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Ray Publish 0.1.0 29d55d6 8h ago

AF1206F5.00TM

AEM · Disposable Fuses · 1206

AF1206F5.00TM from AEM, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Fuse termination (copper with nickel and tin plating); non-polarized, 5.00 A rating, 32 VDC, 50A@32VDC interrupting rating, nominal DCR 0.013 ohm.
2 2 passive Second fuse termination (copper with nickel and tin plating); non-polarized and interchangeable with the other terminal, 5.00 A, 32 VDC.

Key specifications

Parameter Value
Manufacturer AEM
Package 1206
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Clearing time at 100% of current rating 4 hour 100% of current rating, clearing time at 25°C 1
Clearing time at 250% of current rating 5 s 250% of current rating, clearing time at 25°C 1
Operating temperature range -55 125 °C with derating 1
Life: voltage drop change -20 20 % 25°C, 2000 hours, 80% rated current (75% for < 1 A) 6
Reflow & bend: DCR change 20 % 3 reflows at 245°C followed by 2 mm bend 6
Soldering heat resistance: DCR change 20 % 260°C, 10 seconds 6
Thermal shock: DCR change 10 % -65°C to +125°C, 100 cycles 6
Mechanical vibration: DCR change 10 % 5-3000 Hz, 0.4 inch double amplitude or 30 G peak 6
Mechanical shock: DCR change 10 % 1500 G, 0.5 ms, half-sine shocks 6
Salt spray: DCR change 10 % 5% salt solution, 48 hour exposure 6
Moisture resistance: DCR change 15 % 10 cycles 6
Reflow profile: preheat temperature Tsmin 150 °C Pb-free assembly, preheat/soak 7
Reflow profile: preheat temperature Tsmax 200 °C Pb-free assembly, preheat/soak 7
Reflow profile: preheat time (Tsmin to Tsmax) ts 60 120 s Pb-free assembly, from Tsmin to Tsmax 7
Reflow profile: ramp-up rate (TL to Tp) 3 °C/second Pb-free assembly 7
Reflow profile: time above liquidous tL 60 150 s maintained above TL 7
Reflow profile: ramp-down rate (Tp to TL) 6 °C/second Pb-free assembly 7
Reflow profile: time from 25°C to peak temperature 8 minute Pb-free assembly 7
Reflow profile: peak package body temperature Tp 260 °C Pb-free assembly; time within 5°C of Tc for 30 s 7
Reflow profile: liquidous temperature TL 217 °C Pb-free assembly 7
Storage: maximum ambient temperature (packaging) 35 °C storage of packaged parts 5
Storage: maximum relative humidity 75 % storage, sealed vacuum foil bag with desiccant 5
Current rating 5 A AF1206F5.00TM 2
Nominal DCR DCR 0.013 Ω resistance measured at ≤10% of rated current and 25°C ambient 2
Nominal I2t I2t 5.4 A2s melting I2t calculated at 0.001 second pre-arcing time 2
Voltage rating 32 VDC for 5.00 A row of part table 2
Interrupting rating 50 A 50A@32VDC 2

CAD (KiCad official)

  • Symbol: AF1206F5.00TM
  • Footprint: Fuse:Fuse_1206_3216Metric
  • 3D model: 1206 (KiCad packages3D, STEP)
  • 3D model files: af1206f5-00tm-etched.step / af1206f5-00tm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); af1206f5-00tm.step / af1206f5-00tm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: AEM datasheet (8 pp, sha256 d0607b60fdbd0072, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF