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Contents

README

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AGM30P100D

AGM Semi · MOSFETs · TO-252

AGM30P100D from AGM Semi, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limit is ±20 V and threshold VGS(th) is -1.2 V to -2.2 V at ID=-250µA.
2 D passive Drain, also connected to the exposed tab; drain-source voltage rating is -30 V and continuous drain current is -128 A (package limited) at Tc=25°C.
3 S passive Source; body diode continuous source current is up to -128 A.

Key specifications

Parameter Value
Manufacturer AGM Semi
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage (VGS=0V) VDS -30 V VGS=0V 1
Gate-Source Voltage (VDS=0V) VGS -20 20 V VDS=0V 1
Drain Current-Continuous ID -128 A Tc=25℃ (Note 1) 1
Drain Current-Continuous ID -95 A Tc=100℃ 1
Maximum Power Dissipation PD 100 W Tc=25℃ 1
Maximum Power Dissipation PD 40 W Tc=100℃ 1
Avalanche energy EAS 576 mJ See Note 3: TJ=25℃, VDD=-20V, Vgs=-10V, ID=-48A, L=0.5mH, RG=25ohm 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance Junction-ambient (Steady State) RθJA 50 ℃/W Steady State (Note 1) 1
Thermal Resistance Junction-Case RθJC 1.25 ℃/W 1
Drain-Source Breakdown Voltage BVDSS -30 V VGS=0V, ID=-250μA 2
Zero Gate Voltage Drain Current IDSS -1 μA VDS=-30V, VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 2
Gate Threshold Voltage VGS(th) -1.2 -1.6 -2.2 V VDS=VGS, ID=-250μA 2
Drain-Source On-State Resistance RDS(on) 3.7 6 mΩ VGS=-10V, ID=-15A 2
Drain-Source On-State Resistance RDS(on) 6.6 7.8 mΩ VGS=-4.5V, ID=-10A 2
Source-Drain Current (Body Diode) ISD -128 A 2
Forward on Voltage VSD -0.8 -1.2 V VGS=0V, IS=-15A 2

CAD (KiCad official)

  • Symbol: AGM30P100D
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: agm30p100d-etched.step / agm30p100d-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); agm30p100d.step / agm30p100d.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: AGM Semi datasheet (7 pp, sha256 314ea74b9bf9732e, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF