# ADS8319IBDGST

**Texas Instruments** · Analog To Digital Converters (ADCs) · VSSOP-10-0.5mm

ADS8319IBDGST from Texas Instruments, in a VSSOP-10-0.5mm. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | REFIN | input | Reference (positive) input that must be decoupled to GND with a 0.1-µF bypass capacitor and a 10-µF storage capacitor. |
| 2 | +VA | power_in | Analog power supply that must be decoupled to GND. |
| 3 | +IN | input | Noninverting analog signal input. |
| 4 | -IN | input | Inverting analog signal input limited to ±0.1 V and typically grounded at the input decoupling capacitor. |
| 5 | GND | power_in | Device ground that is the common ground for both the analog supply (+VA) and the digital I/O supply (+VBD). |
| 6 | CONVST | input | Convert input that also functions as the CS input in 3-wire interface mode. |
| 7 | SDO | output | Serial data output. |
| 8 | SCLK | input | Serial I/O clock input with which the data on the SDO output are synchronized. |
| 9 | SDI | input | Serial data input whose level at the start of a conversion selects the mode of operation (such as CS or daisy-chain mode) and which also serves as the CS input in 4-wire interface mode. |
| 10 | +VBD | power_in | Digital I/O power supply that must be decoupled to GND. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VSSOP-10-0.5mm |
| Category | Data Converters |
| Pins | 10 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Integral linearity INL | INL | -1.5 | 1 | 1.5 | LSB | ADS8319IB; endpoint INL | 5 |
| Differential linearity DNL | DNL | -1 | 0.5 | 1 | LSB | ADS8319IB; at 16-bit level | 5 |
| Offset error | EO | -1.5 | 0.3 | 1.5 | mV |  | 5 |
| Gain error | EG | -0.03 | 0.0045 | 0.03 | %FSR |  | 5 |
| Supply current |  |  | 3.6 | 4.5 | mA | +VA, 500-kHz sample rate | 6 |
| Power dissipation | PVA |  | 18 | 22.5 | mW | +VA = 5 V, 500-kHz sample rate | 6 |
| Device power-down current | IVApd |  | 50 | 300 | nA | +VA = 5 V | 6 |
| Output LOW logic level | VOL | 0 |  | 0.4 | V | IOL = 2 TTL loads | 6 |
| Input leakage current |  |  |  | 1000 | pA | During acquisition | 5 |
| Analog power-supply voltage | +VA | 4.5 | 5 | 5.5 | V |  | 4 |
| Digital I/O-supply voltage | +VBD | 2.375 | 3.3 | 5.5 | V |  | 4 |
| Reference voltage | VREF | 2.25 | 4.096 |  | V | Maximum is +VA + 0.1 V as printed | 4 |
| Operating free-air temperature | TA | -40 |  | 85 | °C |  | 4 |
| +VA to AGND |  | -0.3 |  | 7 | V |  | 4 |
| +VBD to BDGND |  | -0.3 |  | 7 | V |  | 4 |
| +IN pin voltage |  | -0.3 |  |  | V | Maximum is +VA + 0.3 V as printed | 4 |
| +IN pin current |  | -130 |  | 130 | mA |  | 4 |
| -IN pin voltage |  | -0.3 |  | 0.3 | V |  | 4 |
| -IN pin current |  | -130 |  | 130 | mA |  | 4 |
| Junction temperature | TJ(MAX) |  |  | 150 | °C |  | 4 |
| Storage temperature | Tstg | -65 |  | 150 | °C |  | 4 |
| Maximum VSSOP reflow temperature |  |  |  | 260 | °C |  | 4 |
| Electrostatic discharge HBM | V(ESD) | -2000 |  | 2000 | V | Human-body model, per ANSI/ESDA/JEDEC JS-001 | 4 |
| Electrostatic discharge CDM | V(ESD) | -1000 |  | 1000 | V | Charged-device model, per JEDEC JESD22-C101 | 4 |
| Junction-to-ambient thermal resistance (DGS VSSOP) | RθJA |  | 107.5 |  | °C/W | DGS (VSSOP) 10-pin | 4 |
| Junction-to-case (top) thermal resistance (DGS VSSOP) | RθJC(top) |  | 21.8 |  | °C/W | DGS (VSSOP) 10-pin | 4 |
| Junction-to-board thermal resistance (DGS VSSOP) | RθJB |  | 24.2 |  | °C/W | DGS (VSSOP) 10-pin | 4 |
| Junction-to-top characterization parameter (DGS VSSOP) | ψJT |  | 0.6 |  | °C/W | DGS (VSSOP) 10-pin | 4 |
| Junction-to-board characterization parameter (DGS VSSOP) | ψJB |  | 24.4 |  | °C/W | DGS (VSSOP) 10-pin | 4 |
| Input capacitance |  |  | 59 |  | pF |  | 5 |
| Resolution |  |  | 16 |  | Bits |  | 5 |

## CAD (KiCad official)

- Symbol: `ADS8319IBDGST`
- Footprint: `Package_SO:MSOP-10_3x3mm_P0.5mm`
- 3D model: VSSOP-10-0.5mm (KiCad packages3D, STEP)
- 3D model files: `ads8319ibdgst-etched.step` / `ads8319ibdgst-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ads8319ibdgst.step` / `ads8319ibdgst.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/ads8319.pdf) (43 pp, sha256 `ea8a29c3290b19d7`, retrieved 2026-11-02, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ads8319ibdgst-datasheet.pdf)