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ADUM140E1BRZ
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Analog Devices Digital Isolators, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownADUM140E1BRZ
Analog Devices · Digital Isolators · SOIC-16
ADUM140E1BRZ from Analog Devices, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD1 | power_in | Supply voltage for isolator side 1. |
| 2 | GND1 | power_in | Ground reference for isolator side 1. |
| 3 | VIA | input | Logic input A. |
| 4 | VIB | input | Logic input B. |
| 5 | VIC | input | Logic input C. |
| 6 | VID | input | Logic input D. |
| 7 | NIC | unconnected | No internal connection; leave this pin floating. |
| 8 | GND1 | power_in | Ground reference for isolator side 1. |
| 9 | GND2 | power_in | Ground reference for isolator side 2. |
| 10 | VE2 | input | Active-high output enable 2; outputs VOA, VOB, VOC and VOD are enabled when high or disconnected and go to high-Z when low. |
| 11 | VOD | tri_state | Logic output D, high-Z when VE2 is low. |
| 12 | VOC | tri_state | Logic output C, high-Z when VE2 is low. |
| 13 | VOB | tri_state | Logic output B, high-Z when VE2 is low. |
| 14 | VOA | tri_state | Logic output A, high-Z when VE2 is low. |
| 15 | GND2 | power_in | Ground reference for isolator side 2. |
| 16 | VDD2 | power_in | Supply voltage for isolator side 2. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | SOIC-16 |
| Category | Communication Interface Chip/UART/485/232 |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Propagation Delay (5 V) | tPHL, tPLH | 7.2 | 13 | ns | 50% input to 50% output; 4.5 V ≤ VDDx ≤ 5.5 V (min 4.8 printed) | 4 | |
| Pulse Width Distortion (5 V) | PWD | 0.5 | 3 | ns | /tPLH − tPHL/ | 4 | |
| Propagation Delay Skew (5 V) | tPSK | 6.1 | ns | Between any two units at the same temperature, voltage, and load | 4 | ||
| Channel Matching Codirectional (5 V) | tPSKCD | 0.5 | 3 | ns | 4 | ||
| Channel Matching Opposing Direction (5 V) | tPSKOD | 0.5 | 3 | ns | 4 | ||
| Pulse Width (5 V) | PW | 6.6 | ns | Within pulse width distortion (PWD) limit | 4 | ||
| Data Rate (5 V) | 150 | Mbps | Within PWD limit | 4 | |||
| Output Voltage Logic Low (5 V) | VOL | 0 | 0.1 | V | IOx = 20 µA, VIx = VIxL | 4 | |
| Output Voltage Logic Low (5 V) | VOL | 0.2 | 0.4 | V | IOx = 4 mA, VIx = VIxL | 4 | |
| Input Current per Channel | II | -10 | 0.01 | 10 | µA | 0 V ≤ VIx ≤ VDDx | 4 |
| VE2 Enable Input Pull-Up Current | IPU | -10 | -3 | µA | VE2 = 0 V | 4 | |
| Tristate Output Current per Channel | IOZ | -10 | 0.01 | 10 | µA | 0 V ≤ VOx ≤ VDDx | 4 |
| Quiescent Supply Current Side 1 (5 V) | IDD1 (Q) | 1.2 | 2.2 | mA | ADuM140E; VI = 1 (E1) | 4 | |
| Quiescent Supply Current Side 2 (5 V) | IDD2 (Q) | 2 | 2.72 | mA | ADuM140E; VI = 1 (E1) | 4 | |
| Quiescent Supply Current Side 1 (5 V) | IDD1 (Q) | 12 | 20 | mA | ADuM140E; VI = 0 (E1) | 4 | |
| Quiescent Supply Current Side 2 (5 V) | IDD2 (Q) | 2 | 2.92 | mA | ADuM140E; VI = 0 (E1) | 4 | |
| Common-Mode Transient Immunity High | /CMH/ | 75 | 100 | kV/µs | VIx = VDDx, VCM = 1000 V, transient magnitude = 800 V | 5 | |
| Common-Mode Transient Immunity Low | /CML/ | 75 | 100 | kV/µs | VIx = 0 V, VCM = 1000 V, transient magnitude = 800 V | 5 | |
| Propagation Delay (3.3 V) | tPHL, tPLH | 6.8 | 14 | ns | 50% input to 50% output; 3.0 V ≤ VDDx ≤ 3.6 V (min 4.8 printed) | 6 | |
| Pulse Width Distortion (3.3 V) | PWD | 0.7 | 3 | ns | /tPLH − tPHL/ | 6 | |
| Propagation Delay Skew (3.3 V) | tPSK | 7.5 | ns | Between any two units at the same temperature, voltage, and load | 6 | ||
| Propagation Delay (2.5 V) | tPHL, tPLH | 7 | 14 | ns | 50% input to 50% output; 2.25 V ≤ VDDx ≤ 2.75 V (min 5.0 printed) | 8 | |
| Pulse Width Distortion (2.5 V) | PWD | 0.7 | 3 | ns | /tPLH − tPHL/ | 8 | |
| Propagation Delay Skew (2.5 V) | tPSK | 6.8 | ns | Between any two units at the same temperature, voltage, and load | 8 | ||
| Propagation Delay (1.8 V) | tPHL, tPLH | 8.7 | 15 | ns | 50% input to 50% output; 1.7 V ≤ VDDx ≤ 1.9 V (min 5.8 printed) | 10 | |
| Pulse Width Distortion (1.8 V) | PWD | 0.7 | 3 | ns | /tPLH − tPHL/ | 10 | |
| Propagation Delay Skew (1.8 V) | tPSK | 7 | ns | Between any two units at the same temperature, voltage, and load | 10 | ||
| Propagation Delay Minimum (5 V) | tPHL, tPLH | 4.8 | ns | 50% input to 50% output | 4 | ||
| Output Rise/Fall Time (5 V) | tR/tF | 2.5 | ns | 10% to 90% | 5 | ||
| PWD Change vs. Temperature (5 V) | 1.5 | ps/°C | 4 | ||||
| Jitter (5 V) | 490 | ps p-p | See the Jitter Measurement section | 4 | |||
| UVLO Positive VDDx Threshold | VDDxUV+ | 1.6 | V | 5 | |||
| UVLO Negative VDDx Threshold | VDDxUV− | 1.5 | V | 5 | |||
| Operating Temperature | TA | -40 | 125 | °C | 17 | ||
| Supply Voltages | VDD1, VDD2 | 1.7 | 5.5 | V | 17 | ||
| Input Signal Rise and Fall Times | 1 | ms | 17 | ||||
| Storage Temperature Range | TST | -65 | 150 | °C | TA = 25°C | 18 | |
| Ambient Operating Temperature Range | TA | -40 | 125 | °C | 18 | ||
| Maximum Fault Junction Temperature per DIN V VDE V 0884-11 | TJ | 150 | °C | 18 | |||
| Maximum Fault Junction Temperature per Mold Compound | TJ | 300 | °C | 18 | |||
| Supply Voltages | VDD1, VDD2 | -0.5 | 7 | V | 18 | ||
| Input Voltages | VIA, VIB, VIC, VID, VE1, VE2, DISABLE1, DISABLE2 | -0.5 | V | Max is VDDI1 + 0.5 V | 18 | ||
| Output Voltages | VOA, VOB, VOC, VOD | -0.5 | V | Max is VDDO2 + 0.5 V | 18 | ||
| Side 1 Output Current | IO1 | -10 | 10 | mA | Average output current per pin | 18 | |
| Side 2 Output Current | IO2 | -10 | 10 | mA | Average output current per pin | 18 | |
| Common-Mode Transients | -150 | 150 | kV/µs | Across the insulation barrier | 18 | ||
| IC Junction to Ambient Thermal Resistance, R-16 SOIC_N | θJA | 76 | °C/W | Thermocouple located at center of package underside | 13 | ||
| Rated Dielectric Insulation Voltage, R-16 SOIC_N | 3000 | V rms | 1-minute duration | 12 | |||
| Capacitance (Input to Output) | CI-O | 2.2 | pF | f = 1 MHz | 13 | ||
| Input Capacitance | CI | 4 | pF | From any input data pin to ground | 13 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | pC | In accordance with DIN EN IEC 60747-17 (VDE 0884-17), each ADuM140D/ADuM140E/ADuM141D/ADuM141E/ADuM142D/ADuM142E in the R-16 narrow body [SOIC_N] package is proof tested by applying an insulation test | 14 |
CAD (KiCad official)
- Symbol:
ADUM140E1BRZ - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16 (KiCad packages3D, STEP)
- 3D model files:
adum140e1brz-etched.step/adum140e1brz-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);adum140e1brz.step/adum140e1brz.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices datasheet (31 pp, sha256
d8dc27340f57bada, retrieved 2026-10-31, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).