main
History Download
Ray Publish 0.1.0 cf403fc 16d ago

AGM30P35D

AGM Semi · MOSFETs · TO-252

AGM30P35D from AGM Semi, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limit is ±20 V and threshold VGS(th) is -1.2 V min to -2.2 V max at ID=-250μA.
2 D passive Drain, also connected to the exposed tab; drain-source voltage is -30 V max and continuous drain current is -20 A at TA=25℃ (package limited).
3 S passive Source; body-diode source-drain current is -20 A max.

Key specifications

Parameter Value
Manufacturer AGM Semi
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS -30 V VGS=0V ID=-250μA 2
Zero Gate Voltage Drain Current IDSS -1 μA VDS=-30V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) -1.2 -1.4 -2.2 V VDS=VGS,ID=-250μA 2
Drain-Source On-State Resistance RDS(on) 36.5 43 mΩ VGS=-10V, ID=-10A 2
Drain-Source On-State Resistance RDS(on) 50 60 mΩ VGS=-4.5V, ID=-5A 2
Source-Drain Current (Body Diode) ISD -20 A 2
Forward on Voltage VSD -1.2 V VGS=0V,IS=-10A 2
Drain-Source Voltage VDS -30 V VGS=0V 1
Gate-Source Voltage VGS -20 20 V VDS=0V 1
Drain Current-Continuous ID -20 A TA=25℃ (Note 1) 1
Drain Current-Continuous ID -13 A TA=100℃ 1
Drain Current-Pulsed IDM -80 A Note 2 1
Maximum Power Dissipation PD 25.5 w TA=25℃ 1
Maximum Power Dissipation PD 10.2 w TA=100℃ 1
Avalanche energy EAS 36 mJ TJ=25℃,VDD=-15V,Vgs=-10V,ID=-12A,L=0.5mH,RG=25ohm (Note 3) 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance Junction-ambient RθJA 50 ℃/W Steady State 1
Thermal Resistance Junction-Case RθJC 4.9 ℃/W 1

CAD (KiCad official)

  • Symbol: AGM30P35D
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: agm30p35d-etched.step / agm30p35d-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); agm30p35d.step / agm30p35d.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: AGM Semi datasheet (7 pp, sha256 6cbcf55fdbb8f259, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF