ADR5041WBRTZ-R7 from Analog Devices, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	V+	power_in	Positive terminal of the shunt reference; the shunt current IIN must stay between 50 µA minimum and 15 mA maximum.
2	V-	power_in	Negative terminal of the shunt reference, which sets the reference return; RBIAS must supply at least the minimum IIN of 50 µA even at minimum supply and maximum load current.
3	T	passive	Recommended to be connected to V+ according to the pin configuration note.

Key specifications

Parameter	Value
Manufacturer	Analog Devices
Package	SOT-23
Category	Power Supply Chip
Pins	3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
OUTPUT VOLTAGE (Grade B)	VOUT	2.4975	2.5	2.5025	V	IIN = 100 µA, Grade B	3
INITIAL ACCURACY (Grade B)	VOERR	-2.5		2.5	mV	IIN = 100 µA	3
INITIAL ACCURACY (Grade B, ±0.1 %)	VOERR	-0.1		0.1	%	IIN = 100 µA	3
TEMPERATURE COEFFICIENT (Grade B)	TCVOUT		10	75	ppm/°C	−40°C < TA < +125°C	3
OUTPUT VOLTAGE CHANGE vs. IIN (50 µA to 1 mA)	∆VR		0.5	1.8	mV	IIN = 50 µA to 1 mA, −40°C < TA < +125°C	3
OUTPUT VOLTAGE CHANGE vs. IIN (1 mA to 15 mA)	∆VR		4	8	mV	IIN = 1 mA to 15 mA, −40°C < TA < +125°C	3
MINIMUM OPERATING CURRENT	IIN	50			µA	TA = 25°C	3
MINIMUM OPERATING CURRENT	IIN	60			µA	−40°C < TA < +125°C	3
REVERSE CURRENT				25	mA		6
FORWARD CURRENT				20	mA		6
STORAGE TEMPERATURE RANGE		-65		150	°C		6
EXTENDED TEMPERATURE RANGE		-40		125	°C		6
JUNCTION TEMPERATURE RANGE		-65		150	°C		6
LEAD TEMPERATURE (soldering)				300	°C	60 sec soldering	6
DYNAMIC OUTPUT IMPEDANCE	∆VR/∆IR		0.2		Ω	IIN = 50 µA to 15 mA	4
VOLTAGE NOISE (0.1 Hz to 10 Hz)	eN		3.2		µV rms	IIN = 100 µA; 0.1 Hz to 10 Hz	4
VOLTAGE NOISE (10 Hz to 10 kHz)	eN		150		µV rms	IIN = 100 µA; 10 Hz to 10 kHz	4
TURN-ON SETTLING TIME	tR		35		µs	CLOAD = 0 µF	4
OUTPUT VOLTAGE HYSTERESIS	∆VOUT_HYS		40		ppm	IIN = 1 mA	4
THERMAL RESISTANCE junction-to-ambient (RT-3)	θJA		270		°C/W	RT-3 package, surface-mount device soldered in circuit board, worst case	6
THERMAL RESISTANCE junction-to-case (RT-3)	θJC		102		°C/W	RT-3 package	6

CAD (KiCad official)

Symbol: ADR5041WBRTZ-R7
Footprint: Package_TO_SOT_SMD:SOT-23
3D model: SOT-23 (KiCad packages3D, STEP)
3D model files: adr5041wbrtz-r7-etched.step / adr5041wbrtz-r7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adr5041wbrtz-r7.step / adr5041wbrtz-r7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Analog Devices datasheet (14 pp, sha256 9270161a9890b670, retrieved 2026-10-30, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

ADR5041WBRTZ-R7

Verified ADR5041WBRTZ-R7

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

README