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AG32VH407RCT6

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AGM Microelectronics Microcontrollers (MCU/MPU/SOC), LQFP-64(10x10). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentembedded processors & controllersag32vh407rct6factory-2.0.0extractor-text
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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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AG32VH407RCT6

AGM Microelectronics · Microcontrollers (MCU/MPU/SOC) · LQFP-64(10x10)

AG32VH407RCT6 from AGM Microelectronics, in a LQFP-64(10x10). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VBAT power_in Battery backup supply input (VBAT).
2 PIN_2 bidirectional General-purpose IO with RTC function.
3 OSC32_IN input 32 kHz low-speed oscillator (LSE) input.
4 OSC32_OUT output 32 kHz low-speed oscillator (LSE) output.
5 OSC_IN input High-speed oscillator (HSE) input.
6 OSC_OUT output High-speed oscillator (HSE) output.
7 NRST input Active-low system reset input.
8 RWDS bidirectional RWDS signal; must be shorted externally to pin 22 (RWDS).
9 PIN_9 bidirectional General-purpose IO with ADC_IN11 analog input.
10 PIN_10 bidirectional General-purpose IO with ADC_IN12 analog input.
11 PIN_11 bidirectional General-purpose IO with ADC_IN13 analog input.
12 GND power_in Ground.
13 VDD33 power_in 3.3 V supply; must be isolated from other power sources on the PCB using a magnetic bead.
14 PIN_14 bidirectional General-purpose IO with WKUP, ADC_IN0 and CMP_PA0 functions.
15 PIN_15 bidirectional General-purpose IO with ADC_IN1 and CMP_PA1 functions.
16 PIN_16 bidirectional General-purpose IO with ADC_IN2 and CMP_PA2 functions.
17 PIN_17 bidirectional General-purpose IO with ADC_IN3 and CMP_PA3 functions.
18 GND power_in Ground.
19 VDD33 power_in 3.3 V supply; must be isolated from other power sources on the PCB using a magnetic bead.
20 PIN_20 bidirectional General-purpose IO with ADC_IN5, CMP_PA5 and DAC1 functions.
21 PIN_21 bidirectional General-purpose IO with ADC_IN7 analog input.
22 RWDS bidirectional RWDS signal; must be shorted externally to pin 8 (RWDS).
23 PIN_23 bidirectional General-purpose IO with ADC_IN15 analog input.
24 PIN_24 bidirectional General-purpose IO with ADC_IN9 analog input.
25 PIN_25 bidirectional General-purpose IO with BOOT1 function.
26 PIN_26 bidirectional General-purpose IO.
27 PIN_27 bidirectional General-purpose IO.
28 PIN_28 bidirectional General-purpose IO.
29 PIN_29 bidirectional General-purpose IO.
30 VDD33 power_in 3.3 V supply; must be isolated from other power sources on the PCB using a magnetic bead.
31 GND power_in Ground.
32 VDD33 power_in 3.3 V supply; must be isolated from other power sources on the PCB using a magnetic bead.
33 PIN_33 bidirectional General-purpose IO.
34 PIN_34 bidirectional General-purpose IO.
35 PIN_35 bidirectional General-purpose IO.
36 PIN_36 bidirectional General-purpose IO.
37 PIN_37 bidirectional General-purpose IO.
38 PIN_38 bidirectional General-purpose IO.
39 PIN_39 bidirectional General-purpose IO.
40 PIN_40 bidirectional General-purpose IO.
41 PIN_41 bidirectional General-purpose IO.
42 PIN_42 bidirectional General-purpose IO with UART0_TX function.
43 PIN_43 bidirectional General-purpose IO with UART0_RX function.
44 PIN_44 bidirectional General-purpose IO with USBDM function.
45 PIN_45 bidirectional General-purpose IO with USBDP function.
46 PIN_46 bidirectional General-purpose IO with JTMS function.
47 PIN_47 bidirectional General-purpose IO.
48 VDD33 power_in 3.3 V supply; must be isolated from other power sources on the PCB using a magnetic bead.
49 PIN_49 bidirectional General-purpose IO with JTCK function.
50 PIN_50 bidirectional General-purpose IO with JTDI function.
51 PIN_51 bidirectional General-purpose IO.
52 PIN_52 bidirectional General-purpose IO.
53 PIN_53 bidirectional General-purpose IO.
54 PIN_54 bidirectional General-purpose IO.
55 PIN_55 bidirectional General-purpose IO with JTDO function.
56 PIN_56 bidirectional General-purpose IO with JNTRST function.
57 PIN_57 bidirectional General-purpose IO.
58 PIN_58 bidirectional General-purpose IO.
59 PIN_59 bidirectional General-purpose IO.
60 BOOT0 input BOOT0 boot mode selection input.
61 PIN_61 bidirectional General-purpose IO.
62 PIN_62 bidirectional General-purpose IO.
63 GND power_in Ground.
64 VDD33 power_in 3.3 V supply; must be isolated from other power sources on the PCB using a magnetic bead.

