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ADUM140E0BRQZ

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Analog Devices Digital Isolators, QSOP-16-150mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentcommunication interface chip-uart-485-232adum140e0brqzfactory-2.0.0extractor-text

Verified ADUM140E0BRQZ

by Ray · last 31 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

31 Oct 2026RayPublished by the parts factory: tier mfr, 16 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: ADUM140E0BRQZ · QSOP-16-150mil · 16 pins
  • ✓copper: 16 copper pads, none touching another net
  • ✓datasheet: all 16 pin names found in the 31-page datasheet
  • ✓distributor: lcsc C660403, digikey 505-ADUM140E0BRQZ-ND, mouser 584-ADUM140E0BRQZ
  • ✓family: QSOP-16_3.9x4.9mm_P0.635mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-xpzlamru/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 16 pins = 16 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 16 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ adum140e0brqz.kicad_sym✓ adum140e0brqz.kicad_mod✓ adum140e0brqz.step
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Ray Publish 0.1.0 3af6660 3d ago

ADUM140E0BRQZ

Analog Devices · Digital Isolators · QSOP-16-150mil

ADUM140E0BRQZ from Analog Devices, in a QSOP-16-150mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD1 power_in Supply voltage for isolator side 1, with a 0.01 µF to 0.1 µF bypass capacitor recommended between pin 1 and pin 2.
2 GND1 power_in Ground reference for isolator side 1, shorted internally with pin 8 on the same side.
3 VIA input Logic input A on side 1.
4 VIB input Logic input B on side 1.
5 VIC input Logic input C on side 1.
6 VID input Logic input D on side 1.
7 NIC unconnected No internal connection; leave this pin floating.
8 GND1 power_in Ground reference for isolator side 1, second ground pin of side 1.
9 GND2 power_in Ground reference for isolator side 2, second ground pin of side 2.
10 VE2 input Active-high output enable 2: outputs VOA, VOB, VOC and VOD are enabled when VE2 is high or disconnected, and go to high-Z when VE2 is low.
11 VOD output Logic output D on side 2.
12 VOC output Logic output C on side 2.
13 VOB output Logic output B on side 2.
14 VOA output Logic output A on side 2.
15 GND2 power_in Ground reference for isolator side 2, with a bypass capacitor recommended between pin 15 and pin 16.
16 VDD2 power_in Supply voltage for isolator side 2, with a 0.01 µF to 0.1 µF bypass capacitor recommended between pin 15 and pin 16.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package QSOP-16-150mil
Category Communication Interface Chip/UART/485/232
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Pulse Width PW 6.6 ns Within pulse width distortion (PWD) limit 4
Data Rate 150 Mbps Within PWD limit 4
Propagation Delay (5 V) tPHL, tPLH 4.8 7.2 13 ns 50% input to 50% output 4
Pulse Width Distortion (5 V) PWD 0.5 3 ns /tPLH − tPHL/ 4
Propagation Delay Skew (5 V) tPSK 6.1 ns Between any two units at the same temperature, voltage, and load 4
Channel Matching Codirectional (5 V) tPSKCD 0.5 3 ns 4
Channel Matching Opposing Direction (5 V) tPSKOD 0.5 3 ns 4
Logic Low Output Voltage (5 V) VOL 0 0.1 V IOx = 20 µA, VIx = VIxL 4
Logic Low Output Voltage (5 V) VOL 0.2 0.4 V IOx = 4 mA, VIx = VIxL 4
Input Current per Channel II -10 0.01 10 µA 0 V ≤ VIx ≤ VDDx 4
VE2 Enable Input Pull-Up Current IPU -10 -3 µA VE2 = 0 V 4
Tristate Output Current per Channel IOZ -10 0.01 10 µA 0 V ≤ VOx ≤ VDDx 4
Quiescent Supply Current Side 1 (5 V) IDD1 (Q) 1.2 2.2 mA VI = 0 (E0) 4
Quiescent Supply Current Side 2 (5 V) IDD2 (Q) 2 2.72 mA VI = 0 (E0) 4
Quiescent Supply Current Side 1 (5 V) IDD1 (Q) 12 20 mA VI = 1 (E0) 4
Quiescent Supply Current Side 2 (5 V) IDD2 (Q) 2 2.92 mA VI = 1 (E0) 4
Common-Mode Transient Immunity High /CMH/ 75 100 kV/µs VIx = VDDx, VCM = 1000 V, transient magnitude = 800 V 5
Common-Mode Transient Immunity Low /CML/ 75 100 kV/µs VIx = 0 V, VCM = 1000 V, transient magnitude = 800 V 5
Propagation Delay (3.3 V) tPHL, tPLH 4.8 6.8 14 ns 50% input to 50% output 6
Supply Voltages VDD1, VDD2 1.7 5.5 V 17
Operating Temperature TA -40 125 °C 17
Input Signal Rise and Fall Times 1 ms 17
Storage Temperature Range TST -65 150 °C TA = 25°C 18
Ambient Operating Temperature Range TA -40 125 °C TA = 25°C 18
Maximum Fault Junction Temperature per DIN V VDE V 0884-11 TJ 150 °C 18
Maximum Fault Junction Temperature per Mold Compound TJ 300 °C 18
Supply Voltages VDD1, VDD2 -0.5 7 V 18
Input Voltages VIA, VIB, VIC, VID, VE2 -0.5 V Max is VDDI1 + 0.5 V 18
Output Voltages VOA, VOB, VOC, VOD -0.5 V Max is VDDO2 + 0.5 V 18
Side 1 Output Current IO1 -10 10 mA Average output current per pin 18
Side 2 Output Current IO2 -10 10 mA Average output current per pin 18
Common-Mode Transients -150 150 kV/µs Across the insulation barrier 18
Junction to Ambient Thermal Resistance RQ-16 QSOP θJA 76 °C/W Thermocouple located at center of package underside 13
Capacitance (Input to Output) CI-O 2.2 pF f = 1 MHz 13
Input Capacitance CI 4 pF 13
Rated Dielectric Insulation Voltage RQ-16 3000 V rms 1-minute duration 13
Minimum External Air Gap (Clearance) RQ-16 L (I01) 3.5 mm Measured from input terminals to output terminals, shortest distance through air 13
Minimum External Tracking (Creepage) RQ-16 L (I02) 3.5 mm Measured from input terminals to output terminals, shortest distance path along body 13
Maximum Repetitive Isolation Voltage VIORM 565 V peak 16
Change in Pulse Width Distortion vs. Temperature (5 V) 1.5 ps/°C 4
Jitter (5 V) 490 ps p-p See the Jitter Measurement section 4
Jitter (5 V) 70 ps rms See the Jitter Measurement section 4
Output Rise/Fall Time (5 V) tR/tF 2.5 ns 10% to 90% 5
Positive VDDx Undervoltage Threshold VDDxUV+ 1.6 V 5
Negative VDDx Undervoltage Threshold VDDxUV− 1.5 V 5
VDDx Undervoltage Hysteresis VDDxUVH 0.1 V 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing pC In accordance with DIN EN IEC 60747-17 (VDE 0884-17), each ADuM140D/ADuM140E/ADuM141D/ADuM141E/ADuM142D/ADuM142E in the R-16 narrow body [SOIC_N] package is proof tested by applying an insulation test 14

CAD (KiCad official)

  • Symbol: ADUM140E0BRQZ
  • Footprint: Package_SO:QSOP-16_3.9x4.9mm_P0.635mm
  • 3D model: QSOP-16-150mil (KiCad packages3D, STEP)
  • 3D model files: adum140e0brqz-etched.step / adum140e0brqz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adum140e0brqz.step / adum140e0brqz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (31 pp, sha256 d8dc27340f57bada, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF