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Ray Publish 0.1.0 3e9f879 6h ago

AGM311MN

AGM Semi · MOSFETs · SOP-8

AGM311MN from AGM Semi, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S1 passive Source of MOSFET 1 (N-channel, 30V VDS rating, 11A continuous drain current rating).
2 G1 input Gate of MOSFET 1, with gate-source voltage limited to ±20V and threshold of 1.2V to 2.2V.
3 S2 passive Source of MOSFET 2 (N-channel, 30V VDS rating, 11A continuous drain current rating).
4 G2 input Gate of MOSFET 2, with gate-source voltage limited to ±20V and threshold of 1.2V to 2.2V.
5 D2 passive Drain of MOSFET 2, with 30V maximum drain-source voltage.
6 D2 passive Drain of MOSFET 2, with 30V maximum drain-source voltage (tied to pin 5).
7 D1 passive Drain of MOSFET 1, with 30V maximum drain-source voltage.
8 D1 passive Drain of MOSFET 1, with 30V maximum drain-source voltage (tied to pin 7).

Key specifications

Parameter Value
Manufacturer AGM Semi
Package SOP-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 30 V VGS=0V ID=250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=30V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) 1.2 1.5 2.2 V VDS=VGS,ID=250μA 2
Drain-Source On-State Resistance RDS(on) 10.5 15 mΩ VGS=10V, ID=10A 2
Drain-Source On-State Resistance RDS(on) 15 22 mΩ VGS=4.5V, ID=8A 2
Source-Drain Current (Body Diode) ISD 11 A 2
Forward on Voltage VSD 1.2 V VGS=0V,IS=8A 2
Drain-Source Voltage VDS 30 V VGS=0V 1
Gate-Source Voltage VGS -20 20 V VDS=0V 1
Drain Current-Continuous ID 11 A Ta=25℃ (Note 1) 1
Drain Current-Continuous ID 8.4 A Ta=100℃ 1
Drain Current-Pulsed IDM 4 A (Note 2) pulse width limited by maximum junction temperature 1
Total Power Dissipation PD 2.5 W Ta=25℃ 1
Total Power Dissipation PD 1 W Ta=100℃ 1
Avalanche energy EAS 81 mJ (Note 3) TJ=25℃,VDD=15V,Vgs=10V,ID=18A,L=0.5mH,RG=25ohm 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance Junction-ambient RθJA 50 ℃/W Steady State 1

CAD (KiCad official)

  • Symbol: AGM311MN
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: agm311mn-etched.step / agm311mn-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); agm311mn.step / agm311mn.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: AGM Semi datasheet (8 pp, sha256 1937623a769cfea3, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF