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AGM304S

AGM-Semi · MOSFETs · SOP-8

AGM304S from AGM-Semi, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S passive Source of the N-channel MOSFET (pin 1 marked on top view), tied with pins 2 and 3; body diode source-drain current rated up to 17 A.
2 S passive Source of the N-channel MOSFET, tied with pins 1 and 3; continuous drain current is 17 A at TA=25℃ (package limited).
3 S passive Source of the N-channel MOSFET, tied with pins 1 and 2; gate-source voltage limit is ±20 V.
4 G input Gate of the MOSFET with a threshold of 1.2 V min to 2.2 V max at ID=250μA and an absolute maximum VGS of ±20 V.
5 D passive Drain of the MOSFET, tied with pins 6, 7 and 8; drain-source voltage rated 30 V.
6 D passive Drain of the MOSFET, tied with pins 5, 7 and 8; RDS(on) is 5.2 mΩ typ at VGS=10 V, ID=12 A.
7 D passive Drain of the MOSFET, tied with pins 5, 6 and 8; pulsed drain current is 68 A.
8 D passive Drain of the MOSFET, tied with pins 5, 6 and 7; breakdown voltage BVDSS is 30 V min at ID=250μA.

Key specifications

Parameter Value
Manufacturer AGM-Semi
Package SOP-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 30 V VGS=0V ID=250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=30V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) 1.2 1.6 2.2 V VDS=VGS,ID=250μA 2
Drain-Source On-State Resistance RDS(on) 5.2 6.8 mΩ VGS=10V, ID=12A 2
Drain-Source On-State Resistance RDS(on) 6 8.5 mΩ VGS=4.5V, ID=10A 2
Source-Drain Current (Body Diode) ISD 17 A 2
Forward on Voltage VSD 1.2 V VGS=0V,IS=12A 2
Drain-Source Voltage VDS 30 V VGS=0V, TA=25℃ 1
Gate-Source Voltage VGS -20 20 V VDS=0V, TA=25℃ 1
Continuous Drain Current ID 17 A TA=25℃ 1
Continuous Drain Current ID 12 A TA=100℃ 1
Maximum Power Dissipation PD 2.5 W TA=25℃ 1
Maximum Power Dissipation PD 1 W TA=100℃ 1
Avalanche Energy EAS 272 mJ TJ=25℃,VDD=20V,Vgs=10V,ID=33A,L=0.5mH,RG=25ohm 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance Junction-ambient RθJA 50 ℃/W Steady State 1
Forward Transconductance gFS 16 S VDS=5V,ID=10A 2
Input Capacitance Ciss 1500 pF VDS=15V,VGS=0V,F=1MHZ 2
Output Capacitance Coss 280 pF VDS=15V,VGS=0V,F=1MHZ 2
Reverse Transfer Capacitance Crss 140 pF VDS=15V,VGS=0V,F=1MHZ 2
Gate resistance Rg 1.3 Ω VGS=0V, VDS=0V,f=1.0MHz 2
Turn-on Delay Time td(on) 20 nS VGS=10V,VDS=15V, RL=0.75Ω,RGEN=3.3Ω 2
Turn-on Rise Time tr 15 nS VGS=10V,VDS=15V, RL=0.75Ω,RGEN=3.3Ω 2
Turn-Off Delay Time td(off) 60 nS VGS=10V,VDS=15V, RL=0.75Ω,RGEN=3.3Ω 2
Turn-Off Fall Time tf 11 nS VGS=10V,VDS=15V, RL=0.75Ω,RGEN=3.3Ω 2
Total Gate Charge Qg 16 nC VGS=10V, VDS=25V, ID=10A 2
Gate-Source Charge Qgs 8 nC VGS=10V, VDS=25V, ID=10A 2
Gate-Drain Charge Qgd 5 nC VGS=10V, VDS=25V, ID=10A 2

CAD (KiCad official)

  • Symbol: AGM304S
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: agm304s-etched.step / agm304s-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); agm304s.step / agm304s.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: AGM-Semi datasheet (7 pp, sha256 6653ee25072f7d6d, retrieved 2026-10-24, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF