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AGM15T06H

AGM Semi · MOSFETs · TO-263

AGM15T06H from AGM Semi, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limited to ±20 V, threshold 2.0 to 4.0 V at ID=250 μA.
2 D passive Drain, also the exposed tab; drain-source voltage rated 150 V and continuous current 160 A (package limited).
3 S passive Source; body diode source-drain current up to 160 A.

Key specifications

Parameter Value
Manufacturer AGM Semi
Package TO-263
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 150 V VGS=0V ID=250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=150V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) 2 2.9 4 V VDS=VGS,ID=250μA 2
Drain-Source On-State Resistance RDS(on) 6 7.5 mΩ VGS=10V, ID=20A 2
Source-Drain Current (Body Diode) ISD 160 A 2
Forward on Voltage VSD 1.2 V 2
Drain-Source Voltage VDS 150 V VGS=0V 1
Gate-Source Voltage VGS -20 20 V VDS=0V 1
Drain Current-Continuous ID 160 A Tc=25℃ (Note 1) 1
Drain Current-Continuous ID 95 A Tc=100℃ 1
Drain Current-Pulsed IDM (pluse) 64 A Note 2 (printed as '64 (Note 2) 0'; stray '0' may be part of the value, see review_required) 1
Maximum Power Dissipation PD 300 w Tc=25℃ 1
Maximum Power Dissipation PD 150 w Tc=100℃ 1
Avalanche energy EAS 968 mJ Note 3 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 175 ℃ 1
Thermal Resistance Junction-ambient (Steady State) RθJA 60 ℃/W Steady State 1
Thermal Resistance Junction-Case RθJC 0.5 ℃/W 1

CAD (KiCad official)

  • Symbol: AGM15T06H
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: TO-263 (KiCad packages3D, STEP)
  • 3D model files: agm15t06h-etched.step / agm15t06h-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); agm15t06h.step / agm15t06h.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: AGM Semi datasheet (10 pp, sha256 b0794d7dcb3e466f, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF