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ADS9224RIRHBT
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Texas Instruments Analog To Digital Converters (ADC), QFN-32-EP(5x5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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ADS9224RIRHBT
Texas Instruments · Analog To Digital Converters (ADC) · QFN-32-EP(5x5)
ADS9224RIRHBT from Texas Instruments, in a QFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | AINP_A | passive | Positive analog input for channel A. |
| 2 | AINM_A | passive | Negative analog input for channel A. |
| 3 | REFby2 | passive | REFby2 buffer output; connect a 1-µF decoupling capacitor between pin 3 and pin 4. |
| 4 | GND | power_in | Ground; pins 4, 11, 27 and 30 are the device ground pins, and pin 4 is the decoupling return for REFby2 and REFOUT. |
| 5 | REFOUT | passive | Internal reference output; connect a 1-µF decoupling capacitor between pin 5 and pin 4. |
| 6 | NC | unconnected | No external connection. |
| 7 | AINM_B | passive | Negative analog input for channel B. |
| 8 | AINP_B | passive | Positive analog input for channel B. |
| 9 | REFM_B | passive | Negative output of reference buffer B and negative reference input for ADC_B; externally connect to the device GND. |
| 10 | REFP_B | passive | Positive output of reference buffer B and positive reference input for ADC_B; connect a 10-µF decoupling capacitor between pin 9 and pin 10. |
| 11 | GND | power_in | Ground; pin 11 is the return for the 1-µF AVDD decoupling capacitor on pin 12. |
| 12 | AVDD | power_in | Analog power-supply pin; connect a 1-µF decoupling capacitor between pin 12 and pin 11. |
| 13 | CONVST | input | Conversion start input; a CONVST rising edge starts the conversion for ADC_A and ADC_B. |
| 14 | CS | input | Active-low chip-select input; the host and device communicate when CS is low, and the SDO-x pins go Hi-Z when CS is high. |
| 15 | SDI | input | Serial data input used to program the device registers. |
| 16 | SCLK | input | Clock input pin for the serial interface. |
| 17 | SDO-7/3B | tri_state | In SPI mode, data output 3 for channel B; in parallel byte mode, the most significant bit (MSB) of the data byte; Hi-Z when CS is high. |
| 18 | SDO-6/2B | tri_state | In SPI mode, data output 2 for channel B; in parallel byte mode, LSB+6 of the data byte; Hi-Z when CS is high. |
| 19 | SDO-5/1B | tri_state | In SPI mode, data output 1 for channel B; in parallel byte mode, LSB+5 of the data byte; Hi-Z when CS is high. |
| 20 | SDO-4/0B | tri_state | In SPI mode, data output 0 for channel B; in parallel byte mode, LSB+4 of the data byte; Hi-Z when CS is high. |
| 21 | SDO-3/3A | tri_state | In SPI mode, data output 3 for channel A; in parallel byte mode, LSB+3 of the data byte; Hi-Z when CS is high. |
| 22 | SDO-2/2A | tri_state | In SPI mode, data output 2 for channel A; in parallel byte mode, LSB+2 of the data byte; Hi-Z when CS is high. |
| 23 | SDO-1/1A | tri_state | In SPI mode, data output 1 for channel A; in parallel byte mode, LSB+1 of the data byte; Hi-Z when CS is high. |
| 24 | SDO-0/0A | tri_state | In SPI mode, data output 0 for channel A; in parallel byte mode, the least significant bit (LSB) of the data byte; Hi-Z when CS is high. |
| 25 | READY/STROBE | output | Digital output that indicates data ready or provides a strobe output for data capture. |
| 26 | PD/RST | input | Asynchronous reset or power-down input; see the Reset or Power-Down section of the datasheet. |
| 27 | GND | power_in | Ground; one of the device ground pins (4, 11, 27, 30). |
| 28 | DVDD | power_in | Interface power-supply pin; connect a 1-µF decoupling capacitor between pin 27 and pin 28. |
| 29 | AVDD | power_in | Analog power-supply pin; connect a 1-µF decoupling capacitor between pin 29 and pin 30. |
| 30 | GND | power_in | Ground; one of the device ground pins (4, 11, 27, 30), and the decoupling return for AVDD on pin 29. |
| 31 | REFP_A | passive | Positive output of reference buffer A and positive reference input for ADC_A; connect a 10-µF decoupling capacitor between pin 31 and pin 32. |
| 32 | REFM_A | passive | Negative output of reference buffer A and negative reference input for ADC_A; externally connect to the device GND. |
| 33 | Thermal Pad | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | QFN-32-EP(5x5) |
| Category | Data Acquisition |
| Pins | 33 |
CAD (KiCad official)
- Symbol:
ADS9224RIRHBT - Footprint:
Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm - 3D model: QFN-32-EP(5x5) (KiCad packages3D, STEP)
- 3D model files:
ads9224rirhbt-etched.step/ads9224rirhbt-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ads9224rirhbt.step/ads9224rirhbt.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (66 pp, sha256
e8405ba4f4929a21, retrieved 2026-10-11, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# ADS9224RIRHBT
**Texas Instruments** · Analog To Digital Converters (ADC) · QFN-32-EP(5x5)
ADS9224RIRHBT from Texas Instruments, in a QFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | AINP_A | passive | Positive analog input for channel A. |
| 2 | AINM_A | passive | Negative analog input for channel A. |
| 3 | REFby2 | passive | REFby2 buffer output; connect a 1-µF decoupling capacitor between pin 3 and pin 4. |
| 4 | GND | power_in | Ground; pins 4, 11, 27 and 30 are the device ground pins, and pin 4 is the decoupling return for REFby2 and REFOUT. |
| 5 | REFOUT | passive | Internal reference output; connect a 1-µF decoupling capacitor between pin 5 and pin 4. |
| 6 | NC | unconnected | No external connection. |
| 7 | AINM_B | passive | Negative analog input for channel B. |
| 8 | AINP_B | passive | Positive analog input for channel B. |
| 9 | REFM_B | passive | Negative output of reference buffer B and negative reference input for ADC_B; externally connect to the device GND. |
| 10 | REFP_B | passive | Positive output of reference buffer B and positive reference input for ADC_B; connect a 10-µF decoupling capacitor between pin 9 and pin 10. |
| 11 | GND | power_in | Ground; pin 11 is the return for the 1-µF AVDD decoupling capacitor on pin 12. |
| 12 | AVDD | power_in | Analog power-supply pin; connect a 1-µF decoupling capacitor between pin 12 and pin 11. |
| 13 | CONVST | input | Conversion start input; a CONVST rising edge starts the conversion for ADC_A and ADC_B. |
| 14 | CS | input | Active-low chip-select input; the host and device communicate when CS is low, and the SDO-x pins go Hi-Z when CS is high. |
| 15 | SDI | input | Serial data input used to program the device registers. |
| 16 | SCLK | input | Clock input pin for the serial interface. |
| 17 | SDO-7/3B | tri_state | In SPI mode, data output 3 for channel B; in parallel byte mode, the most significant bit (MSB) of the data byte; Hi-Z when CS is high. |
| 18 | SDO-6/2B | tri_state | In SPI mode, data output 2 for channel B; in parallel byte mode, LSB+6 of the data byte; Hi-Z when CS is high. |
| 19 | SDO-5/1B | tri_state | In SPI mode, data output 1 for channel B; in parallel byte mode, LSB+5 of the data byte; Hi-Z when CS is high. |
| 20 | SDO-4/0B | tri_state | In SPI mode, data output 0 for channel B; in parallel byte mode, LSB+4 of the data byte; Hi-Z when CS is high. |
| 21 | SDO-3/3A | tri_state | In SPI mode, data output 3 for channel A; in parallel byte mode, LSB+3 of the data byte; Hi-Z when CS is high. |
| 22 | SDO-2/2A | tri_state | In SPI mode, data output 2 for channel A; in parallel byte mode, LSB+2 of the data byte; Hi-Z when CS is high. |
| 23 | SDO-1/1A | tri_state | In SPI mode, data output 1 for channel A; in parallel byte mode, LSB+1 of the data byte; Hi-Z when CS is high. |
| 24 | SDO-0/0A | tri_state | In SPI mode, data output 0 for channel A; in parallel byte mode, the least significant bit (LSB) of the data byte; Hi-Z when CS is high. |
| 25 | READY/STROBE | output | Digital output that indicates data ready or provides a strobe output for data capture. |
| 26 | PD/RST | input | Asynchronous reset or power-down input; see the Reset or Power-Down section of the datasheet. |
| 27 | GND | power_in | Ground; one of the device ground pins (4, 11, 27, 30). |
| 28 | DVDD | power_in | Interface power-supply pin; connect a 1-µF decoupling capacitor between pin 27 and pin 28. |
| 29 | AVDD | power_in | Analog power-supply pin; connect a 1-µF decoupling capacitor between pin 29 and pin 30. |
| 30 | GND | power_in | Ground; one of the device ground pins (4, 11, 27, 30), and the decoupling return for AVDD on pin 29. |
| 31 | REFP_A | passive | Positive output of reference buffer A and positive reference input for ADC_A; connect a 10-µF decoupling capacitor between pin 31 and pin 32. |
| 32 | REFM_A | passive | Negative output of reference buffer A and negative reference input for ADC_A; externally connect to the device GND. |
| 33 | Thermal Pad | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | QFN-32-EP(5x5) |
| Category | Data Acquisition |
| Pins | 33 |
## CAD (KiCad official)
- Symbol: `ADS9224RIRHBT`
- Footprint: `Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm`
- 3D model: QFN-32-EP(5x5) (KiCad packages3D, STEP)
- 3D model files: `ads9224rirhbt-etched.step` / `ads9224rirhbt-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ads9224rirhbt.step` / `ads9224rirhbt.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/ads9224r) (66 pp, sha256 `e8405ba4f4929a21`, retrieved 2026-10-11, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ads9224rirhbt-datasheet.pdf)