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ADS8900BRGET

Texas Instruments · Analog To Digital Converters (ADCs) · VQFN-24-EP(4x4)

ADS8900BRGET from Texas Instruments, in a VQFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CONVST input Conversion start input; a CONVST rising edge moves the device from the ACQ state to the CNV state.
2 RST input Asynchronous reset input; a low pulse resets the device and all register bits return to their default state.
3 REFIN passive Reference voltage input; VREF must be between 2.5 V and RVDD - 0.3 V per the recommended operating conditions.
4 REFM passive Reference ground potential; REFM to GND is limited to -0.1 V to 0.1 V in the absolute maximum ratings.
5 REFBUFOUT bidirectional Internal reference buffer output or external reference input; short pin 5 and pin 7 together and use the 10 µF to 22 µF external ceramic decoupling capacitor.
6 NC unconnected No connection; float this pin with no external connection.
7 REFBUFOUT bidirectional Internal reference buffer output or external reference input; short pin 7 and pin 5 together and use the 10 µF to 22 µF external ceramic decoupling capacitor.
8 REFM passive Reference ground potential; REFM to GND is limited to -0.1 V to 0.1 V in the absolute maximum ratings.
9 AINP passive Positive analog input; analog input voltage to GND is limited to -0.3 V to VREF + 0.3 V.
10 AINM passive Negative analog input; analog input voltage to GND is limited to -0.3 V to VREF + 0.3 V.
11 GND power_in Ground reference for the device.
12 RVDD power_in Analog power supply pin; RVDD is 3 V to 5.5 V (5 V nominal) referenced to AGND.
13 DECAP power_out Decoupling capacitor connection for the internal power supply; short pin 13 and pin 14 together.
14 DECAP power_out Decoupling capacitor connection for the internal power supply; short pin 14 and pin 13 together.
15 GND power_in Ground reference for the device.
16 DVDD power_in Interface power supply pin; operating range is 1.65 V to 5.5 V and specified throughput range is 2.35 V to 5.5 V.
17 SDO-3 tri_state Serial communication data output 3; the pin goes to Hi-Z when CS is high.
18 SDO-2 tri_state Serial communication data output 2; the pin goes to Hi-Z when CS is high.
19 SDO-1 tri_state Serial communication data output 1; the pin goes to Hi-Z when CS is high.
20 SDO-0 tri_state Serial communication data output 0; the pin goes to Hi-Z when CS is high.
21 RVS output Multifunction output; with CS high it reflects the internal ADCST status, and with CS low its status depends on the selected output protocol.
22 SDI input Serial data input used to feed data or commands into the device.
23 SCLK input Clock input for the serial interface; all system-synchronous data transfer protocols are timed to SCLK.
24 CS input Active-low chip-select input; the device takes control of the data bus when CS is low.
25 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-24-EP(4x4)
Category Data Converters
Pins 25

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
RVDD Analog supply voltage (RVDD to AGND) RVDD 3 5 5.5 V 5
DVDD Digital supply voltage (DVDD to AGND), operating DVDD 1.65 3 5.5 V Operating 5
DVDD Digital supply voltage (DVDD to AGND), specified throughput DVDD 2.35 3 5.5 V Specified throughput 5
Reference input voltage on REFIN VREF 2.5 V 5
External ceramic decoupling capacitor CREFBUF 10 22 µF 5
External series resistor RESR 0 1 1.3 Ω 5
Specified free-air operating temperature TA -40 25 125 °C 5
RVDD to GND -0.3 7 V 5
DVDD to GND -0.3 7 V 5
REFIN to REFM -0.3 V 5
REFM to GND -0.1 0.1 V 5
Analog Input (AINP, AINM) to GND -0.3 V 5
Digital input (RST, CONVST, CS, SCLK, SDI) to GND -0.3 V 5
Digital output (READY, SDO-0, SDO-1, SDO-2, SDO-3) to GND -0.3 V 5
Analog Input (AINP, AINM) to RVDD and GND -130 130 mA 5
Operating free-air temperature TA -40 125 °C 5
Storage temperature Tstg -65 150 °C 5
Absolute input voltage VIN 0 V (AINP and AINM to REFM) 6
Reference input current IREF 0.1 1 µA VREF = 5 V 6
Reference buffer offset voltage (VREFBUFOUT, VREF) V(RO) -250 250 µV With EN_MARG = 0b, TA = 25°C 6
External ceramic decoupling capacitor CREFBUF 10 22 µF 6
External series resistor RESR 0 1 1.3 Ω 6
Margining range -4.5 4.5 mV With EN_MARG = 1b 6
Integral nonlinearity (INL) INL -2 1 2 ppm TA = 0°C to +60°C 6
Integral nonlinearity (INL) INL -2.75 1 2.75 ppm TA = -40°C to +85°C 6
Integral nonlinearity (INL) INL -3.75 1 3.75 ppm TA = -40°C to +125°C 6
Differential nonlinearity (DNL) DNL -0.5 0.2 0.5 ppm 6
Input offset error (E(IO)) E(IO) -11.5 3 11.5 ppm TA = 25°C 6
Input offset error (E(IO)) E(IO) -60 10 60 ppm TA = -40°C to +125°C 6
Gain error GE -0.03 0.005 0.03 %FSR EN_MARG = 0b 6
First output code deviation for burst-mode data acquisition -3 3 TNS Burst-mode data acquisition; see Reference Buffer Module 6
Signal-to-noise + distortion (SINAD) SINAD 101.8 103.9 dB fIN = 2 kHz, TA = -40°C to +85°C 7
Signal-to-noise + distortion (SINAD) SINAD 101.3 103.9 dB fIN = 2 kHz, TA = -40°C to +125°C 7
Signal-to-noise ratio (SNR) SNR 102 104.5 dB fIN = 2 kHz, TA = -40°C to +85°C 7
Signal-to-noise ratio (SNR) SNR 101.5 104.5 dB fIN = 2 kHz, TA = -40°C to +125°C 7
Low-level input voltage (VIL) VIL -0.3 V 1.65 V < DVDD < 2.3 V 7
Input current 0.01 0.1 µA 7
Low-level output voltage (VOL) VOL 0 V IOH = 500-µA sink 7
Analog supply current (IRVDD), ADS8900B IRVDD 4.2 5.8 mA ADS8900B at RVDD = 5 V, 1-MSPS 7
Power dissipation (PRVDD), ADS8900B PRVDD 21 29 mW ADS8900B at RVDD = 5 V, 1-MSPS 7
Junction-to-ambient thermal resistance RθJA 31.9 °C/W 5
Junction-to-case (top) thermal resistance RθJC(top) 29.9 °C/W 5
Junction-to-board thermal resistance RθJB 8.9 °C/W 5
Junction-to-top characterization parameter ψJT 0.3 °C/W 5
Junction-to-board characterization parameter ψJB 8.9 °C/W 5
Junction-to-case (bottom) thermal resistance RθJC(bot) 2 °C/W 5

CAD (KiCad official)

  • Symbol: ADS8900BRGET
  • Footprint: Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
  • 3D model: VQFN-24-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: ads8900brget-etched.step / ads8900brget-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ads8900brget.step / ads8900brget.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (77 pp, sha256 b51a83c67f910328, retrieved 2026-10-31, tier: manufacturer)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF