Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

ADS8557IPM

Texas Instruments · Analog To Digital Converters (ADC) · LQFP-64(10x10)

ADS8557IPM from Texas Instruments, in a LQFP-64(10x10). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 DB14/REFBUFEN bidirectional Data bit 14 input/output, which is '0' for the ADS8557; in hardware mode it is the reference buffers enable input (active low, mandatory when the internal reference is used).
2 DB13/SDI bidirectional Data bit 13 input/output, which is the MSB for the ADS8557; connect to BGND in hardware mode and use as the serial data input in software mode.
3 DB12 bidirectional Data bit 12 input/output in parallel mode, with the table specifying connection to BGND.
4 DB11 bidirectional Data bit 11 input/output; it is the MSB output for the ADS8558 and the table specifies connection to BGND.
5 DB10/SDO_C bidirectional Data bit 10 input/output; when SEL_C = 1 it is the data output for channel C, and when SEL_C = 0 it must be tied to BGND.
6 DB9/SDO_B bidirectional Data bit 9 input/output; when SEL_B = 1 it is the data output for channel B, and when SEL_B = 0 it must be tied to BGND.
7 DB8/SDO_A bidirectional Data bit 8 input/output and data output for channel A; it acts as the single data output for all channels when SEL_C = 0 and SEL_B = 0.
8 BGND power_in Buffer I/O ground, to be connected to the digital ground plane.
9 BVDD power_in Buffer I/O supply, 2.7 V to 5.5 V, decoupled with a 1-μF ceramic capacitor (or 100-nF plus 10-μF) to BGND.
10 DB7/HBEN/DCEN bidirectional In word mode it is data bit 7 and the daisy-chain enable (connect to BGND if unused); in byte mode it is the high-byte enable that sets which byte is output first on DB[15:8].
11 DB6/SCLK bidirectional In word mode it is data bit 6; in serial mode it is the serial interface clock input, 36 MHz maximum, and in byte mode it is connected to BGND or BVDD.
12 DB5/DCIN_A bidirectional In word mode it is data bit 5 and, when DCEN = 1, the daisy-chain data input for channel A; otherwise it is connected to BGND.
13 DB4/DCIN_B bidirectional In word mode it is data bit 4 and, when SEL_B = 1 and DCEN = 1, the daisy-chain data input for channel B; otherwise it is connected to BGND.
14 DB3/DCIN_C bidirectional In word mode it is data bit 3 and, when SEL_C = 1 and DCEN = 1, the daisy-chain data input for channel C; otherwise it is connected to BGND.
15 DB2/SEL_C bidirectional In word mode it is data bit 2 and the select input for SDO_C, where SDO_C is active when high and disabled when low.
16 DB1/SEL_B bidirectional In word mode it is data bit 1 and the select input for SDO_B, where SDO_B is active when high and disabled when low.
17 DB0/SEL_A bidirectional In word mode it is data bit 0 (LSB) and the select input for SDO_A, which must always be high.
18 BUSY/INT output Converter busy output (high during conversion, low once all six channel results are latched) or interrupt output when CR bit C21 = 1, with polarity set by CR bit C20.
19 CS/FS input Chip select input that enables the parallel interface when low; in serial mode it is the frame synchronization input, whose falling edge controls the frame transfer.
20 RD input Read data input that enables the parallel data output when low; the table specifies connection to BGND.
21 CONVST_C input Hardware mode conversion start for channel pair C, where the rising edge starts simultaneous conversion of CH_C[1:0] and the signal must stay high during conversion or both ADCs of channel C enter partial power-down.
22 CONVST_B input Hardware mode conversion start for channel pair B, where the rising edge starts simultaneous conversion of CH_B[1:0] and the signal must stay high during conversion or both ADCs of channel B enter partial power-down.
23 CONVST_A input Hardware mode conversion start for channel pair A, where the rising edge starts simultaneous conversion of CH_A[1:0] and the signal must stay high during conversion or both ADCs of channel A enter partial power-down.
24 STBY input Standby mode input; when low the entire device is powered down including the internal clock and reference, and when high it operates in normal mode.
25 AGND power_in Analog ground to be connected to the analog ground plane; this pin may have a dedicated ground only if its potential stays within ±300 mV of AGND.
26 AVDD power_in Analog power supply, 4.5 V to 5.5 V, decoupled with 100-nF to AGND plus a 10-μF capacitor; this pin may have a dedicated supply only if kept within ±300 mV of AVDD.
27 RANGE/XCLK bidirectional In hardware mode it selects the input range (low = ±4 VREF, high = ±2 VREF); in software mode it is the external conversion clock input (CLKSEL) or internal conversion clock output (CLKOUT_EN), and connects to BVDD or BGND if unused.
28 RESET input Active-high reset that aborts ongoing conversions and resets the control register to 0x000003FF, with a pulse of at least 50 ns required.
29 WORD/BYTE input Output mode select, where low selects word mode on DB[15:0] and high selects byte mode on DB[15:8] requiring two accesses per 16-bit transfer; the table specifies connection to BGND.
30 HVSS power_in Negative supply for the analog inputs, -16.5 V to -5 V, decoupled with 100-nF and 10-μF to AGND.
31 HVDD power_in Positive supply for the analog inputs, 5 V to 16.5 V, decoupled with 100-nF and 10-μF to AGND.
32 AGND power_in Analog ground to be connected to the analog ground plane.
33 CH_A0 passive Analog input of channel A0, with input range set by the RANGE pin in hardware mode or CR bit C26 (RANGE_A) in software mode.
34 AVDD power_in Analog power supply, 4.5 V to 5.5 V, decoupled to AGND as specified for the AVDD pins.
35 AVDD power_in Analog power supply, 4.5 V to 5.5 V, decoupled to AGND as specified for the AVDD pins.
36 CH_A1 passive Analog input of channel A1, with input range set by the RANGE pin in hardware mode or CR bit C26 (RANGE_A) in software mode.
37 AGND power_in Analog ground to be connected to the analog ground plane.
38 AGND power_in Analog ground to be connected to the analog ground plane.
39 CH_B0 passive Analog input of channel B0, with input range set by the RANGE pin in hardware mode or CR bit C27 (RANGE_B) in software mode.
40 AVDD power_in Analog power supply, 4.5 V to 5.5 V, decoupled to AGND as specified for the AVDD pins.
41 AVDD power_in Analog power supply, 4.5 V to 5.5 V, decoupled to AGND as specified for the AVDD pins.
42 CH_B1 passive Analog input of channel B1, with input range set by the RANGE pin in hardware mode or CR bit C27 (RANGE_B) in software mode.
43 AGND power_in Analog ground to be connected to the analog ground plane.
44 AGND power_in Analog ground to be connected to the analog ground plane.
45 CH_C0 passive Analog input of channel C0, with input range set by the RANGE pin in hardware mode or CR bit C28 (RANGE_C) in software mode.
46 AVDD power_in Analog power supply, 4.5 V to 5.5 V, decoupled to AGND as specified for the AVDD pins.
47 AVDD power_in Analog power supply, 4.5 V to 5.5 V, decoupled to AGND as specified for the AVDD pins.
48 CH_C1 passive Analog input of channel C1, with input range set by the RANGE pin in hardware mode or CR bit C28 (RANGE_C) in software mode.
49 AGND power_in Analog ground to be connected to the analog ground plane.
50 AVDD power_in Analog power supply, 4.5 V to 5.5 V, decoupled to AGND as specified for the AVDD pins.
51 REFIO bidirectional Reference input/output, 0.5 V to 3.025 V, enabled via REFEN/WR or CR bit C25, with a 470-nF ceramic decoupling capacitor to pin 52.
52 AGND power_in Analog ground to be connected to the analog ground plane and used as the return for the REFIO decoupling capacitor.
53 AGND power_in Analog ground to be connected to the analog ground plane and used as the return for the REFC_A decoupling capacitor.
54 REFC_A passive Decoupling capacitor node for the channel A reference, requiring a 10-μF ceramic capacitor to pin 53.
55 AGND power_in Analog ground to be connected to the analog ground plane and used as the return for the REFC_B decoupling capacitor.
56 REFC_B passive Decoupling capacitor node for the channel B reference, requiring a 10-μF ceramic capacitor to pin 55.
57 AGND power_in Analog ground to be connected to the analog ground plane and used as the return for the REFC_C decoupling capacitor.
58 REFC_C passive Decoupling capacitor node for the channel C reference, requiring a 10-μF ceramic capacitor to pin 57.
59 AGND power_in Analog ground to be connected to the analog ground plane.
60 AVDD power_in Analog power supply, 4.5 V to 5.5 V, decoupled to AGND as specified for the AVDD pins.
61 PAR/SER input Interface mode select, where low selects the parallel interface and high enables the serial interface.
62 HW/SW input Mode select, where low selects hardware mode controlled by external pins and high selects software mode configured through the control register.
63 REFEN/WR input In hardware mode it is the internal reference enable (high enables the internal reference, low requires an external reference at REFIO); in software mode it is the parallel write input (active with CS low) or is tied to BGND/BVDD in serial mode.
64 DB15 bidirectional Data bit 15 (MSB) input/output, which is '0' for the ADS8557 and should be connected to BGND.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package LQFP-64(10x10)
Category Data Acquisition
Pins 64

CAD (KiCad official)

  • Symbol: ADS8557IPM
  • Footprint: Package_QFP:LQFP-64_10x10mm_P0.5mm
  • 3D model: LQFP-64(10x10) (KiCad packages3D, STEP)
  • 3D model files: ads8557ipm-etched.step / ads8557ipm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ads8557ipm.step / ads8557ipm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (50 pp, sha256 40692bd4ec54d669, retrieved 2026-10-11, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF