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AGM30P20D

AGM-Semi · MOSFETs · TO-252

AGM30P20D from AGM-Semi, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limit is ±20 V with threshold of -1.2 V to -2.2 V at ID=-250µA.
2 D passive Drain, also connected to the exposed tab; VDS rating is -30 V and continuous ID is -18 A at Tc=25°C (package limited).
3 S passive Source; body diode continuous source current is -18 A.

Key specifications

Parameter Value
Manufacturer AGM-Semi
Package TO-252
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS -30 V VGS=0V ID=-250μA 2
Zero Gate Voltage Drain Current IDSS -1 μA VDS=-30V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) -1.2 -2.2 V VDS=VGS,ID=-250μA 2
Drain-Source On-State Resistance RDS(on) 15.5 20 mΩ VGS=-10V, ID=-10A 2
Drain-Source On-State Resistance RDS(on) 22.5 30 mΩ VGS=-4.5V, ID=-5A 2
Source-Drain Current (Body Diode) ISD -18 A 2
Forward on Voltage VSD -1.2 V VGS=0V,IS=-10A 2
Drain-Source Voltage VDS -30 V VGS=0V 1
Gate-Source Voltage VGS -20 20 V VDS=0V 1
Drain Current-Continuous ID -18 A Tc=25℃ (Note 1) 1
Drain Current-Continuous ID -12 A Tc=100℃ 1
Maximum Power Dissipation PD 28 w Tc=25℃ 1
Maximum Power Dissipation PD 11 w Tc=100℃ 1
Avalanche energy EAS 90 mJ TJ=25℃, VDD=-15V, Vgs=-10V, ID=-19A, L=0.5mH, RG=25ohm (Note 3) 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance Junction-ambient (Steady State) RθJA 50 ℃/W Steady State (Note 1) 1
Thermal Resistance Junction-Case RθJC 1 4.4 ℃/W 1

CAD (KiCad official)

  • Symbol: AGM30P20D
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: agm30p20d-etched.step / agm30p20d-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); agm30p20d.step / agm30p20d.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: AGM-Semi datasheet (9 pp, sha256 af3aaf7f9bf632e2, retrieved 2026-11-05, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF