component
AGM30P20M
Public Made by Adomby adom
AGM-Semi MOSFETs, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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AGM30P20M
AGM-Semi · MOSFETs · SOP-8
AGM30P20M from AGM-Semi, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Source of P-channel MOSFET 1 (VDS -30V, continuous ID -11A at Tc=25℃). |
| 2 | G1 | input | Gate of MOSFET 1 (VGS ±20V max, threshold -1.2V to -2.2V at ID=-250μA). |
| 3 | S2 | passive | Source of P-channel MOSFET 2 (VDS -30V, continuous ID -11A at Tc=25℃). |
| 4 | G2 | input | Gate of MOSFET 2 (VGS ±20V max, threshold -1.2V to -2.2V at ID=-250μA). |
| 5 | D2 | passive | Drain of MOSFET 2, tied to pin 6 (VDS -30V, RDS(on) 17mΩ typ at VGS=-10V). |
| 6 | D2 | passive | Drain of MOSFET 2, tied to pin 5 (VDS -30V, RDS(on) 17mΩ typ at VGS=-10V). |
| 7 | D1 | passive | Drain of MOSFET 1, tied to pin 8 (VDS -30V, RDS(on) 17mΩ typ at VGS=-10V). |
| 8 | D1 | passive | Drain of MOSFET 1, tied to pin 7 (VDS -30V, RDS(on) 17mΩ typ at VGS=-10V). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | AGM-Semi |
| Package | SOP-8 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | -30 | V | VGS=0V ID=-250μA | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | -1 | μA | VDS=-30V,VGS=0V | 2 | ||
| Gate-Body Leakage Current | IGSS | -100 | 100 | nA | VGS=±20V,VDS=0V | 2 | |
| Gate Threshold Voltage | VGS(th) | -1.2 | -2.2 | V | VDS=VGS,ID=-250μA | 2 | |
| Drain-Source On-State Resistance | RDS(on) | 17 | 21 | mΩ | VGS=-10V, ID=-5A | 2 | |
| Drain-Source On-State Resistance | RDS(on) | 24.5 | 31 | mΩ | VGS=-4.5V, ID=-4A | 2 | |
| Source-Drain Current (Body Diode) | ISD | -11 | A | 2 | |||
| Forward on Voltage | VSD | -1.2 | V | VGS=0V,IS=-5A | 2 | ||
| Drain-Source Voltage | VDS | -30 | V | VGS=0V, TA=25℃ | 1 | ||
| Gate-Source Voltage | VGS | -20 | 20 | V | VDS=0V, TA=25℃ | 1 | |
| Drain Current-Continuous | ID | -11 | A | Tc=25℃ | 1 | ||
| Drain Current-Continuous | ID | -7 | A | Tc=100℃ | 1 | ||
| Maximum Power Dissipation | PD | 3 | w | Tc=25℃ | 1 | ||
| Maximum Power Dissipation | PD | 1.2 | w | Tc=100℃ | 1 | ||
| Avalanche energy | EAS | 100 | mJ | TJ=25℃,VDD=-15V,Vgs=-10V,ID=-20A, L=0.5mH,RG=25ohm | 1 | ||
| Operating Junction and Storage Temperature Range | TJ,TSTG | -55 | 150 | ℃ | 1 | ||
| Thermal Resistance Junction-ambient | RθJA | 41.6 | ℃/W | Steady State | 1 | ||
| Forward Transconductance | gFS | 7 | S | VDS=-5V,ID=-4A | 2 | ||
| Input Capacitance | Ciss | 924 | pF | VDS=-15V,VGS=0V, F=1MHZ | 2 | ||
| Output Capacitance | Coss | 135 | pF | VDS=-15V,VGS=0V, F=1MHZ | 2 | ||
| Reverse Transfer Capacitance | Crss | 121 | pF | VDS=-15V,VGS=0V, F=1MHZ | 2 | ||
| Turn-on Delay Time | td(on) | 10 | nS | ID=-5A, VDS=-15V, VGS=-10V, RG=3.0Ω | 2 | ||
| Turn-on Rise Time | tr | 18 | nS | ID=-5A, VDS=-15V, VGS=-10V, RG=3.0Ω | 2 | ||
| Turn-Off Delay Time | td(off) | 130 | nS | ID=-5A, VDS=-15V, VGS=-10V, RG=3.0Ω | 2 | ||
| Turn-Off Fall Time | tf | 90 | nS | ID=-5A, VDS=-15V, VGS=-10V, RG=3.0Ω | 2 | ||
| Total Gate Charge | Qg | 20 | nC | VGS=-10V, VDS=-15V, ID=-8A | 2 | ||
| Gate-Source Charge | Qgs | 1.9 | nC | VGS=-10V, VDS=-15V, ID=-8A | 2 | ||
| Gate-Drain Charge | Qgd | 4.2 | nC | VGS=-10V, VDS=-15V, ID=-8A | 2 |
CAD (KiCad official)
- Symbol:
AGM30P20M - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
agm30p20m-etched.step/agm30p20m-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);agm30p20m.step/agm30p20m.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: AGM-Semi datasheet (8 pp, sha256
ed70e9ac8539d969, retrieved 2026-10-26, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# AGM30P20M
**AGM-Semi** · MOSFETs · SOP-8
AGM30P20M from AGM-Semi, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Source of P-channel MOSFET 1 (VDS -30V, continuous ID -11A at Tc=25℃). |
| 2 | G1 | input | Gate of MOSFET 1 (VGS ±20V max, threshold -1.2V to -2.2V at ID=-250μA). |
| 3 | S2 | passive | Source of P-channel MOSFET 2 (VDS -30V, continuous ID -11A at Tc=25℃). |
| 4 | G2 | input | Gate of MOSFET 2 (VGS ±20V max, threshold -1.2V to -2.2V at ID=-250μA). |
| 5 | D2 | passive | Drain of MOSFET 2, tied to pin 6 (VDS -30V, RDS(on) 17mΩ typ at VGS=-10V). |
| 6 | D2 | passive | Drain of MOSFET 2, tied to pin 5 (VDS -30V, RDS(on) 17mΩ typ at VGS=-10V). |
| 7 | D1 | passive | Drain of MOSFET 1, tied to pin 8 (VDS -30V, RDS(on) 17mΩ typ at VGS=-10V). |
| 8 | D1 | passive | Drain of MOSFET 1, tied to pin 7 (VDS -30V, RDS(on) 17mΩ typ at VGS=-10V). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | AGM-Semi |
| Package | SOP-8 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | -30 | | | V | VGS=0V ID=-250μA | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | -1 | μA | VDS=-30V,VGS=0V | 2 |
| Gate-Body Leakage Current | IGSS | -100 | | 100 | nA | VGS=±20V,VDS=0V | 2 |
| Gate Threshold Voltage | VGS(th) | -1.2 | | -2.2 | V | VDS=VGS,ID=-250μA | 2 |
| Drain-Source On-State Resistance | RDS(on) | | 17 | 21 | mΩ | VGS=-10V, ID=-5A | 2 |
| Drain-Source On-State Resistance | RDS(on) | | 24.5 | 31 | mΩ | VGS=-4.5V, ID=-4A | 2 |
| Source-Drain Current (Body Diode) | ISD | | | -11 | A | | 2 |
| Forward on Voltage | VSD | | | -1.2 | V | VGS=0V,IS=-5A | 2 |
| Drain-Source Voltage | VDS | | | -30 | V | VGS=0V, TA=25℃ | 1 |
| Gate-Source Voltage | VGS | -20 | | 20 | V | VDS=0V, TA=25℃ | 1 |
| Drain Current-Continuous | ID | | | -11 | A | Tc=25℃ | 1 |
| Drain Current-Continuous | ID | | | -7 | A | Tc=100℃ | 1 |
| Maximum Power Dissipation | PD | | | 3 | w | Tc=25℃ | 1 |
| Maximum Power Dissipation | PD | | | 1.2 | w | Tc=100℃ | 1 |
| Avalanche energy | EAS | | | 100 | mJ | TJ=25℃,VDD=-15V,Vgs=-10V,ID=-20A, L=0.5mH,RG=25ohm | 1 |
| Operating Junction and Storage Temperature Range | TJ,TSTG | -55 | | 150 | ℃ | | 1 |
| Thermal Resistance Junction-ambient | RθJA | | | 41.6 | ℃/W | Steady State | 1 |
| Forward Transconductance | gFS | | 7 | | S | VDS=-5V,ID=-4A | 2 |
| Input Capacitance | Ciss | | 924 | | pF | VDS=-15V,VGS=0V, F=1MHZ | 2 |
| Output Capacitance | Coss | | 135 | | pF | VDS=-15V,VGS=0V, F=1MHZ | 2 |
| Reverse Transfer Capacitance | Crss | | 121 | | pF | VDS=-15V,VGS=0V, F=1MHZ | 2 |
| Turn-on Delay Time | td(on) | | 10 | | nS | ID=-5A, VDS=-15V, VGS=-10V, RG=3.0Ω | 2 |
| Turn-on Rise Time | tr | | 18 | | nS | ID=-5A, VDS=-15V, VGS=-10V, RG=3.0Ω | 2 |
| Turn-Off Delay Time | td(off) | | 130 | | nS | ID=-5A, VDS=-15V, VGS=-10V, RG=3.0Ω | 2 |
| Turn-Off Fall Time | tf | | 90 | | nS | ID=-5A, VDS=-15V, VGS=-10V, RG=3.0Ω | 2 |
| Total Gate Charge | Qg | | 20 | | nC | VGS=-10V, VDS=-15V, ID=-8A | 2 |
| Gate-Source Charge | Qgs | | 1.9 | | nC | VGS=-10V, VDS=-15V, ID=-8A | 2 |
| Gate-Drain Charge | Qgd | | 4.2 | | nC | VGS=-10V, VDS=-15V, ID=-8A | 2 |
## CAD (KiCad official)
- Symbol: `AGM30P20M`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `agm30p20m-etched.step` / `agm30p20m-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `agm30p20m.step` / `agm30p20m.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [AGM-Semi datasheet](docs/agm30p20m-datasheet.pdf) (8 pp, sha256 `ed70e9ac8539d969`, retrieved 2026-10-26, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/agm30p20m-datasheet.pdf)