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AGM18N10S

AGM-Semi · MOSFETs · SOP-8

AGM18N10S from AGM-Semi, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S passive Source of the N-channel MOSFET, one of three source pins (1-3) tied together.
2 S passive Source of the N-channel MOSFET, one of three source pins (1-3) tied together.
3 S passive Source of the N-channel MOSFET, one of three source pins (1-3) tied together.
4 G input Gate of the N-channel MOSFET; VGS rated ±20 V maximum, threshold 1.2 V min to 2.2 V max at 250 µA.
5 D passive Drain of the N-channel MOSFET, one of four drain pins (5-8) tied together; VDS rated 100 V maximum.
6 D passive Drain of the N-channel MOSFET, one of four drain pins (5-8) tied together; VDS rated 100 V maximum.
7 D passive Drain of the N-channel MOSFET, one of four drain pins (5-8) tied together; VDS rated 100 V maximum.
8 D passive Drain of the N-channel MOSFET, one of four drain pins (5-8) tied together; VDS rated 100 V maximum.

Key specifications

Parameter Value
Manufacturer AGM-Semi
Package SOP-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 100 V VGS=0V 1
Gate-Source Voltage VGS -20 20 V VDS=0V 1
Drain Current-Continuous ID 12 A TA=25℃ 1
Drain Current-Continuous ID 8 A TA=100℃ 1
Drain Current-Pulsed IDM 48 A 1
Maximum Power Dissipation PD 2.5 w TA=25℃ 1
Maximum Power Dissipation PD 1 w TA=100℃ 1
Avalanche energy EAS 56 mJ TJ=25℃,VDD=50V,Vgs=10V ID=15A, L=0.5mH,RG=25ohm 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance Junction-ambient RθJA 50 ℃/W Steady State 1
Drain-Source Breakdown Voltage BVDSS 100 V VGS=0V ID=250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=100V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) 1.2 1.8 2.2 V VDS=VGS,ID=250μA 2
Drain-Source On-State Resistance RDS(on) 17 21 mΩ VGS=10V, ID=12A 2
Drain-Source On-State Resistance RDS(on) 22 26 mΩ VGS=4.5V, ID=8A 2
Source-Drain Current (Body Diode) ISD 12 A 2
Forward on Voltage VSD 1.2 V VGS=0V,IS=12A 2
Forward Transconductance gFS 12 S VDS=5V,ID=8A 2
Input Capacitance Ciss 573 pF VDS=50V,VGS=0V, F=1MHZ 2
Output Capacitance Coss 166 pF VDS=50V,VGS=0V, F=1MHZ 2
Reverse Transfer Capacitance Crss 5.3 pF VDS=50V,VGS=0V, F=1MHZ 2
Gate resistance Rg 4.5 Ω VGS=0V, VDS=0V,f=1.0MHz 2
Turn-on Delay Time td(on) 13 nS VGS=10V,VDS=50V, ID=10A,RGEN=4Ω 2
Turn-on Rise Time tr 16 nS VGS=10V,VDS=50V, ID=10A,RGEN=4Ω 2
Turn-Off Delay Time td(off) 23 nS VGS=10V,VDS=50V, ID=10A,RGEN=4Ω 2
Turn-Off Fall Time tf 6 nS VGS=10V,VDS=50V, ID=10A,RGEN=4Ω 2
Total Gate Charge Qg 12.5 nC VGS=10V, VDS=50V, ID=10A 2
Gate-Source Charge Qgs 1.9 nC VGS=10V, VDS=50V, ID=10A 2
Gate-Drain Charge Qgd 3 nC VGS=10V, VDS=50V, ID=10A 2
Reverse Recovery Time trr 43 ns IF=12A , dI/dt=100A/µs , TJ=25℃ 2
Reverse Recovery Charge Qrr 87 nc IF=12A , dI/dt=100A/µs , TJ=25℃ 2

CAD (KiCad official)

  • Symbol: AGM18N10S
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: agm18n10s-etched.step / agm18n10s-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); agm18n10s.step / agm18n10s.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: AGM-Semi datasheet (9 pp, sha256 73d6c3731420c12a, retrieved 2026-10-30, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF