |
| Reverse Transfer Capacitance | Crss |  | 520 |  | pF | VDS=-20V,VGS=0V, F=1MHZ | 2 |
| Gate resistance | Rg |  | 2.5 |  | Ω | VGS=0V, VDS=0V,f=1.0MHz | 2 |
| Turn-on Delay Time | td(on) |  | 41 |  | nS | VGS=-10V,VDS=-20V, ID=-12A,RGEN=3Ω | 2 |
| Turn-on Rise Time | tr |  | 12 |  | nS | VGS=-10V,VDS=-20V, ID=-12A,RGEN=3Ω | 2 |
| Turn-Off Delay Time | td(off) |  | 308 |  | nS | VGS=-10V,VDS=-20V, ID=-12A,RGEN=3Ω | 2 |
| Turn-Off Fall Time | tf |  | 70 |  | nS | VGS=-10V,VDS=-20V, ID=-12A,RGEN=3Ω | 2 |
| Total Gate Charge | Qg |  | 106 |  | nC | VGS=-10V, VDS=-20V, ID=-12A | 2 |
| Gate-Source Charge | Qgs |  | 13 |  | nC | VGS=-10V, VDS=-20V, ID=-12A | 2 |
| Gate-Drain Charge | Qgd |  | 24 |  | nC | VGS=-10V, VDS=-20V, ID=-12A | 2 |
| Reverse Recovery Time | trr |  | 24 |  | ns | Isd=-20A , dI/dt=100A/µs , TJ=25℃ | 2 |
| Reverse Recovery Charge | Qrr |  | 140 |  | nc | Isd=-20A , dI/dt=100A/µs , TJ=25℃ | 2 |
| Drain-Source Voltage | VDS |  |  | -40 | V | VGS=0V, TA=25℃ | 1 |
| Gate-Source Voltage | VGS | -20 |  | 20 | V | VDS=0V, TA=25℃ | 1 |
| Drain Current-Continuous | ID |  |  | -140 | A | Tc=25℃, package limited | 1 |
| Drain Current-Continuous | ID |  |  | -93 | A | Tc=100℃ | 1 |
| Drain Current-Pulsed | IDM |  |  | -560 | A | TA=25℃ | 1 |
| Maximum Power Dissipation | PD |  |  | 200 | w | Tc=25℃ | 1 |
| Maximum Power Dissipation | PD |  |  | 100 | w | Tc=100℃ | 1 |
| Avalanche energy | EAS |  |  | 420 | mJ | TJ=25℃,VDD=-20V,Vgs=-10V,ID=-41A,L=0.5mH,RG=25ohm | 1 |
| Operating Junction and Storage Temperature Range | TJ,TSTG | -55 |  | 175 | ℃ | TA=25℃ | 1 |
| Thermal Resistance Junction-ambient | RθJA |  |  | 40 | ℃/W | Steady State | 1 |
| Thermal Resistance Junction-Case | RθJC |  |  | 0.92 | ℃/W |  | 1 |

## CAD (KiCad official)

- Symbol: `AGM40P100H`
- Footprint: `Package_TO_SOT_SMD:TO-263-2`
- 3D model: TO-263 (KiCad packages3D, STEP)
- 3D model files: `agm40p100h-etched.step` / `agm40p100h-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `agm40p100h.step` / `agm40p100h.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [AGM-Semi datasheet](docs/agm40p100h-datasheet.pdf) (7 pp, sha256 `3eadec2a85a119ce`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/agm40p100h-datasheet.pdf)