component
ADR4530BRZ
Public Made by Adomby adom
Analog Devices Voltage References, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownADR4530BRZ
Analog Devices · Voltage References · SOIC-8
ADR4530BRZ from Analog Devices, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NIC | unconnected | Not Internally Connected; this pin is not connected internally and is not specified as a functional terminal. |
| 2 | VIN | power_in | Input voltage connection; the family input voltage range is stated as 3 V to 15 V. |
| 3 | NIC | unconnected | Not Internally Connected; this pin is not connected internally and is not specified as a functional terminal. |
| 4 | GND | power_in | Ground connection for the reference. |
| 5 | NIC | unconnected | Not Internally Connected; this pin is not connected internally and is not specified as a functional terminal. |
| 6 | VOUT | power_out | Output voltage of the reference; the output current is stated as +10 mA source and −10 mA sink. |
| 7 | NIC | unconnected | Not Internally Connected; this pin is not connected internally and is not specified as a functional terminal. |
| 8 | DNC | unconnected | Do Not Connect; no connection should be made to this pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | SOIC-8 |
| Category | Power Management ICs |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Initial output voltage error, B grade | VOUT_ERR | -0.02 | 0.02 | % | B Grade | 3 | |
| Initial output voltage error, B grade | VOUT_ERR | 600 | μV | B Grade | 5 | ||
| Temperature coefficient, box method, B grade | TCVOUT | 2 | ppm/°C | −40°C ≤ TA ≤ +125°C (box method), B Grade | 5 | ||
| Temperature coefficient, bowtie method, B grade | TCVOUT | 4 | ppm/°C | −40°C ≤ TA ≤ +125°C (bowtie method), B Grade | 5 | ||
| Line regulation | ΔVOUT/ΔVIN | 1 | 10 | ppm/V | −40°C ≤ TA ≤ +125°C | 5 | |
| Load regulation, sourcing | ΔVOUT/ΔIL | 30 | 80 | ppm/mA | IL = 0 mA to +10 mA source, −40°C ≤ TA ≤ +125°C | 5 | |
| Load regulation, sinking | ΔVOUT/ΔIL | 60 | 120 | ppm/mA | IL = 0 mA to −10 mA sink, −40°C ≤ TA ≤ +125°C | 5 | |
| Quiescent current | IQ | 700 | 950 | μA | −40°C ≤ TA ≤ +125°C, no load | 5 | |
| Dropout voltage, no load | VDO | 100 | mV | −40°C ≤ TA ≤ +125°C, no load | 5 | ||
| Dropout voltage, IL = 2 mA | VDO | 300 | mV | −40°C ≤ TA ≤ +125°C, IL = 2 mA | 5 | ||
| Ripple rejection ratio | RRR | 90 | dB | fIN = 1 kHz | 5 | ||
| Output current capacity, sinking | IL | -10 | mA | Sinking | 5 | ||
| Output current capacity, sourcing | IL | 10 | mA | Sourcing | 5 | ||
| Output voltage noise | eNp-p | 1.6 | μV p-p | 0.1 Hz to 10.0 Hz | 5 | ||
| Output voltage noise density | eN | 60 | nV/√Hz | 1 kHz | 5 | ||
| Long-term drift, 250 hours (early life drift) | ΔVOUT_LTD | 19 | ppm | TA = 25°C | 5 | ||
| Long-term drift, 1000 hours | ΔVOUT_LTD | 25 | ppm | TA = 25°C | 5 | ||
| Long-term drift, 4500 hours | ΔVOUT_LTD | 51 | ppm | TA = 25°C | 5 | ||
| Load capacitance | CL | 0.1 | 100 | µF | 6 | ||
| Turn-on settling time | tR | 130 | µs | COUT = 0.1 µF, CIN = 0.1 µF, RLOAD = 1 kΩ | 5 | ||
| Output voltage | VOUT | 3 | V | 5 | |||
| Input voltage range | VIN | 3.1 | 15 | V | IL = 0 mA, TA = 25°C | 5 | |
| Supply voltage | VIN | 16 | V | 10 | |||
| Operating temperature range | TA | -40 | 125 | °C | 10 | ||
| Storage temperature range | TSTG | -65 | 150 | °C | 10 | ||
| Junction temperature range | TJ | -65 | 150 | °C | 10 | ||
| Electrostatic discharge, human body model | ESD HBM | 6 | kV | Human Body Model (HBM) | 10 | ||
| Thermal resistance, junction to air, 1-layer JEDEC board | θJA | 63 | °C/W | 8-Lead SOIC, 1-Layer JEDEC Board | 10 | ||
| Thermal resistance, junction to air, 2-layer JEDEC board | θJA | 120 | °C/W | 8-Lead SOIC, 2-Layer JEDEC Board | 10 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | abs | is packaged in a SOIC plastic package and has a moisture sensitivity level of MSL-1, per the JEDEC standard. However, moisture absorption from the air into the package changes the internal | 38 |
CAD (KiCad official)
- Symbol:
ADR4530BRZ - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
adr4530brz-etched.step/adr4530brz-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);adr4530brz.step/adr4530brz.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices datasheet (41 pp, sha256
de2dca59e24477c2, retrieved 2026-11-02, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).