Key specifications

Parameter Value
Manufacturer AGM Microelectronics
Package LQFP-64(10x10)
Category Embedded Processors & Controllers
Pins 64

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
External voltage range VDD 3.465 V VSS - 0.3 min; max VSS + 3.465 294
External analog supply voltage VDDA 3.465 V VSSA - 0.3 min; max VSSA + 3.465 294
External battery supply voltage VBAT 3.465 V VSS - 0.3 min; max VSS + 3.465 294
Input voltage on I/O VIN 3.465 V VSS - 0.3 min; max VSS + 3.465 294
Maximum current for GPIO pins Iio 25 mA 294
Injected current on I/O Iinj -5 5 mA 294
Operating temperature range TA -40 85 °C 294
Storage temperature range TSTG -55 150 °C 294
Maximum junction temperature TJ 125 °C 294
Supply voltage VDD 3.135 3.3 3.465 V 294
Analog supply voltage VDDA 3.135 3.3 3.465 V 294
Battery supply voltage VBAT 2.2 3.465 V 294
ESD human body model VESD(HBM) 2000 V 295
ESD charge device model VESD(CDM) 500 V 295
Latch-up LU 100 mA 295
Power on reset threshold Vpor 2 2.2 2.4 V 296
Power down reset threshold Vpdr 1.8 2 2.2 V 296
PDR hysteresis Vhyst 0.2 V 296
Reset temporization Trsttemp 4 ms 296
HSE oscillator frequency f_OSC_IN 4 8 26 MHz VDD=3.3V 296
HSE feedback resistor RF 1 MΩ 296
HSE load capacitance C 20 30 pF 296
HSE oscillator transconductance gm 25 mA/V 296
HSE duty cycle Dosc_out 45 50 55 % 296
HSE startup time T_su_hse 2 mS VDD is stabilized 296
LSE oscillator frequency f_LSE 32.768 1000 KHz VDD=VBAT=3.3V 297
LSE feedback resistor RF 10 MΩ 297
LSE load capacitance C 15 pF 297
LSE oscillator transconductance gm 10 uA/V 297
LSE duty cycle Dosc_out 45 50 55 % 297
LSE startup time T_su_lse 3 S VDD is stabilized 297
HSI oscillator frequency f_HSI 10 20 40 MHz VDD=3.3V 298
HSI duty cycle Duty_HSI 45 50 55 % 298
HSI oscillator startup time T_su_HSI 1 2 μs 298
PLL input clock fPLL_IN 4 20 50 MHz 298
PLL input clock duty cycle 40 50 60 % 298
PLL multiplier output clock fPLL_OUT 2 200 300 MHz 298
PLL lock time tLOCK 400 μs 298
PLL cycle-to-cycle jitter Jitter 400 ps 298
Flash endurance PECYC 100 kcycles TA=-40°C ~ +85°C 299
Flash data retention time tRET 20 years TA=125°C 299
Word programming time tPROG 2 3 ms TA=-40°C ~ +85°C 299
Page erase time tERASE 8 20 ms TA=-40°C ~ +85°C 299
Mass erase time tMERASE 8 20 ms TA=-40°C ~ +85°C 299
Standard IO low level input voltage VIL -0.3 0.8 V VDD ≥3.135V 299
Standard IO high level input voltage VIH 1.5 3.465 V VDD ≥3.135V 299
Low level output voltage VOL 0.2 V VDD ≥3.135V 299
High level output voltage VOH 2.8 V VDD ≥3.135V 299
Internal pull-up resistor RPU 30 40 50 kΩ VIN=VSS 299
Internal pull-down resistor RPD 30 40 50 kΩ VIN=VDD 299
ADC operating voltage VDDA 3.135 3.3 3.465 V 300
ADC clock fADC 0.5 13 MHz 300
ADC sampling rate fs 1 MHz 300
ADC conversion time tconv 1 20 μs 300
ADC input sampling switch resistance RADC 0.5 kΩ 300
ADC input sampling capacitance CADC 8 pF 300
ADC startup time tsu 2 μs 300
DAC reference supply voltage VREFP 3.135 3.3 3.465 V VREFP should always below VDDA 300
DAC load resistance RLOAD 5 kΩ Resistive load vs. VSSA with buffer ON 300
DAC load capacitance CLOAD 50 pF No pin/pad capacitance included 300
Comparator startup time tstart 10 μs VDDA ≥3.135 V 301
Comparator propagation delay tD 40 ns VDDA ≥3.135 V, full range step with 100 mV overdrive 301
Comparator offset error VOFFSET -25 25 mV VDDA ≥3.135 V 301
NRST input low level voltage VIL(NRST) 0.2 V max is 0.2VDD 303

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing pet Time-base unit describes how the update event (UEV) is generated with respect to the counter overflows/underflows. It is actually generated only when the repetition counter has 78

CAD (KiCad official)

  • Symbol: AG32VH407RCT6
  • Footprint: Package_QFP:LQFP-64_10x10mm_P0.5mm
  • 3D model: LQFP-64(10x10) (KiCad packages3D, STEP)
  • 3D model files: ag32vh407rct6-etched.step / ag32vh407rct6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ag32vh407rct6.step / ag32vh407rct6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: AGM Microelectronics datasheet (312 pp, sha256 327741ff0f0e8c52, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF