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ADS8166IRHBR

Texas Instruments · Analog To Digital Converters (ADC) · VQFN-32-EP(5x5)

ADS8166IRHBR from Texas Instruments, in a VQFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground connection; 0V reference potential.
2 DECAP power_in Decoupling capacitor pin; connect 1µF capacitor to GND for internal power supply.
3 REFIO bidirectional External reference voltage input or internal 4.096V reference output; connect 1µF capacitor to GND.
4 REFM power_in Reference ground potential; short externally to GND.
5 REFP bidirectional Reference buffer output and ADC reference input; short pins 5 and 6 together.
6 REFP bidirectional Reference buffer output and ADC reference input; short pins 5 and 6 together.
7 REFby2 output Analog output equal to half the REFP voltage; connect 1µF capacitor to GND.
8 AIN-COM input Common analog input for pseudo-differential or single-ended reference configurations.
9 AIN0 input Analog input channel 0.
10 AIN1 input Analog input channel 1.
11 AIN2 input Analog input channel 2.
12 AIN3 input Analog input channel 3.
13 AIN4 input Analog input channel 4.
14 AIN5 input Analog input channel 5.
15 AIN6 input Analog input channel 6.
16 AIN7 input Analog input channel 7.
17 ADC-INP input Positive ADC analog input.
18 MUXOUT-P output Multiplexer positive analog output.
19 MUXOUT-M output Multiplexer negative analog output.
20 ADC-INM input Negative ADC analog input.
21 GND power_in Ground connection; 0V reference potential.
22 ALERT output Digital alert output, active high; logical OR of enabled channel comparator flags.
23 CS input Chip select input, active low; device starts conversion on CS rising edge, SDO-x go high-impedance when CS high.
24 SDI input Serial data input; transfers commands and configuration data into device via SPI.
25 SCLK input Serial interface clock input; all data transfers synchronized to SCLK edges.
26 SDO-0 tri_state Serial data output 0; high-impedance when CS is high.
27 SDO-1/SEQSTS tri_state Serial data output 1 or sequence status indicator; high-impedance when CS is high.
28 READY output Multifunction output; reflects conversion status when CS high, protocol-dependent output when CS low.
29 RST input Asynchronous reset input, active low; resets device to default register state.
30 DVDD power_in Digital interface power supply; connect 1µF capacitor to GND.
31 GND power_in Ground connection; 0V reference potential.
32 AVDD power_in Analog power supply, 3V to 5.5V range; connect 1µF capacitor to GND.
EP Thermal Pad power_in Exposed thermal pad; connect to GND.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-32-EP(5x5)
Category Data Acquisition
Pins 33

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
AVDD supply, internal reference AVDD 4.5 5 5.5 V Internal reference 6
AVDD supply, external reference AVDD 3 5 5.5 V External reference 6
DVDD supply, operating DVDD 1.65 3 5.5 V Operating 6
DVDD supply, specified throughput DVDD 2.35 3 5.5 V Specified throughput 6
Absolute input voltage, AINx to REFM (single-ended) VIN -0.1 V AINx to REFM and CHx_CHy_CFG = 00b; max printed as VREF + 0.1 6
Absolute input voltage, AINy to REFM VIN -0.1 0.1 V AINy to REFM and CHx_CHy_CFG = 01b 6
Absolute input voltage, AIN-COM (single-ended) VIN -0.1 0.1 V 6
REFIO input voltage VREFIO 2.5 V REFIO configured as input pin; max printed as AVDD - 0.3 6
Ambient temperature TA -40 25 125 °C 6
Input current to any pin except supply pins -10 10 mA 5
Junction temperature TJ -40 125 °C 5
Storage temperature Tstg -65 150 °C 5
AVDD to GND AVDD -0.3 7 V 5
DVDD to GND DVDD -0.3 7 V 5
MUX input on-channel leakage current ILMUX_ON -750 10 750 nA REFM < VIN < REFP 7
Integral nonlinearity INL -0.8 0.35 0.8 LSB 7
Differential nonlinearity DNL -0.5 0.2 0.5 LSB 7
Input offset error VOS -10 0.5 10 LSB 7
Input offset error match -1 0.5 1 LSB 7
Gain error GE -0.06 0.002 0.06 %FSR Referred to REFIO 7
Gain error match -0.005 0.0025 0.005 %FSR Referred to REFIO 7
Gain error thermal drift dGE/dT -1 1 1 ppm/°C Referred to REFIO 7
Signal-to-noise + distortion SINAD 91.6 93.5 dB fIN = 2kHz 7
Signal-to-noise ratio SNR 91.8 93.6 dB fIN = 2kHz 7
Reference buffer offset voltage VRO -250 250 µV VRO = VREFP − VREFIO, TA = 25°C 7
External series resistance (REFP decoupling) RESR 0 1.3 Ω 7
REFIO output voltage VREFIO 4.091 4.096 4.101 V TA = 25°C, REFIO configured as output pin 7
Internal reference temperature drift dVREFIO/dT 4 18 ppm/°C 7
REFIO input current IREFIO 0.1 1 μA REFIO configured as input pin 7
Analog supply current, ADS8166 IAVDD 3 4.1 mA ADS8166, AVDD = 5V 8
SCLK high time tph_CK 0.45 0.55 tCLK 9
SCLK low time tpl_CK 0.45 0.55 tCLK 9
Time offset: READY falling to next data valid on SDO toff_STRDO_f -2 2 ns 10
Time offset: READY rising to next data valid on SDO toff_STRDO_r -2 2 ns 10
Strobe output high time tph_STR 0.45 0.55 tSTR 2.35V ≤ DVDD ≤ 5.5V 10
Strobe output low time tpl_STR 0.45 0.55 tSTR 2.35V ≤ DVDD ≤ 5.5V 10
Junction-to-ambient thermal resistance RθJA 29.5 °C/W RHB (VQFN) 32 pins 5
Junction-to-case (top) thermal resistance RθJC(top) 18.6 °C/W RHB (VQFN) 32 pins 5
Junction-to-board thermal resistance RθJB 10.2 °C/W RHB (VQFN) 32 pins 5
Junction-to-top characterization parameter ΨJT 0.2 °C/W RHB (VQFN) 32 pins 5
Junction-to-board characterization parameter ΨJB 10.2 °C/W RHB (VQFN) 32 pins 5
Junction-to-case (bottom) thermal resistance RθJC(bot) 1.3 °C/W RHB (VQFN) 32 pins 5

CAD (KiCad official)

  • Symbol: ADS8166IRHBR
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: VQFN-32-EP(5x5) (KiCad packages3D, STEP)
  • 3D model files: ads8166irhbr-etched.step / ads8166irhbr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ads8166irhbr.step / ads8166irhbr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (86 pp, sha256 fa97ed7844ff4a62, retrieved 2026-10-21, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF