component
ADS8900BRGET
Public Made by Adomby adom
Texas Instruments Analog To Digital Converters (ADCs), VQFN-24-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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ADS8900BRGET
Texas Instruments · Analog To Digital Converters (ADCs) · VQFN-24-EP(4x4)
ADS8900BRGET from Texas Instruments, in a VQFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CONVST | input | Conversion start input; a CONVST rising edge moves the device from the ACQ state to the CNV state. |
| 2 | RST | input | Asynchronous reset input; a low pulse resets the device and all register bits return to their default state. |
| 3 | REFIN | passive | Reference voltage input; VREF must be between 2.5 V and RVDD - 0.3 V per the recommended operating conditions. |
| 4 | REFM | passive | Reference ground potential; REFM to GND is limited to -0.1 V to 0.1 V in the absolute maximum ratings. |
| 5 | REFBUFOUT | bidirectional | Internal reference buffer output or external reference input; short pin 5 and pin 7 together and use the 10 µF to 22 µF external ceramic decoupling capacitor. |
| 6 | NC | unconnected | No connection; float this pin with no external connection. |
| 7 | REFBUFOUT | bidirectional | Internal reference buffer output or external reference input; short pin 7 and pin 5 together and use the 10 µF to 22 µF external ceramic decoupling capacitor. |
| 8 | REFM | passive | Reference ground potential; REFM to GND is limited to -0.1 V to 0.1 V in the absolute maximum ratings. |
| 9 | AINP | passive | Positive analog input; analog input voltage to GND is limited to -0.3 V to VREF + 0.3 V. |
| 10 | AINM | passive | Negative analog input; analog input voltage to GND is limited to -0.3 V to VREF + 0.3 V. |
| 11 | GND | power_in | Ground reference for the device. |
| 12 | RVDD | power_in | Analog power supply pin; RVDD is 3 V to 5.5 V (5 V nominal) referenced to AGND. |
| 13 | DECAP | power_out | Decoupling capacitor connection for the internal power supply; short pin 13 and pin 14 together. |
| 14 | DECAP | power_out | Decoupling capacitor connection for the internal power supply; short pin 14 and pin 13 together. |
| 15 | GND | power_in | Ground reference for the device. |
| 16 | DVDD | power_in | Interface power supply pin; operating range is 1.65 V to 5.5 V and specified throughput range is 2.35 V to 5.5 V. |
| 17 | SDO-3 | tri_state | Serial communication data output 3; the pin goes to Hi-Z when CS is high. |
| 18 | SDO-2 | tri_state | Serial communication data output 2; the pin goes to Hi-Z when CS is high. |
| 19 | SDO-1 | tri_state | Serial communication data output 1; the pin goes to Hi-Z when CS is high. |
| 20 | SDO-0 | tri_state | Serial communication data output 0; the pin goes to Hi-Z when CS is high. |
| 21 | RVS | output | Multifunction output; with CS high it reflects the internal ADCST status, and with CS low its status depends on the selected output protocol. |
| 22 | SDI | input | Serial data input used to feed data or commands into the device. |
| 23 | SCLK | input | Clock input for the serial interface; all system-synchronous data transfer protocols are timed to SCLK. |
| 24 | CS | input | Active-low chip-select input; the device takes control of the data bus when CS is low. |
| 25 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-24-EP(4x4) |
| Category | Data Converters |
| Pins | 25 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| RVDD Analog supply voltage (RVDD to AGND) | RVDD | 3 | 5 | 5.5 | V | 5 | |
| DVDD Digital supply voltage (DVDD to AGND), operating | DVDD | 1.65 | 3 | 5.5 | V | Operating | 5 |
| DVDD Digital supply voltage (DVDD to AGND), specified throughput | DVDD | 2.35 | 3 | 5.5 | V | Specified throughput | 5 |
| Reference input voltage on REFIN | VREF | 2.5 | V | 5 | |||
| External ceramic decoupling capacitor | CREFBUF | 10 | 22 | µF | 5 | ||
| External series resistor | RESR | 0 | 1 | 1.3 | Ω | 5 | |
| Specified free-air operating temperature | TA | -40 | 25 | 125 | °C | 5 | |
| RVDD to GND | -0.3 | 7 | V | 5 | |||
| DVDD to GND | -0.3 | 7 | V | 5 | |||
| REFIN to REFM | -0.3 | V | 5 | ||||
| REFM to GND | -0.1 | 0.1 | V | 5 | |||
| Analog Input (AINP, AINM) to GND | -0.3 | V | 5 | ||||
| Digital input (RST, CONVST, CS, SCLK, SDI) to GND | -0.3 | V | 5 | ||||
| Digital output (READY, SDO-0, SDO-1, SDO-2, SDO-3) to GND | -0.3 | V | 5 | ||||
| Analog Input (AINP, AINM) to RVDD and GND | -130 | 130 | mA | 5 | |||
| Operating free-air temperature | TA | -40 | 125 | °C | 5 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 5 | ||
| Absolute input voltage | VIN | 0 | V | (AINP and AINM to REFM) | 6 | ||
| Reference input current | IREF | 0.1 | 1 | µA | VREF = 5 V | 6 | |
| Reference buffer offset voltage (VREFBUFOUT, VREF) | V(RO) | -250 | 250 | µV | With EN_MARG = 0b, TA = 25°C | 6 | |
| External ceramic decoupling capacitor | CREFBUF | 10 | 22 | µF | 6 | ||
| External series resistor | RESR | 0 | 1 | 1.3 | Ω | 6 | |
| Margining range | -4.5 | 4.5 | mV | With EN_MARG = 1b | 6 | ||
| Integral nonlinearity (INL) | INL | -2 | 1 | 2 | ppm | TA = 0°C to +60°C | 6 |
| Integral nonlinearity (INL) | INL | -2.75 | 1 | 2.75 | ppm | TA = -40°C to +85°C | 6 |
| Integral nonlinearity (INL) | INL | -3.75 | 1 | 3.75 | ppm | TA = -40°C to +125°C | 6 |
| Differential nonlinearity (DNL) | DNL | -0.5 | 0.2 | 0.5 | ppm | 6 | |
| Input offset error (E(IO)) | E(IO) | -11.5 | 3 | 11.5 | ppm | TA = 25°C | 6 |
| Input offset error (E(IO)) | E(IO) | -60 | 10 | 60 | ppm | TA = -40°C to +125°C | 6 |
| Gain error | GE | -0.03 | 0.005 | 0.03 | %FSR | EN_MARG = 0b | 6 |
| First output code deviation for burst-mode data acquisition | -3 | 3 | TNS | Burst-mode data acquisition; see Reference Buffer Module | 6 | ||
| Signal-to-noise + distortion (SINAD) | SINAD | 101.8 | 103.9 | dB | fIN = 2 kHz, TA = -40°C to +85°C | 7 | |
| Signal-to-noise + distortion (SINAD) | SINAD | 101.3 | 103.9 | dB | fIN = 2 kHz, TA = -40°C to +125°C | 7 | |
| Signal-to-noise ratio (SNR) | SNR | 102 | 104.5 | dB | fIN = 2 kHz, TA = -40°C to +85°C | 7 | |
| Signal-to-noise ratio (SNR) | SNR | 101.5 | 104.5 | dB | fIN = 2 kHz, TA = -40°C to +125°C | 7 | |
| Low-level input voltage (VIL) | VIL | -0.3 | V | 1.65 V < DVDD < 2.3 V | 7 | ||
| Input current | 0.01 | 0.1 | µA | 7 | |||
| Low-level output voltage (VOL) | VOL | 0 | V | IOH = 500-µA sink | 7 | ||
| Analog supply current (IRVDD), ADS8900B | IRVDD | 4.2 | 5.8 | mA | ADS8900B at RVDD = 5 V, 1-MSPS | 7 | |
| Power dissipation (PRVDD), ADS8900B | PRVDD | 21 | 29 | mW | ADS8900B at RVDD = 5 V, 1-MSPS | 7 | |
| Junction-to-ambient thermal resistance | RθJA | 31.9 | °C/W | 5 | |||
| Junction-to-case (top) thermal resistance | RθJC(top) | 29.9 | °C/W | 5 | |||
| Junction-to-board thermal resistance | RθJB | 8.9 | °C/W | 5 | |||
| Junction-to-top characterization parameter | ψJT | 0.3 | °C/W | 5 | |||
| Junction-to-board characterization parameter | ψJB | 8.9 | °C/W | 5 | |||
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | 2 | °C/W | 5 |
CAD (KiCad official)
- Symbol:
ADS8900BRGET - Footprint:
Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm - 3D model: VQFN-24-EP(4x4) (KiCad packages3D, STEP)
- 3D model files:
ads8900brget-etched.step/ads8900brget-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ads8900brget.step/ads8900brget.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (77 pp, sha256
b51a83c67f910328, retrieved 2026-10-31, tier: manufacturer) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# ADS8900BRGET
**Texas Instruments** · Analog To Digital Converters (ADCs) · VQFN-24-EP(4x4)
ADS8900BRGET from Texas Instruments, in a VQFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CONVST | input | Conversion start input; a CONVST rising edge moves the device from the ACQ state to the CNV state. |
| 2 | RST | input | Asynchronous reset input; a low pulse resets the device and all register bits return to their default state. |
| 3 | REFIN | passive | Reference voltage input; VREF must be between 2.5 V and RVDD - 0.3 V per the recommended operating conditions. |
| 4 | REFM | passive | Reference ground potential; REFM to GND is limited to -0.1 V to 0.1 V in the absolute maximum ratings. |
| 5 | REFBUFOUT | bidirectional | Internal reference buffer output or external reference input; short pin 5 and pin 7 together and use the 10 µF to 22 µF external ceramic decoupling capacitor. |
| 6 | NC | unconnected | No connection; float this pin with no external connection. |
| 7 | REFBUFOUT | bidirectional | Internal reference buffer output or external reference input; short pin 7 and pin 5 together and use the 10 µF to 22 µF external ceramic decoupling capacitor. |
| 8 | REFM | passive | Reference ground potential; REFM to GND is limited to -0.1 V to 0.1 V in the absolute maximum ratings. |
| 9 | AINP | passive | Positive analog input; analog input voltage to GND is limited to -0.3 V to VREF + 0.3 V. |
| 10 | AINM | passive | Negative analog input; analog input voltage to GND is limited to -0.3 V to VREF + 0.3 V. |
| 11 | GND | power_in | Ground reference for the device. |
| 12 | RVDD | power_in | Analog power supply pin; RVDD is 3 V to 5.5 V (5 V nominal) referenced to AGND. |
| 13 | DECAP | power_out | Decoupling capacitor connection for the internal power supply; short pin 13 and pin 14 together. |
| 14 | DECAP | power_out | Decoupling capacitor connection for the internal power supply; short pin 14 and pin 13 together. |
| 15 | GND | power_in | Ground reference for the device. |
| 16 | DVDD | power_in | Interface power supply pin; operating range is 1.65 V to 5.5 V and specified throughput range is 2.35 V to 5.5 V. |
| 17 | SDO-3 | tri_state | Serial communication data output 3; the pin goes to Hi-Z when CS is high. |
| 18 | SDO-2 | tri_state | Serial communication data output 2; the pin goes to Hi-Z when CS is high. |
| 19 | SDO-1 | tri_state | Serial communication data output 1; the pin goes to Hi-Z when CS is high. |
| 20 | SDO-0 | tri_state | Serial communication data output 0; the pin goes to Hi-Z when CS is high. |
| 21 | RVS | output | Multifunction output; with CS high it reflects the internal ADCST status, and with CS low its status depends on the selected output protocol. |
| 22 | SDI | input | Serial data input used to feed data or commands into the device. |
| 23 | SCLK | input | Clock input for the serial interface; all system-synchronous data transfer protocols are timed to SCLK. |
| 24 | CS | input | Active-low chip-select input; the device takes control of the data bus when CS is low. |
| 25 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-24-EP(4x4) |
| Category | Data Converters |
| Pins | 25 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| RVDD Analog supply voltage (RVDD to AGND) | RVDD | 3 | 5 | 5.5 | V | | 5 |
| DVDD Digital supply voltage (DVDD to AGND), operating | DVDD | 1.65 | 3 | 5.5 | V | Operating | 5 |
| DVDD Digital supply voltage (DVDD to AGND), specified throughput | DVDD | 2.35 | 3 | 5.5 | V | Specified throughput | 5 |
| Reference input voltage on REFIN | VREF | 2.5 | | | V | | 5 |
| External ceramic decoupling capacitor | CREFBUF | 10 | 22 | | µF | | 5 |
| External series resistor | RESR | 0 | 1 | 1.3 | Ω | | 5 |
| Specified free-air operating temperature | TA | -40 | 25 | 125 | °C | | 5 |
| RVDD to GND | | -0.3 | | 7 | V | | 5 |
| DVDD to GND | | -0.3 | | 7 | V | | 5 |
| REFIN to REFM | | -0.3 | | | V | | 5 |
| REFM to GND | | -0.1 | | 0.1 | V | | 5 |
| Analog Input (AINP, AINM) to GND | | -0.3 | | | V | | 5 |
| Digital input (RST, CONVST, CS, SCLK, SDI) to GND | | -0.3 | | | V | | 5 |
| Digital output (READY, SDO-0, SDO-1, SDO-2, SDO-3) to GND | | -0.3 | | | V | | 5 |
| Analog Input (AINP, AINM) to RVDD and GND | | -130 | | 130 | mA | | 5 |
| Operating free-air temperature | TA | -40 | | 125 | °C | | 5 |
| Storage temperature | Tstg | -65 | | 150 | °C | | 5 |
| Absolute input voltage | VIN | 0 | | | V | (AINP and AINM to REFM) | 6 |
| Reference input current | IREF | | 0.1 | 1 | µA | VREF = 5 V | 6 |
| Reference buffer offset voltage (VREFBUFOUT, VREF) | V(RO) | -250 | | 250 | µV | With EN_MARG = 0b, TA = 25°C | 6 |
| External ceramic decoupling capacitor | CREFBUF | 10 | 22 | | µF | | 6 |
| External series resistor | RESR | 0 | 1 | 1.3 | Ω | | 6 |
| Margining range | | -4.5 | | 4.5 | mV | With EN_MARG = 1b | 6 |
| Integral nonlinearity (INL) | INL | -2 | 1 | 2 | ppm | TA = 0°C to +60°C | 6 |
| Integral nonlinearity (INL) | INL | -2.75 | 1 | 2.75 | ppm | TA = -40°C to +85°C | 6 |
| Integral nonlinearity (INL) | INL | -3.75 | 1 | 3.75 | ppm | TA = -40°C to +125°C | 6 |
| Differential nonlinearity (DNL) | DNL | -0.5 | 0.2 | 0.5 | ppm | | 6 |
| Input offset error (E(IO)) | E(IO) | -11.5 | 3 | 11.5 | ppm | TA = 25°C | 6 |
| Input offset error (E(IO)) | E(IO) | -60 | 10 | 60 | ppm | TA = -40°C to +125°C | 6 |
| Gain error | GE | -0.03 | 0.005 | 0.03 | %FSR | EN_MARG = 0b | 6 |
| First output code deviation for burst-mode data acquisition | | -3 | | 3 | TNS | Burst-mode data acquisition; see Reference Buffer Module | 6 |
| Signal-to-noise + distortion (SINAD) | SINAD | 101.8 | 103.9 | | dB | fIN = 2 kHz, TA = -40°C to +85°C | 7 |
| Signal-to-noise + distortion (SINAD) | SINAD | 101.3 | 103.9 | | dB | fIN = 2 kHz, TA = -40°C to +125°C | 7 |
| Signal-to-noise ratio (SNR) | SNR | 102 | 104.5 | | dB | fIN = 2 kHz, TA = -40°C to +85°C | 7 |
| Signal-to-noise ratio (SNR) | SNR | 101.5 | 104.5 | | dB | fIN = 2 kHz, TA = -40°C to +125°C | 7 |
| Low-level input voltage (VIL) | VIL | -0.3 | | | V | 1.65 V < DVDD < 2.3 V | 7 |
| Input current | | | 0.01 | 0.1 | µA | | 7 |
| Low-level output voltage (VOL) | VOL | 0 | | | V | IOH = 500-µA sink | 7 |
| Analog supply current (IRVDD), ADS8900B | IRVDD | | 4.2 | 5.8 | mA | ADS8900B at RVDD = 5 V, 1-MSPS | 7 |
| Power dissipation (PRVDD), ADS8900B | PRVDD | | 21 | 29 | mW | ADS8900B at RVDD = 5 V, 1-MSPS | 7 |
| Junction-to-ambient thermal resistance | RθJA | | 31.9 | | °C/W | | 5 |
| Junction-to-case (top) thermal resistance | RθJC(top) | | 29.9 | | °C/W | | 5 |
| Junction-to-board thermal resistance | RθJB | | 8.9 | | °C/W | | 5 |
| Junction-to-top characterization parameter | ψJT | | 0.3 | | °C/W | | 5 |
| Junction-to-board characterization parameter | ψJB | | 8.9 | | °C/W | | 5 |
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | | 2 | | °C/W | | 5 |
## CAD (KiCad official)
- Symbol: `ADS8900BRGET`
- Footprint: `Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm`
- 3D model: VQFN-24-EP(4x4) (KiCad packages3D, STEP)
- 3D model files: `ads8900brget-etched.step` / `ads8900brget-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ads8900brget.step` / `ads8900brget.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/ads8900brget.pdf) (77 pp, sha256 `b51a83c67f910328`, retrieved 2026-10-31, tier: manufacturer)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ads8900brget-datasheet.pdf)