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AGM18N10I

AGM-Semi · MOSFETs · TO-251

AGM18N10I from AGM-Semi, in a TO-251. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; the datasheet rates gate-source voltage at ±20 V, with a threshold of 1.2 V min, 1.7 V typ and 2.2 V max at ID=250 µA.
2 D passive Drain, also connected to the metal tab; rated for 100 V drain-source and 40 A continuous (package limited) at Tc=25 °C.
3 S passive Source; body-diode source-drain current is rated at 40 A.

Key specifications

Parameter Value
Manufacturer AGM-Semi
Package TO-251
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 100 V VGS=0V 1
Gate-Source Voltage VGS -20 20 V VDS=0V 1
Drain Current-Continuous ID 40 A Tc=25℃ (Note 1) 1
Drain Current-Continuous ID 32 A Tc=100℃ 1
Maximum Power Dissipation PD 30 w Tc=25℃ 1
Maximum Power Dissipation PD 12 w Tc=100℃ 1
Avalanche energy EAS 22 mJ Note 3: TJ=25℃,VDD=50V,Vgs=10V ID=15A,L=0.5mH,RG=25ohm 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance Junction-ambient (Steady State) RθJA 62 ℃/W Steady State (Note 1) 1
Thermal Resistance Junction-Case RθJC 4.2 ℃/W 1
Drain-Source Breakdown Voltage BVDSS 100 V VGS=0V ID=250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=100V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) 1.2 1.7 2.2 V VDS=VGS,ID=250μA 2
Drain-Source On-State Resistance RDS(on) 16 20 mΩ VGS=10V, ID=12A 2
Drain-Source On-State Resistance RDS(on) 20 25 mΩ VGS=4.5V, ID=8A 2
Source-Drain Current (Body Diode) ISD 40 A 2
Forward on Voltage VSD 1.2 V VGS=0V,IS=12A 2

CAD (KiCad official)

  • Symbol: AGM18N10I
  • Footprint: Package_TO_SOT_THT:TO-251-3_Vertical
  • 3D model: TO-251 (KiCad packages3D, STEP)
  • 3D model files: agm18n10i-etched.step / agm18n10i-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); agm18n10i.step / agm18n10i.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: AGM-Semi datasheet (8 pp, sha256 1a759f03d99a670d, retrieved 2026-11-07, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF